SERVICE MANUAL - Nexo

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NXAMP4x4■ HEAT SINK UNIT MP-5 PAANH Circuit BoardWK74650WK74650440440311311511511REF NO. PART NO. DESCRIPTION REMARKS QTY RANK-- HEAT SINK UNIT 10x20 (WK74650)311 -- BIND HEAD TAPPING SCREW-B 3x6 MFZN2W3 (WE93630) 01440 -- HEAT SINK MP-5 (WK74330)511 -- TRANSISTOR 2SC3840-AZ M,L,K S (WJ45950) 03✽ : New PartsRANK: Japan only19
NXAMP4x4■ ELECTRICAL PARTS REF NO. PART NO. DESCRIPTION REMARKS QTY RANKELECTRICAL PARTS* WR776500 CIRCUIT BOARD CONTROL (X8710D0)WJ972600 CIRCUIT BOARD INAN (WJ97320)(X8714C0) 28* WJ972801 CIRCUIT BOARD OUTANH (WJ97320)(X8714C0) 20* WT661200 CIRCUIT BOARD NX-DFLT (YC233A0)WJ971500 CIRCUIT BOARD OPT-AN (WJ97170)(X8711E0) 16-- CIRCUIT BOARD PN-AN (WJ97170)(X8711E0)(WJ97130) 20* WJ971401 CIRCUIT BOARD RS232-GPI (WJ97170)(X8711E0) 16-- CIRCUIT BOARD LCD SPACER (WJ97170)(X8711E0)(WK62420) 08* WR777200 CIRCUIT BOARD PAANH (WR77710)(X8712G0)* WJ973501 CIRCUIT BOARD PSANHA J,U (X8715G0) 74* WJ973601 CIRCUIT BOARD PSANHA CHN (X8715G0) 73* WJ973801 CIRCUIT BOARD PSANHB J,U (X8715G0) 73* WJ973901 CIRCUIT BOARD PSANHB CHN (X8715G0) 73* WR776500 CIRCUIT BOARD CONTROL (X8710D0)C001 -- MYLAR CAPACITOR (CHIP) 2200pF 50V J (WB57540)-004 -- MYLAR CAPACITOR (CHIP) 2200pF 50V J (WB57540)C005 -- CERAMIC CAPACITOR-B(CHIP) 0.1uF 50V K (WD96920) 01C006 -- ELECTROLYTIC CAP. (CHIP) 10uF 50V (UF06710) 01C007 -- CERAMIC CAPACITOR-B(CHIP) 0.1uF 50V K (WD96920) 01C008 -- ELECTROLYTIC CAP. (CHIP) 10uF 50V (UF06710) 01C009 -- CERAMIC CAPACITOR-B(CHIP) 0.1uF 50V K (WD96920) 01C010 -- CERAMIC CAPACITOR-B(CHIP) 0.1uF 50V K (WD96920) 01C011 -- ELECTROLYTIC CAP. (CHIP) 10uF 50V (UF06710) 01C012 -- CERAMIC CAPACITOR-B(CHIP) 0.1uF 50V K (WD96920) 01C013 -- CERAMIC CAPACITOR-B(CHIP) 0.1uF 50V K (WD96920) 01C014 -- CERAMIC CAPACITOR-CH (CHIP) 56pF 50V J (US06156) 01-017 -- CERAMIC CAPACITOR-CH (CHIP) 56pF 50V J (US06156) 01C018 -- CERAMIC CAPACITOR-B(CHIP) 0.1uF 50V K (WD96920) 01C019 -- ELECTROLYTIC CAP. 22uF 25V (WC89280) 01-022 -- ELECTROLYTIC CAP. 22uF 25V (WC89280) 01C027 -- CERAMIC CAPACITOR-B(CHIP) 0.1uF 50V K (WD96920) 01-031 -- CERAMIC CAPACITOR-B(CHIP) 0.1uF 50V K (WD96920) 01C032 -- ELECTROLYTIC CAP.(CHIP) 100uF 16V (UF03810) 01C033 -- ELECTROLYTIC CAP.