6-Joyce-Board Test Workshop 2005.pdf

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Strain Limit Determination• Intel® has begun providing strain limits for its BGA componentsto help manufacturers identify processes which cause high strain.• The limits are based upon a laboratory test in which pressure isapplied to the back of the component and around the componentin the opposite direction. We test for the strain at which cracksbegin, not just when the electrical connection is broken.10
Strain Limit Determination• Strain gages are attached to the test coupon at preciselocations, the coupon is bent to certain strains, and the jointsare tested for cracks.• The result is a strain value for a particular location which isrelative to the threshold of damage.<strong>Board</strong> strainOnset of crackingcomponent strain11
Page 1 and 2: Board Test Workshop 2005Board Flex
Page 3 and 4: Intro to Strain testing• As BGA p
Page 5 and 6: How do we measure strain?• We mea
Page 7 and 8: Strain Metrics• Since Strain is a
Page 9: And is less bend mode sensitive•
Page 13 and 14: LF Solder vs Tin-Lead Eutectic Sold
Page 15 and 16: Intel® Board Flex InitiativeOvervi
Page 17 and 18: Mobile Components Strain LimitGuida
Page 19 and 20: Test Equipment Requirements• Data
Page 21 and 22: Gage Locations• LGA 775 socket- 2
Page 23 and 24: Demonstration• Flex test run #1
Page 25 and 26: Sample Report25
Page 27 and 28: Gage Locations27
Page 29 and 30: JEDEC 9704• Jedec Spec29
Page 31: Backup31

6-Joyce-Board Test Workshop 2005.pdf

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