EPP Europe P2.2023

Issue 11 | 2023 

www.epp-europe.eu 

Electronics 

Production & 

Test 

Trade Show + Events 

Productronica 2023 to 

foreground AI, power electronics 

» Page 14 

PCB + Assembly 

Why no-code and low-code tools 

are vital to robotics solutions 

» Page 48 

Test + Quality 

Assurance 

How AI is revolutionising 

AOI & AXI systems 

» Page 52 

Interview 

The road to 

sustainability with 

Guenter Lauber, 

ASMPT 

» Page 7 

COVER STORY 

SMT at its best 

AI-based process 

controls for 

Industry 4.0 

» Page 16 

Ahead with Koh Young’s Process Optimizer

Buy your ticket now! 

productronica.com/ticket 

Accelerating Your Innovation. 

co-located event

» EDITORIAL 

Dear readers, 

Waste not, want not… 

The news that German chipmaker Infineon is heading a European research 

project focusing on reducing e-waste (page 10) will come as no surprise 

to an industry in which efficiency has long been king. Our cover feature 

(page 16) reveals how inspection-based process control tools could save 

you both time and resources. And can Marie Kondo-ing your benchtop 

reduce the number of boards landing on the scrap pile? Find out more on 

page 44. 

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Labour-saving digitalization? 

We typically view automation solutions as digital replacements for human 

operators, but could increased digitalization actually help companies 

attract more talented personnel (page 30)? If robotics is more your thing, 

don’t overlook the advantages of no-code and low-code software 

solutions (page 48). 

The future of electronics production 

“The next paradigm shift will be in the area of software. And artificial 

intelligence will be the driver,” says Andreas Tuerk in the article on page 

52. The organizers of this year’s Productronica event agree (page 14). AI, 

automation, and the growing significance of power electronics will be 

front and centre in Munich in November. 

Don‘t forget to visit our website (epp-europe.eu) to stay up to date with 

the latest industry news and trends. 

See you in Munich, Booth A2.281 

Sophie Siegmund 

Online Editor EPP Europe 

redaktion.eppe@konradin.de 

Follow us: 

LinkedIn: 

bit.ly/36aMJh1 

Twitter: 

@EPPmagazine 

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EPP Europe » 11 | 2023 3

» CONTENTS 11 | 2023 29. YEAR OF PUBLICATION 

Koh Young 

highlights the 

importance of 

integrating IPC 

communication 

standards into its 

tools 

COVER STORY 

AI-based 

process 

controls for 

Industry 4.0 

» Page 16 

Source: Koh Young 

NEWS & HIGHLIGHTS 

Industry News 

Heraeus Electronics to partner in joint ‘KuSIn’ project 6 

EU launches risk assessments of critical technologies 6 

Interview 

Guenther Lauber, ASMPT 

The road to sustainability 7 

Industry News 

New platform to raise awareness robotics advantages 10 

Infineon heads EU project for ‘greener’ electronics industry 10 

CEA & Siemens to collaborate on digital twin capabilities 11 

TSMC to build semiconductor factory in Dresden, Germany 12 

Kamic Group acquires SmartRep 12 

IPC: Eurozone economy grows 0.3% in Q2 2023 13 

TRADE SHOWS & EVENTS 

Shaping the future of electronics production 

Productronica 2023 to foreground AI, power electronics 14 

COVER STORY 

Get ahead with real time inspection 

AI-based process controls for Industry 4.0 (Koh Young) 16 

PCB & ASSEMBLY 

Moving beyond manual ID methods 

Applying IMSs in lighting and power conversion (Ventec) 22 

Product Updates – PCB + Assembly 25 

Full traceability in hand soldering 

Laser labelling in electronics manufacturing (Altus) 26 

Transforming labour shortages into business advantages 

Address staffing challenges using digitalization (Siemens) 30 

Experiment & analysis of QFN assemblies 

Minimizing voiding in SMT assembly of BTCs (Indium) 34 

White paper: ‘flying’ SMD components - part two 

Combatting the ‘flying’ components phenomenon (Rehm) 38 


5S lean manufacturing methodology in PCB production 

Improve benchtop cleaning, reduce waste (MicroCare) 44 

Implementing robots in a time and cost-efficient manner 

Why no-code/low-code tools are vital in robotics (ArtiMinds) 48 


TEST & QUALITY ASSURANCE 

Achieving autonomous inspection 

How AI is revolutionising AOI and AXI systems (Goepel) 52 

Product Updates – Test + Quality Assurance 55 

Verifying board mechanical stress on flying probe 

Programmer tool for flying prober (Seica) 56 

COLUMNS 

Editorial 3 

Imprint/List of advertisers 58 

4 EPP Europe » 11 | 2023

The NEXT 

EVOLUTION 

of SOLDER 

Single software solutions automatically generate code and are able to 

transfer teach points from the robot back into the software, allowing for 

seamless integration of robotic solutions into existing commissioning and 

maintenance processes. 

