2012-2016 Microsystem Technology Strategy and Roadmaps
2012-2016 Microsystem Technology Strategy and Roadmaps
2012-2016 Microsystem Technology Strategy and Roadmaps
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Test, Measurement, Designfor-Test<br />
(DFT) Priorities<br />
Focus on provision of tools <strong>and</strong> methodologies aligned with<br />
testing <strong>and</strong> measurement required to support R&D involving<br />
microsystems <strong>and</strong> constituent technologies<br />
– Verification, validation <strong>and</strong> characterization<br />
– Hardware, software, embedded systems, integrated systems<br />
Themes are drawn from “parent” roadmaps,<br />
encompassing:<br />
– Test capabilities driven by More Moore (speed, frequency, complexity, power)<br />
– Harsh environment (temperature, power, radiation, etc.) testing for components <strong>and</strong> systems<br />
– 3D linked TSV <strong>and</strong> other interconnect technologies for heterogeneous or hybrid integration;<br />
DFT methodologies<br />
– Interconnect architectures (emerging st<strong>and</strong>ards) <strong>and</strong> smart fixtures to enable testability<br />
(wafer level, advanced probing, manufacturing oriented, reconfigurable)<br />
How:<br />
– CMC test equipment lending pool<br />
– Enabling access to test facilities. E.g. NMPTC, other university labs<br />
– System-level development platforms<br />
– Provision of CAD tools supporting DFT<br />
© <strong>2012</strong>, CMC <strong>Microsystem</strong>s <strong>Strategy</strong> <strong>and</strong> Roadmap, Work in Progress 32