2012-2016 Microsystem Technology Strategy and Roadmaps
2012-2016 Microsystem Technology Strategy and Roadmaps
2012-2016 Microsystem Technology Strategy and Roadmaps
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Microfluidics <strong>Technology</strong><br />
Focus<br />
• Focus on integratibility of microfluidics with microelectronics, photonics, <strong>and</strong><br />
MEMS in a microsystem<br />
• Use three main methods to integrate uF with microsystem technologies<br />
– Post-processing <strong>and</strong> monolithic integration (deposition, etching, surface<br />
modification of a die or wafer, embedded waveguides, uF on CMOS, etc.)<br />
– Conventional packaging & assembly (flip-chip, wire bonding, laser bonding,<br />
chip stacking etc.)<br />
– Emerging techniques (injection printing/3D printing, injection molding, etc.)<br />
• Develop st<strong>and</strong>ardized interface modules to integrate uF with other domain<br />
technologies<br />
• Focus on glass, silicon <strong>and</strong> polymer based microfluidics technologies for<br />
developing custom components<br />
• In addition to commercial sourcing, increased involvement with FACT (MNT<br />
labs) for delivering technologies for building customized microfluidic devices<br />
such as PDMS <strong>and</strong> other polymer based technologies including hot embossing,<br />
injection molding, laser micromachining, <strong>and</strong> injection printing<br />
© <strong>2012</strong>, CMC <strong>Microsystem</strong>s <strong>Strategy</strong> <strong>and</strong> Roadmap, Work in Progress 28
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