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a)
b)
Figure 2.2: Modification of the photomask process yields SFIL imprint templates.
(a) The patterned Cr layer is used as an etch mask to transfer the pattern into the
quartz substrate, and then removed, yielding (b) all-quartz imprint templates bearing
topography.
Most templates manufactured to date have been produced this way. This
process yields templates that are comprised entirely of fused silica, and the final
templates do not the possess charge dissipation capabilities required for post-
processing SEM inspection. Considering that imprint lithography challenges mask-
making technology by requiring 1X features, the ability to inspect and repair imprint
templates is of extreme importance. The process shown in Figure 2.2 and described
in detail in Section 2.2.3 results in high resolution imprint templates consisting
entirely of bulk SiO2, and therefore is not compatible with the standard, high
resolution inspection and repair technology.
2.2.2 Introduction to Templates Fabricated using the Transparent
Conducting Oxide Process Flow
In order to circumvent the charge dissipation problem associated with all-
quartz templates, a layer of transparent, conducting material can be embedded into
the final template, thereby allowing charge dissipation during both e-beam writing
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