CY7C64215 USB HS DataSheet - Delcom Products Inc.
CY7C64215 USB HS DataSheet - Delcom Products Inc.
CY7C64215 USB HS DataSheet - Delcom Products Inc.
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<strong>CY7C64215</strong>Package HandlingSome IC packages require baking before they are soldered onto a PCB to remove moisture that may have been absorbed after leavingthe factory. A label on the packaging has details about actual bake temperature and the minimum bake time to remove this moisture.The maximum bake time is the aggregate time that the parts are exposed to the bake temperature. Exceeding this exposure time maydegrade device reliability.Parameter Description Min Typical Max UnitT BAKETEMP Bake Temperature 125 See package label °CT BAKETIME Bake Time See package label 72 hoursOrdering InformationPackage Ordering Code Flash Size SRAM (Bytes)56-Pin MLF <strong>CY7C64215</strong>-56LFXC 16K 1K28-Pin SSOP <strong>CY7C64215</strong>-28PVXC 16K 1KDocument 38-08036 Rev. *C Page 29 of 30[+] Feedback
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