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Screen E-Book (.PDF) - MacDermid Autotype

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6. Substrate unstable.7. Changes in temperature during stencilprocessing.8. Changes in humidity during stencilprocessing.Technical referenceSee ‘Optional theory’ chapter and ‘Problemsolving in the real world’ chapter.Solution1. Reduce off contact2. Reduce squeegee pressure, using a lowEOM stencil minimises the need for highsqueegee pressure.3. Use a larger screen for the job4. <strong>Screen</strong> should be less than 1N/cm differencein mesh tension.5. Stainless steel mesh gives minimumstretch.6. Condition the substrate before use7. Always expose and print the stencil at aconstant temperature and humidity.Ink SievingDescriptionStencil open but ink not passing through.CauseMesh too fine to allow all the ink particlesto pass through.Technical referenceSee ‘Print faults and fixing them’ chapter.SolutionUse coarser mesh. Capillex CX will allow acoarse mesh to be used whilst giving a lowprofile, fine resolution stencil.CobwebbingDescriptionRandom trails of ink spreading from theimage.CauseStatic.Technical referenceSee ‘Problem solving in the real world’chapter.132

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