Microcomputer Unit - Index of

RELIABILITY TEST DATA1. INTRODUCTIONMicrocomputers provide high reliability and quality to meetthe demands of increased functions, enlarging scale, and wideningapplication. Hitachi has improved the quality level ofmicrocomputer products by evaluating reliability, buildingquality into the manufacturing process, strengthening inspectiontechniques, and analyzing field data.The following reliability and quality assurance data forHitachi 8-bit single-chip microcomputers indicates results fromtest and failure analysis.2. PACKAGE AND CHIP STRUCTURE2.1 PackagingProduction output and application of plastic packaging continuesto increase, expanding to automobile measuring and controlsystems, and computer terminal equipment operating undersevere conditions. To meet this demand, Hitachi has significantlyimproved moisture resistance and operational stability in theplastic manufacturing process.Plastic and side-brazed ceramic package structures are shownin Figure 1 and Table I.(11 Plastic DIP(21 Plastic Flat PackageBonding wireBonding wireChipFigure 1 Package StructureTable 1 Package Material and PropertiesItem Plastic DIP Plastic Flat PackagePackage Epoxy EpoxyLead Solder dipping Alloy 42 Solder plating Alloy 42Die bond Au-Si or Ag paste Au-Si or Ag pasteWire bond Thermo compression Thermo compressionWire Au AuCf)HITACHI31