6-Joyce-Board Test Workshop 2005.pdf

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Load on Corner JointA spherical bending condition isthe worst case1.000.800.600.400.20• Several bend modeswere tested.• Large variation wasseen in the strain atfailure• Spherical bend gavethe highest strain vs.joint stress0.000 0.2 0.4 0.6 0.8 1<strong>Board</strong>-Level Strain8
And is less bend mode sensitive• This metric isolates thestrain vectors mostresponsible for cornerjoint stress• This results in reducedstrain level variation atjoint failure, regardlessof bend mode,compared to principalstrainLoad on Corner Joint1.000.800.600.400.20εdiagonal= max( ) ( )ε2,εAlternatemetric1ε 3ε2ε 1ε 2+ ε3Principalstrain90.000 0.2 0.4 0.6 0.8 1<strong>Board</strong>-Level Strain
Page 1 and 2: Board Test Workshop 2005Board Flex
Page 3 and 4: Intro to Strain testing• As BGA p
Page 5 and 6: How do we measure strain?• We mea
Page 7: Strain Metrics• Since Strain is a
Page 11 and 12: Strain Limit Determination• Strai
Page 13 and 14: LF Solder vs Tin-Lead Eutectic Sold
Page 15 and 16: Intel® Board Flex InitiativeOvervi
Page 17 and 18: Mobile Components Strain LimitGuida
Page 19 and 20: Test Equipment Requirements• Data
Page 21 and 22: Gage Locations• LGA 775 socket- 2
Page 23 and 24: Demonstration• Flex test run #1
Page 25 and 26: Sample Report25
Page 27 and 28: Gage Locations27
Page 29 and 30: JEDEC 9704• Jedec Spec29
Page 31: Backup31

6-Joyce-Board Test Workshop 2005.pdf

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