2012-2016 Microsystem Technology Strategy and Roadmaps

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Embedded Systems • Embedded intelligence • Programmability MICROSYSTEMS Photonics • Signal processing • Communication • Sensing • Energy generation MEMS, Microfluidics, Nanotechnology • Sensing • Actuation • Material property modification • Energy generation Microelectronics • Signal processing • Communication • Data storage / memory Microsystems Technologies – Domains and Functions © 2012, CMC Microsystems Strategy and Roadmap, Work in Progress 8
Roadmap Structure Categories Technology themes Roadmap items Technologies 2012 2013 2014 2015 2016 Component Technologies Integration Component technologies Silicon Semiconductor 28nm CMOS 22nm CMOS 14nm FD SOI Advanced CMOS FinFET model 20nm FD SOI 14nm FinFET Imaging/Opto CMOS Imaging/Opto 0.13/0.18 CMOS Color filter / microlens imaging CMOS HV CMOS HV CMOS library 0.18 HV CMOS 0.13um 3D IC 90nm/65nm 3D IC Heterogenious 3D IC 3D IC Back‐to‐face 3D IC stacking High‐aspect ratio TSV (>20:1) Multi‐tier (2+) 3D IC Compound Semiconductor GaN Field‐plate and low‐leakage GaN Through via GaN 0.25um GaN SiC SiC SiGe 200GHz 0.13um SiGe 300GHz 90nm SiGe Hybrid Integration & Packaging SiP Multi‐die planar 2.5D SIP 3D SiP Integration technologies Interposer Coarse pitched interposer (200 um) Interposer with COTS/KGD Fine pitched interposer (20um) Substrate Focus areas Packaging and Assembly Low‐loss high‐frequency (>70GHz) Heat dissipation substrate Fine line substrate (trace/space 10um) Substrate with embedded functions Flip‐chip (60um pitch) Solderless flip‐chip 1GHz+ RF Package Flip‐chip (35um pitch) Heavy‐duty wirebond High‐power device packaging Vacuum packaging Fine‐pitch wirebond (35um) High temperature packaging (120‐350C) Packaging for flexible systems Energy Generation and Storage Photovoltaic energy harvesting Super‐capacitor Kinetic/thermal energy harvesting Chemical energy harvesting Postprocessing/Functionalization Technology capability / features Bio‐compatible coating TSV on die Surface functionalization deposition Die thinning Transducer/sensor layer deposition Monolithic Multi‐domain Integration Integrated CMOS/MEMS Integrated CMOS/MEMS Integrated CMOS/Photonics Integrated CMOS/Photonics New emerging New and Emerging Printable/Flexible Electronics Nanoelectronics Printable electronics Flexible electronics 2012 2013 2014 Nanoelectronics 2015 2016 Timeline © 2012, CMC Microsystems Strategy and Roadmap, Work in Progress 9
Page 1 and 2: CMC Microsystems and Canada’s Nat
Page 3 and 4: Context, Purpose, Objectives • Wh
Page 5 and 6: Application Space: Biomedical, ICT,
Page 7: 2012-2016 CMC/NDN Microsystem Techn
Page 11 and 12: 2012‐2016 Embedded Systems Techno
Page 13 and 14: 2012‐2016 Microelectronics Techno
Page 15 and 16: 2012-2016 Photonics Technology Road
Page 17 and 18: Appendix I 1. CMC vision and missio
Page 19 and 20: Canadian Science and Technology R&D
Page 21 and 22: Technology Readiness Levels • CMC
Page 23 and 24: CMC Solutions - R&D Themes June 201
Page 25 and 26: Appendix II Other Roadmap Views The
Page 27 and 28: 2012-2016 MEMS View of the Roadmap
Page 29 and 30: 2012-2016 Microfluidics View of the
Page 31 and 32: Packaging and Assembly View of the
Page 33 and 34: Test, Measurement and DFT View of t

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