Annual report 2009 - Imec

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inGrid de WoLf RELIABILITy: FORECASTINg THE FUTURE a whole different story. So every specific application of a component or system calls for a specific reliability study. Therefore, we have to set up system-dedicated test methods. But of course, you cannot set-up a dedicated test for each sample. The test methods should remain as generic as possible so that they can be applied to a broad family of systems. The growing integration requires that reliability researchers have a broad knowledge of a large range of application domains: heterogeneous integration, scaling, solar cell technology, biomedical technology, 3D technology, etc. And it also calls for collaboration between reliability specialists and experts in design, processing, materials, and systems. We see this evolution happening at imec: there is an increasing collaboration between the research units. One of imec’s strong points is that we have all the necessary expertise in-house and that we can form multidisciplinary teams with experts in electronics and mechanics, designers, chemists, material scientists, physicists, modeling specialists, etc. Such collaboration really is the only way to make the reliable systems of the future. 30 HIgHLIgHTS - The business line CmOS-based heterogeneous integration (CmORE) incorporates all imec’s activities on strongly integrated IC systems with added functionality. These include mEmS (micro-electromechanical systems), sensors, power electronics, silicon photonics, and advanced interconnection and packaging technology. 01 Testing the reliability of MEMS In 2009, for MEMS testing and reliability, imec set up an improved automatic wafer-level test system. This system allows measuring the functionality and reliability of MEMS in various environments (with varying temperature, pressure, gasses), using both electrical and optical measurement signals. In addition, we built and demonstrated a test environment for testing the electrostatic discharge (ESD) sensitivity of MEMS in various environments, with in-situ motion monitoring of the MEMS movements during the ESD zap. 02 Record piezoelectric energy harvester In 2009, imec and Holst Centre presented a MEMS piezoelectric energy harvester. This device generates a record 85µW from vibration energy. To ensure the robustness of the MEMS device, it was packaged in a wafer-level process. The harvester generates enough power to drive a sensor that intermittently measures the temperature and sends it wirelessly to a base station. 3D stacked ICs after die-to-wafer bonding process
03 Testing for 22nm IC technology For back-end-of-line dielectrical reliability, imec found that the E and root-E models are too conservative to describe the real physics of failure. Imec also obtained very encouraging first electromigration data for 30nm half-pitch copper lines. Furthermore, we successfully used finite element modeling to study residual stress and vacancy gradients in copper structures. Imec started first experiments to study in-situ electromigration and time-dependent breakdown in a SEM with nanoprobes. We also optimized the material characterization of thin films using nano-indentation. Imec’s ultralow-power electrostatic actuator 04 Reliability of 3D structures In the 3D program, imec demonstrated a high-reliability performance of Cu-Sn intermetallic interconnects. We optimized electromigration tests through an in-situ temperature monitoring during testing. Important finite element modeling results were obtained on Cu pumping, crack reduction at metal/organic dielectric inter faces, and thermal modeling of 3D stacks with hot spots. We also optimized the thermal transient measurement system, allowing automatic measurements on test chips with active hot spots. Various metrology systems were assessed for application in the 3D program. Imec and Holst Centre’s piezoelectric harvester packaged on a wireless temperature sensor hIGhLIGhTs IMEC CMORE 05 Micro-actuator for in-vivo biomedical applications 2009, imec fabricated a watertight ultralow-power micro-actuator with an integrated micro-needle. This innovative combination of characteristics makes the actuator especially suited for use in in-vivo biomedical applications, such as implants and long-term patient treatment. The actuator could be used, for example, to accurately control the position of micro-needles used in brain applications. The new actuator is fabricated using SOI-based (siliconon-insulator) micromachining. It combines a large range (±50µm) with sufficient force (±195µN) to position for example in-vivo brain electrodes. The actuator works at 11V, which is three times lower than the operating voltages of the current available actuators. Moreover, the actuator consumes below 100nW and can therefore be used in applications that require a long battery life. 31
Page 1: ASPIRE INVENT ACHIEVE ANNUAL REPORT
Page 4 and 5: 2009 was a year of celebration. A y
Page 6 and 7: Table of contents 06 LUC VAN DEN HO
Page 8 and 9: Luc Van den hoVe, President and Chi
Page 10 and 11: GiLbert decLerck, Executive Officer
Page 12 and 13: VIsIoN aNd MIssIoN IMEC VISION AND
Page 14 and 15: REsEaRch sTRaTEGy IMEC RESEARCH STR
Page 16 and 17: ImEC IN FIgURES 14 36.5 is the aver
Page 18 and 19: 16 194 PhD students contribute to i
Page 20 and 21: 18 25 prizes were awarded to imec
Page 22: imec core cmos Boosting chip perfor
Page 25 and 26: PUSHINg LITHOgRAPHy TO ITS LImITS T
Page 27 and 28: 04 22nm interconnect technology - a
Page 30 and 31: inGrid de WoLf, group Leader Reliab
Page 34 and 35: human++ Pioneering efficient health
Page 36 and 37: kris Verstreken, Director Life Scie
Page 38 and 39: chris Van hoof, Director Integrated
Page 40 and 41: hIGhLIGhTs HUMAN++ HIgHLIgHTS - Ime
Page 42 and 43: hIGhLIGhTs HUMAN++ 40 04 Sleep moni
Page 44: imec enerGy Powering a sustainable
Page 47 and 48: ExTREmE mATERIALS FOR POwER ELECTRO
Page 49 and 50: Imec’s research into photovoltaic
Page 51 and 52: 03 Imec presents a large-area solar
Page 53 and 54: 06 Organic solar cells with efficie
Page 56 and 57: Liesbet Van der perre, Program Dire
Page 58 and 59: hIGhLIGhTs IMEC SMART SYSTEMS HIgHL
Page 61 and 62: facts and fiGures coLLaboration
Page 63 and 64: Because I work both at Hasselt Univ
Page 65 and 66: 02 Diamond-based DNA- and immunosen
Page 67 and 68: The path the IC industry has follow
Page 69 and 70: Stretchable LED matrix 02 Ultra-thi
Page 71 and 72: TRAININg AND SERVICES FOR THE IC DE
Page 73 and 74: Europractice multiproject wafer, pr
Page 75 and 76: BRINg SCIENCE TO LIFE, yOUR LIFE! R
Page 77 and 78: 04 Peter and the Wolf In collaborat
Page 79 and 80: NEw RESEARCH DOmAINS CALL FOR NEw B
Page 81 and 82: HIgHLIgHTS - Only by joining forces
Page 83 and 84:
BUILDINg FOR ImEC’S FUTURE In its
Page 85 and 86:
Process step in imec’s O-line 03
Page 87 and 88:
02 INCOME STATEMENT 2009 in euro OP
Page 89 and 90:
ADDRESSES 01 IMEC Kapeldreef 75 B-3
Page 92:
ASPIRE INVENT ACHIEVE www.imec.be
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