Stresses in Cu Thin Films and Ag/Ni Multilayers - Harvard School of ...

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Chapter 1: Background 17 χ θ−∆θ 2θ θ α q ∆θ n Figure 1.6: A schematic of different scattering geometries. (a) The symmetric θ − 2θ geometry and χ rotation axis, (b) the geometry used for longitudinal diffuse scattering, and (c) the grazing incidence diffraction geometry. θ θ+∆θ α (a) (b) (c)
Chapter 1: Background 18 Figure 1.7: A schematic of the sputtering chamber at Harvard University. substrates were cleaved from the wafer and subsequently cleaned in acetone, methanol, and isopropanol. The base pressure of the deposition chamber is 1.3 × 10 −5 Pa. The sputtering targets are bolted onto a rotating target block to facilitate multilayer growth, and both the targets and samples are water-cooled. One ion gun is used for target sputtering, and another gun can be used for either substrate cleaning or reactive sputtering. The parameters for sputter deposition and substrate cleaning are listed in Table 1.2. Table 1.2: Parameters for ion beam sputter deposition and substrate cleaning. Deposition Substrate Cleaning Beam 1400 V 45 mA 500 V 35 mA Accelerator 150 V 0 mA 500 V 0 mA Discharge 25 V 2 mA 30 V 2 mA Cathode 8 V - 8 V - Ar Pressure 1.1 × 10 −2 Pa 1.1 × 10 −2 Pa
Page 1 and 2: Stresses in Cu Thin Films and Ag/Ni
Page 3 and 4: Thesis advisor Author Frans Spaepen
Page 5 and 6: Contents v Measuring Both the Biaxi
Page 7 and 8: Contents vii B.2.3 Alignment Errors
Page 9 and 10: List of Figures ix 2.4 (a) Powder d
Page 11 and 12: List of Figures xi 4.4 A schematic
Page 13 and 14: List of Tables 1.1 Ability of wafer
Page 15 and 16: Acknowledgments xv Chervinsky, and
Page 17 and 18: Dedicated to my family
Page 19 and 20: Chapter 1: Background 2 films on ri
Page 21 and 22: Chapter 1: Background 4 σ = F/a 0
Page 23 and 24: Chapter 1: Background 6 For more in
Page 25 and 26: Chapter 1: Background 8 T T sinΘ
Page 27 and 28: Chapter 1: Background 10 1.3 Thin F
Page 29 and 30: Chapter 1: Background 12 (a) (b) (c
Page 31 and 32: Chapter 1: Background 14 Prior to t
Page 33: Chapter 1: Background 16 Figure 1.5
Page 37 and 38: Chapter 2: The Elastic Properties o
Page 67 and 68: Chapter 3: The Plastic Properties o
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Chapter 3: The Plastic Properties o
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Chapter 4 The Ag/Ni {111} Interface
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Chapter 4: The Ag/Ni {111} Interfac
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Bibliography [1] C. W. Allen, H. Sc
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Bibliography 128 [25] W. K. Burton,
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Bibliography 130 [54] M. F. Doerner
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Bibliography 132 [82] P. Gergaud, S
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Bibliography 134 [110] M. S. Jackso
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Bibliography 136 [138] D. R. Lee, Y
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Bibliography 138 [166] M. Murakami
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Bibliography 140 [196] J. A. Ruud,
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Bibliography 142 [224] S. P. Timosh
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Bibliography 144 [249] G. K. White.
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Appendix A: X-Ray Stress Analysis 1
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Appendix B X-Ray Errors In this sec
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Appendix B: X-Ray Errors 154 differ
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Appendix B: X-Ray Errors 156 ψ =
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Appendix B: X-Ray Errors 158 The re
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Appendix B: X-Ray Errors 160 B.3.2
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Appendix C: Alignment Procedure for
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Appendix C: Alignment Procedure for
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Appendix D: Elastic Constants 166 D
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Appendix D: Elastic Constants 168 a
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Appendix D: Elastic Constants 170 n
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Appendix D: Elastic Constants 172 N
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Appendix D: Elastic Constants 174 N
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Appendix E: The Stoney Equation 176
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Appendix E: The Stoney Equation 178
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Appendix F: List of Symbols 180 A a
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