6-Joyce-Board Test Workshop 2005.pdf

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Precise gage location is critical• Close to the joint thestrain field is highlynonlinear• Far from the joint thestrain field is notrepresentative• For typicalmotherboardapplications, 5mmfrom the package edgeworks well14StrainLinear RegionSteep,Nonlinear region3.6mmNot RepresentativeDistance from corner3.6mm5.0mme1e2e3
Intel® <strong>Board</strong> Flex InitiativeOverview• The Intel® <strong>Board</strong> Flex Initiative (BFI) consists of six documentsdescribing the theory and operation of board flex testing toreduce strain in the manufacturing environment.– Section 1 Introduction– Section 2 Gage Attach– Section 3 Calibration fixture– Section 4 Line testing– Section 5 Data Reduction• These documents are available from TDE or your local Intel®test representative.15
Page 1 and 2: Board Test Workshop 2005Board Flex
Page 3 and 4: Intro to Strain testing• As BGA p
Page 5 and 6: How do we measure strain?• We mea
Page 7 and 8: Strain Metrics• Since Strain is a
Page 9 and 10: And is less bend mode sensitive•
Page 11 and 12: Strain Limit Determination• Strai
Page 13: LF Solder vs Tin-Lead Eutectic Sold
Page 17 and 18: Mobile Components Strain LimitGuida
Page 19 and 20: Test Equipment Requirements• Data
Page 21 and 22: Gage Locations• LGA 775 socket- 2
Page 23 and 24: Demonstration• Flex test run #1
Page 25 and 26: Sample Report25
Page 27 and 28: Gage Locations27
Page 29 and 30: JEDEC 9704• Jedec Spec29
Page 31: Backup31

6-Joyce-Board Test Workshop 2005.pdf

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