2012-2016 Microsystem Technology Strategy and Roadmaps

More documents

Recommendations

Info

Packaging & Assembly Priorities • Meet the evolving performance/functional requirements (form factor, power, speed, frequency, etc.) of various component technologies • Provide custom packaging solutions and applicationspecific functionalities (embedded or integrated passive/active components, optical interface, biocompatible encapsulation, thermal management, etc.) • Enable or enhance the integrability of microsystems (SiP, interposer, WLP, etc.) © 2012, CMC Microsystems Strategy and Roadmap, Work in Progress 30
Packaging and Assembly View of the Roadmap Technologies 2012 2013 2014 2015 2016 Flip‐chip Flip chip (60um pitch) Solderless flip chip Flip‐chip (30um pitch) Component P&A Hybrid Packaging Emerging Wirebond Substrate/carrier Heavy‐duty wirebond Low‐loss high‐frequency (>70GHz) substraHeat dissipation substrate Fine line substrate (trace/space 10um) Substrate embedded functionalities (passives, waveguides) Thin core, high‐layer‐count substrate (20) Fibre‐to‐chip coupling Fibre array to chip coupling with electrical I/Os Custom application‐specific packaging GHz RF Package High temperature packaging (120‐350C) High‐power device packaging Packaging for flexible systems Multi‐die planar 2.5D SIP 3D SiP SiP CMOS driver IC + photonics Source/detector + photonics Interposer Coarse pitched interposer (200 um) Interposer with COTS/KGD Fine pitched interposer (20um) Post processing/Functionalization Bio‐compatible coating TSV on die Die thinning Transducer/sensor layer deposition surface functionalization deposition Wafer‐level packaging Wafer‐level chip‐scale packaging Wafer‐level multi‐component packaging Printable packaging and assembly 2012 2013 2014 2015 2016 © 2012, CMC Microsystems Strategy and Roadmap, Work in Progress 31
Page 1 and 2: CMC Microsystems and Canada’s Nat
Page 3 and 4: Context, Purpose, Objectives • Wh
Page 5 and 6: Application Space: Biomedical, ICT,
Page 7 and 8: 2012-2016 CMC/NDN Microsystem Techn
Page 9 and 10: Roadmap Structure Categories Techno
Page 11 and 12: 2012‐2016 Embedded Systems Techno
Page 13 and 14: 2012‐2016 Microelectronics Techno
Page 15 and 16: 2012-2016 Photonics Technology Road
Page 17 and 18: Appendix I 1. CMC vision and missio
Page 19 and 20: Canadian Science and Technology R&D
Page 21 and 22: Technology Readiness Levels • CMC
Page 23 and 24: CMC Solutions - R&D Themes June 201
Page 25 and 26: Appendix II Other Roadmap Views The
Page 27 and 28: 2012-2016 MEMS View of the Roadmap
Page 29: 2012-2016 Microfluidics View of the
Page 33 and 34: Test, Measurement and DFT View of t

2012-2016 Microsystem Technology Strategy and Roadmaps

Create successful ePaper yourself

Delete template?

Save as template?