(CHIP) 100uF 16V (UF03810) 01C034 -- CERAMIC CAPACITOR-B(CHIP) 0.1uF 50V K (WD96920) 01C035 -- CERAMIC CAPACITOR-B(CHIP) 0.1uF 50V K (WD96920) 01C036 -- ELECTROLYTIC CAPACITOR (CHIP) 1uF 50V (UF06610) 01C037 -- ELECTROLYTIC CAPACITOR (CHIP) 1uF 50V (UF06610) 01C038 -- ELECTROLYTIC CAP. (CHIP) 10uF 50V (UF06710) 01-045 -- ELECTROLYTIC CAP. (CHIP) 10uF 50V (UF06710) 01C046 -- CERAMIC CAPACITOR-B (CHIP) 0.01uF 50V K (US06410) 01-049 -- CERAMIC CAPACITOR-B (CHIP) 0.01uF 50V K (US06410) 01C050 -- CERAMIC CAPACITOR-B(CHIP) 0.1uF 50V K (WD96920) 01-053 -- CERAMIC CAPACITOR-B(CHIP) 0.1uF 50V K (WD96920) 01C054 -- CERAMIC CAPACITOR-SL(CHIP) 470pF 50V J (US06247) 01-061 -- CERAMIC CAPACITOR-SL(CHIP) 470pF 50V J (US06247) 01C062 -- CERAMIC CAPACITOR-B(CHIP) 0.1uF 50V K (WD96920) 01C063 -- CERAMIC CAPACITOR-B(CHIP) 0.1uF 50V K (WD96920) 01C064 -- MYLAR CAPACITOR (CHIP) 2700pF 50V J (WB57550)C065 -- MYLAR CAPACITOR (CHIP) 2700pF 50V J (WB57550)C066 -- CERAMIC CAPACITOR-B(CHIP) 0.1uF 50V K (WD96920) 01C067 -- MYLAR CAPACITOR (CHIP) 2700pF 50V J (WB57550)C068 -- MYLAR CAPACITOR (CHIP) 2700pF 50V J (WB57550)C069 -- CERAMIC CAPACITOR-B(CHIP) 0.1uF 50V K (WD96920) 01C070 -- CERAMIC CAPACITOR-F (CHIP) 1.0uF 10V Z (US12610) 01C071 -- CERAMIC CAPACITOR-F (CHIP) 1.0uF 10V Z (US12610) 01C072 -- CERAMIC CAPACITOR-B(CHIP) 0.1uF 50V K (WD96920) 01-075 -- CERAMIC CAPACITOR-B(CHIP) 0.1uF 50V K (WD96920) 01C076 -- CERAMIC CAPACITOR-F (CHIP) 1.0uF 10V Z (US12610) 01C077 -- CERAMIC CAPACITOR-F (CHIP) 1.0uF 10V Z (US12610) 01C079 -- CERAMIC CAPACITOR-F (CHIP) 1.0uF 10V Z (US12610) 01C080 -- CERAMIC CAPACITOR-F (CHIP) 1.0uF 10V Z (US12610) 01C081 -- CERAMIC CAPACITOR-B(CHIP) 0.1uF 50V K (WD96920) 01-084 -- CERAMIC CAPACITOR-B(CHIP) 0.1uF 50V K (WD96920) 01C085 -- ELECTROLYTIC CAP.(CHIP) 47uF 16V (UF03747) 01C086 -- ELECTROLYTIC CAP.(CHIP) 47uF 16V (UF03747) 01C115 -- CERAMIC CAPACITOR-SL (CHIP) 560pF 50V J (US06256) 01-118 -- CERAMIC CAPACITOR-SL (CHIP) 560pF 50V J (US06256) 01✽ : New PartsRANK: Japan only20
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SERVICE MANUAL■ CONTENTS PANEL LA
Page 3 and 4:
NXAMP4x4■ PANEL LAYOUT • Front
Page 5 and 6:
NXAMP4x4■ SERVICE PRECAUTIONS Saf
Page 7 and 8:
NXAMP4x4■ OVERALL ASSEMBLY WIRING
Page 9 and 10:
NXAMP4x43. Wiring of the FANConnect
Page 11 and 12:
NXAMP4x4d, e) Fix the wires to the
Page 13 and 14:
NXAMP4x4CN401YELLOW Fig. 20 NOTE:
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NXAMP4x4b-3) Then fasten these wire
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NXAMP4x4At the stage as shown in Fi
Page 19 and 20:
NXAMP4x4o) Fasten the wires (WK0208
Page 21 and 22:
NXAMP4x48. Color of the connectors
Page 23 and 24:
NXAMP4x412. Confirmation of Switch
Page 25 and 26:
