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Microcomputer Unit - Index of

Microcomputer Unit - Index of

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INTRODUCTION OF PACKAGESHitac;hi microcomputer devices are <strong>of</strong>fered in a variety <strong>of</strong>packages, to meet various user requirements.1. Package ClassificationWhen selecting suitable packaging, please refer to thePackage Classifications given in Fig. I for pin insertion, surfacemount, and multi-function types, in plastic and ceramic.Standard OutlinePlastic DIPPin Insertion TypeCeramic DIPShrink OutlineShrink Type Plastic DIPShrink Type Ceramic DIPPackage ClassificationFlat PackageSurface Mounting TypeChip CarrierMulti·function TypeDIP; DUAL IN LINE PACKAGES·DIP; SHRINK DUAL IN LINE PACKAGEPGA: PIN GRID ARRAYFLAT·DIP; FLAT DUAL IN LINE PACKAGEFLAT·QUIP; FLAT QUAD IN LINE PACKAGECC: CHIP CARRIERSOP;SMALL OUTLINE PACKAGEFPP; FLAT PLASTIC PACKAGEPLCC;PLASTIC LEADED CHIP CARRIERLCC ; LEADLESS CHIP CARRIERFig. 1Package Classification according to Material and Printed Circuit Board Mounting Type_HITACHI 17

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