6-Joyce-Board Test Workshop 2005.pdf

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Desktop Components Strain LimitGuidance for Lead Free PackageProductPackagePitch(mm)PackageSize (mm)Boardthickness(in / mm)Pb-FreeStrainLimit (µε(µε)Intel® Broadwater GMCHFCBGA70.8+1.037.5 x 37.5.040” / 1.0.062” / 1.6600600Intel® ICH8 ChipsetPBGA1.07MM31X31.040” / 1.0.062” / 1.6*500*500Intel® Gb-LAB“Ninevah”FCMMAP1.010 x 10.040” / 1.0.062” / 1.6*500*450Intel® LGA775 Socket1.2745 x 45.040” / 1.0.062” / 1.6650600Important Note:Above strain limit is only valid when using measurement metrologydocumented in Intel Board Flexure MAS rev 3.01 or later.*Preliminary estimate16
Mobile Components Strain LimitGuidance for Lead Free PackageProductPackagePitch(mm)PackageSize (mm)Boardthickness(in / mm)Pb-FreeFreeStrainLimit (µε(µε)Intel® Mobile 945 MCHChipset0.8+37.5 x 37.5.040” / 1.0.062” / 1.6650600**Intel® ICH7M Chipset(Plastic Ball Grid Array)1.0731X31.040” / 1.0.062” / 1.6500500Intel® Pentium® MProcessor in Micro-FCBGA Package (Yonah(Based)1.2735 x 35.040” / 1.0.062” / 1.6*650*650Important Note: Above strain limit is only valid when using measurementmetrology documented in Intel Board Flexure MAS rev 3.0 or later*Assume Solder Mask Defined pads are used at corner.**Not a FCBGA package, PBGA package.17
Page 1 and 2: Board Test Workshop 2005Board Flex
Page 3 and 4: Intro to Strain testing• As BGA p
Page 5 and 6: How do we measure strain?• We mea
Page 7 and 8: Strain Metrics• Since Strain is a
Page 9 and 10: And is less bend mode sensitive•
Page 11 and 12: Strain Limit Determination• Strai
Page 13 and 14: LF Solder vs Tin-Lead Eutectic Sold
Page 15: Intel® Board Flex InitiativeOvervi
Page 19 and 20: Test Equipment Requirements• Data
Page 21 and 22: Gage Locations• LGA 775 socket- 2
Page 23 and 24: Demonstration• Flex test run #1
Page 25 and 26: Sample Report25
Page 27 and 28: Gage Locations27
Page 29 and 30: JEDEC 9704• Jedec Spec29
Page 31: Backup31

6-Joyce-Board Test Workshop 2005.pdf

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