6-Joyce-Board Test Workshop 2005.pdf

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6-Joyce-Board Test Workshop 2005.pdf

6-Joyce-Board Test Workshop 2005.pdf

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Future• Alternate gage locations– Mobile and Handheld• Tier 2 training videos• Inclusion of 9-point 9bend into JEDEC30

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Future• Alternate gage locations– Mobile and Handheld• Tier 2 training videos• Inclusion of 9-point 9bend into JEDEC30

Backup31

Page 1 and 2: Board Test Workshop 2005Board Flex
Page 3 and 4: Intro to Strain testing• As BGA p
Page 5 and 6: How do we measure strain?• We mea
Page 7 and 8: Strain Metrics• Since Strain is a
Page 9 and 10: And is less bend mode sensitive•
Page 11 and 12: Strain Limit Determination• Strai
Page 13 and 14: LF Solder vs Tin-Lead Eutectic Sold
Page 15 and 16: Intel® Board Flex InitiativeOvervi
Page 17 and 18: Mobile Components Strain LimitGuida
Page 19 and 20: Test Equipment Requirements• Data
Page 21 and 22: Gage Locations• LGA 775 socket- 2
Page 23 and 24: Demonstration• Flex test run #1
Page 25 and 26: Sample Report25
Page 27 and 28: Gage Locations27
Page 29: JEDEC 9704• Jedec Spec29