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arrier (Chapter 3), a durable template surface treatment (Chapters 4 and 5), and a
transfer layer that adhered to the wafer and etch barrier while not swelling while in
contact with the liquid etch barrier; (2) an imprint apparatus that allowed consistent,
hands-free operation in order to remove much of the human component from the
imprinting experiment (Chapter 7); and (3) a defect inspection tool that would give
an accurate count of defects per imprint in a manner acceptable by the scientific
community (Chapter 7).
The end result of this work is a clear understanding of the fundamental
process and equipment requirements for a defect study in imprint lithography, as
well as a benchmark of defects over time using the SFIL process, which can be used
as a launch pad for further process and equipment development.
1.8 REFERENCES
1. Scanlon, L., No P-N Intended, in Technology Review, 2003. 106(1): 88.
2. Tristram, C., Supercomputing Resurrected, in Technology Review, 2003.
106(1): 52-60.
3. Moore, G., Proc. SPIE, 1995. 2438: p. 2-17.
4. International Technology Roadmap for Semiconductors. 1999,
Semiconductor Industry Association: www.semichips.org.
5. Thompson, L.F., C.G. Willson, and M.J. Bowden, Introduction to
Microlithography. 2nd ed. 1994, Washington, D.C.: ACS.
6. 3 rd International SEMATECH Next Generation Lithography Workshop.
1999: Colorado.
7. Association, S.I., International Technology Roadmap for Semiconductors.
2001: available at http://public.itrs.net/Files/2001ITRS/Home.html.
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