Stresses in Cu Thin Films and Ag/Ni Multilayers - Harvard School of ...

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Chapter 2: The Elastic Properties of Cu Thin Films 29 (a) (b) Figure 2.2: Plan-view TEM micrographs of 0.87 µm thick copper in the as-deposited state (a) and after annealing at 600 ◦ C for 0.5 hrs (b).
Chapter 2: The Elastic Properties of Cu Thin Films 30 Figure 2.3: A cross-sectional TEM micrograph of 1.90 µm thick copper grown on Ge(111). Annealing the films at 600 ◦ C induces grain growth, as seen in the micrographs, and enhanced 〈111〉 texture, as seen in Figures 2.5 (a) (powder scan) and 2.5 (b) (χ-scan). The films annealed on α-Al2O3(0001) had much stronger 〈111〉 texture than those on Si(100) (Figure 2.6). The films grown on Ge(111) reacted with the Ge above 200 ◦ C, so the texture after annealing was not remeasured. Figure 2.7 shows that the 0.5 µm thick film had even stronger 〈111〉 texture in both the as-deposited and annealed states than the 1.25 µm thick film (cf. Figure 2.5 (b)). The as-deposited electron beam evaporated films had both 〈111〉 and 〈100〉 texture components (Figure 2.8). If we had the full ODF from several pole figures, we could calculate the biaxial modulus of imperfectly textured films using equation (2.4). However, even with only χ-scans, we can still estimate the biaxial modulus as a function of the volume fraction of textured
Page 1 and 2: Stresses in Cu Thin Films and Ag/Ni
Page 3 and 4: Thesis advisor Author Frans Spaepen
Page 5 and 6: Contents v Measuring Both the Biaxi
Page 7 and 8: Contents vii B.2.3 Alignment Errors
Page 9 and 10: List of Figures ix 2.4 (a) Powder d
Page 11 and 12: List of Figures xi 4.4 A schematic
Page 13 and 14: List of Tables 1.1 Ability of wafer
Page 15 and 16: Acknowledgments xv Chervinsky, and
Page 17 and 18: Dedicated to my family
Page 19 and 20: Chapter 1: Background 2 films on ri
Page 21 and 22: Chapter 1: Background 4 σ = F/a 0
Page 23 and 24: Chapter 1: Background 6 For more in
Page 25 and 26: Chapter 1: Background 8 T T sinΘ
Page 27 and 28: Chapter 1: Background 10 1.3 Thin F
Page 29 and 30: Chapter 1: Background 12 (a) (b) (c
Page 31 and 32: Chapter 1: Background 14 Prior to t
Page 33 and 34: Chapter 1: Background 16 Figure 1.5
Page 35 and 36: Chapter 1: Background 18 Figure 1.7
Page 37 and 38: Chapter 2: The Elastic Properties o
Page 45: Chapter 2: The Elastic Properties o
Page 67 and 68: Chapter 3: The Plastic Properties o
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Chapter 3: The Plastic Properties o
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Chapter 4 The Ag/Ni {111} Interface
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Chapter 4: The Ag/Ni {111} Interfac
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Bibliography [1] C. W. Allen, H. Sc
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Bibliography 128 [25] W. K. Burton,
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Bibliography 130 [54] M. F. Doerner
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Bibliography 132 [82] P. Gergaud, S
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Bibliography 134 [110] M. S. Jackso
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Bibliography 136 [138] D. R. Lee, Y
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Bibliography 138 [166] M. Murakami
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Bibliography 140 [196] J. A. Ruud,
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Bibliography 142 [224] S. P. Timosh
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Bibliography 144 [249] G. K. White.
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Appendix A: X-Ray Stress Analysis 1
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Appendix B X-Ray Errors In this sec
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Appendix B: X-Ray Errors 154 differ
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Appendix B: X-Ray Errors 156 ψ =
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Appendix B: X-Ray Errors 158 The re
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Appendix B: X-Ray Errors 160 B.3.2
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Appendix C: Alignment Procedure for
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Appendix C: Alignment Procedure for
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Appendix D: Elastic Constants 166 D
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Appendix D: Elastic Constants 168 a
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Appendix D: Elastic Constants 170 n
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Appendix D: Elastic Constants 172 N
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Appendix D: Elastic Constants 174 N
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Appendix E: The Stoney Equation 176
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Appendix E: The Stoney Equation 178
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Appendix F: List of Symbols 180 A a
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