NXAMP4x4■ DISASSEMBLY PROCEDURES
Page 27 and 28:
NXAMP4x43. PSANHA Circuit Board(Tim
Page 29 and 30:
NXAMP4x45. PSANHB Circuit Board(Tim
Page 31 and 32:
NXAMP4x48. Upper left (CH1) PA unit
Page 33 and 34:
NXAMP4x412. Front Panel Assembly(Ti
Page 35 and 36:
NXAMP4x416. Lower left DC Fan(Time
Page 37 and 38:
■ LSI PIN DESCRIPTION NXAMP4x4
Page 39 and 40:
NXAMP4x4CS4272-CZZR (X8487A0)CODECC
Page 41 and 42:
NXAMP4x4NJU7630-M (X8682A0)Regulato
Page 43 and 44:
NXAMP4x4SN74LVC157APWR (X6786A0)Dat
Page 45 and 46:
NXAMP4x4• INANH Circuit Boardto C
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NXAMP4x4• CONTROL Circuit BoardAA
Page 49 and 50:
NXAMP4x4• CONTROL Circuit BoardBP
Page 51 and 52:
NXAMP4x4• OUTANH Circuit BoardPat
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NXAMP4x4• PN-AN Circuit BoardAEnc
Page 55 and 56:
NXAMP4x4• PN-AN Circuit BoardBPat
Page 57 and 58:
NXAMP4x4• PAANH Circuit BoardAA't
Page 59 and 60: NXAMP4x4• PSANHA, PSANHB Circuit
Page 61 and 62: NXAMP4x4• PSANHA, PSANHB Circuit
Page 63 and 64: NXAMP4x4• NX-DFLT Circuit BoardEx
Page 65 and 66: NXAMP4x43. Operation3-1. Entry of t
Page 67 and 68: NXAMP4x4Switch the GPI jig to the G
Page 69 and 70: NXAMP4x44-15. ANALOG testPress the
Page 71 and 72: NXAMP4x4■ 71
Page 73 and 74: NXAMP4x4 73
Page 77 and 78: NXAMP4x4
Page 79 and 80: NXAMP4x41-5. Other0 dBu is defined
Page 81 and 82: NXAMP4x44-7. Channel separation1) G
Page 83 and 84: NXAMP4x4■
Page 89 and 90: NXAMP4x45) Click the [Create] butto
Page 93 and 94: NXAMP4x4■ OVERALL ASSEMBLY 1/2 8
Page 95 and 96: NXAMP4x4■ OVERALL ASSEMBLY 2/2 2
Page 97 and 98: NXAMP4x4REF NO. PART NO. DESCRIPTIO
Page 101 and 102: NXAMP4x4■ LOCATIONS OF HEAT SINK
Page 103 and 104: NXAMP4x4■ HEAT SINK UNIT L100 PS
Page 105 and 106: NXAMP4x4■ HEAT SINK UNIT L60 PSA
Page 107 and 108: NXAMP4x4■ HEAT SINK UNIT L50 PSA
Page 109: NXAMP4x4■ HEAT SINK UNIT MP-5 PA
Page 115 and 116: NXAMP4x4CONTROLREF NO. PART NO. DES
Page 123 and 124: NXAMP4x4PAANHREF NO. PART NO. DESCR
Page 131 and 132: NXAMP4x4CIRCUIT DIAGRAM■ CONTENTS
Page 133 and 134: KJIHGFEDCBANXAMP4x4■ WIRING DIAGR
Page 135 and 136: HGFEDCBANXAMP4x4■ BLOCK DIAGRAM 2
Page 137 and 138: HGFEDCBANXAMP4x4■ BLOCK DIAGRAM 4
Page 139 and 140: QPONMLKJIHGFEDCBANXAMP4x4■ CIRCUI
Page 145 and 146: HGFEDCBANXAMP4x4■ CIRCUIT DIAGRAM
Page 149 and 150: LKJIHGFEDCBANXAMP4x4■ CIRCUIT DIA
Page 151 and 152: LKJIHGFEDCBANXAMP4x4■ CIRCUIT DIA
Page 153: QPONMLKJIHGFEDCBANXAMP4x4■ CIRCUI
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