6-Joyce-Board Test Workshop 2005.pdf

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Agenda1. Introduction to Strain Measurement2. Overview of Intel® Board Flex Initiative (BFI)3. Test Equipment Requirements4. Demonstration5. Test Report Review6. Jedec 97047. Questions and Answers2
Intro to Strain testing• As BGA package size and ball pitch have decreased, second-level interconnect failure due to manufacturing over-flexurehas become an increasing concern, especially whencombined with the metallurgical changes for lead freemanufacturing.• Data suggests typical manufacturing processes may exceedstrain limits in one or more of these areas: Board Assembly,ICT, Functional Test and System Assembly• In Circuit Testing (ICT) has shown to induce the higheststrain.• Strain gage measurement is a common and effective way ofmonitoring board flexure, and Intel® is now establishingstrain limits for our BGA products.• Intel’s® BFI (Board Flex Initiative) is a set of tools that hasbeen carefully designed to correlate laboratory experimentaldata to the real world factory.3
Page 1: Board Test Workshop 2005Board Flex
Page 5 and 6: How do we measure strain?• We mea
Page 7 and 8: Strain Metrics• Since Strain is a
Page 9 and 10: And is less bend mode sensitive•
Page 11 and 12: Strain Limit Determination• Strai
Page 13 and 14: LF Solder vs Tin-Lead Eutectic Sold
Page 15 and 16: Intel® Board Flex InitiativeOvervi
Page 17 and 18: Mobile Components Strain LimitGuida
Page 19 and 20: Test Equipment Requirements• Data
Page 21 and 22: Gage Locations• LGA 775 socket- 2
Page 23 and 24: Demonstration• Flex test run #1
Page 25 and 26: Sample Report25
Page 27 and 28: Gage Locations27
Page 29 and 30: JEDEC 9704• Jedec Spec29
Page 31: Backup31

6-Joyce-Board Test Workshop 2005.pdf

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