» Page 48 

Source: Artiminds 

Patented technology 

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FOLLOW US: 

LinkedIn: 

bit.ly/36aMJh1 

Twitter: 

@EPPmagazine 


» NEWS & HIGHLIGHTS 

Electromobility & power electronics applications 

Heraeus Electronics to partner in joint ‘KuSIn’ project 

Source: Heraeus Electronics 

Provider of material solutions for electronics packaging 

Heraeus Electronics is one of five partners taking 

part in the three-year project ‘KuSIn – Copper sinter 

processes using induction heating for electromobility 

applications’, funded by the German Federal Ministry 

of Economic Affairs & Climate Action (BMWK), and 

launched in July 2023. The other participants are: Vitesco 

Technologies, Chemnitz University of Technology 

and Fraunhofer Institutes ENAS and IMWS. 

The project aims to develop pastes, tools, machines, and 

processes for inductive sintering of copper particles for 

(multi-)die and substrate attach (the technical terms 

for chip and substrate assembly on the circuit carrier) in 

electromobility, and related power electronics applications. 

Copper will replace silver as a joining material. 

Energy-efficient inductive heating will be used to address 

the higher sinter temperatures and oxidation tendency 

of copper. This is expected to reduce process 

costs and improve energy efficiency while maintaining 

reliability. Increased sintering of metal-ceramic substrates 

on heat sinks or other large-area structures 

could further support the spread of low-temperature 

sinter technology in power electronics. Heraeus will develop 

copper pastes and processes for inductive sintering 

of copper particles for die and substrate attach in 

power electronic assemblies. 

www.heraeus.com 

European Commission launches risk assessments of critical technologies 

IPC urges holistic approach to include complete electronics ecosystem 

IPC has issued a statement in response to 

the European Commission’s announcement 

that it will be carrying out risk assessments 

of technology areas deemed critical for the 

EU’s economic security. The Commission 

identified four technology areas that are 

considered highly likely to present the most 

sensitive and immediate risks related to 

technology security and technology leakage. 

These are: advanced semiconductors, 

artificial intelligence, quantum technologies 

and biotechnologies. 

It recommends Member States initially 

conduct collective risk assessments of 

these four areas by the end of this year. 

“We need to continuously monitor our 

critical technologies, assess our risk exposure 

and – as and when necessary – take 

measures to preserve our strategic interests 

and our security,” Commissioner for 

Internal Market, Thierry Breton, said. “Europe 

is adapting to new geopolitical realities, 

putting an end to the era of naivety 

and acting as a real geopolitical power.” 

IPC statement 

In response, IPC urged the EU to consider 

the electronics ecosystem as a whole and 

emphasized the strategic importance of a 

robust electronics manufacturing industry 

in Europe. Alison James, IPC senior director 

of European government relations, 

The European Commission has announced it is 

launching risk assessments of four technology 

areas deemed critical for the EU’s economic 

security 

Source: EU / ec.europa.eu/commission/ 

said: “IPC urges the European Commission 

to address the alarming strategic dependencies 

in European electronics 

manufacturing as part of and independently 

of the risk assessments on critical 

technologies ... Electronics manufacturing 

is central to the four critical technologies 

highlighted in the Commission’s proposal 

although key segments of electronics 

manufacturing in Europe have atrophied, 

undermining the region’s resiliency, security, 

and economic competitiveness. 

“IPC recently led a collaboration of more 

than 100 companies across the electronics 

industry to produce a report for 

the European Commission ... The industry 

stakeholders ... agreed that Europe must 

strengthen the electronics manufacturing 

industry to remain on the forefront of 

technological innovation, compete in the 

global economy, and bolster resiliency 

against future supply chain disruptions. 

www.ipc.org 


SPECIAL 

Road to sustainability 

ASMPT just unveiled its strategy for carbon neutrality. Guenter Lauber, 

EVP & Chief Strategy and Digitalization Officer, and responsible for ESG 

in ASMPT’s management, reveals more about the company’s plans. 

Honesty is best policy 

“Anyone who makes overly general 

statements about sustainability 

will rightly have to put up with 

the accusation of greenwashing.” 

Challenge yourself 

“We are challenging ourselves 

and, at the same time, trying to 

live up to our responsibility as a 

prominent player in the industry 

– an industry which [reports 

suggest] accounts for up to four 

percent of global greenhouse gas 

emissions.” 

Source: ASMPT 

Invest in the future 

“Sustainable companies are redefining 

the business ecosystem by 

designing models that create value 

for all stakeholders, including 

employees, shareholders, supply 

chains, society, and the planet.” 


TEST & QUALITY ASSURANCE » Special 

Interview with Guenter Lauber, ASMPT, on carbon neutrality 

The road to sustainability 

ASMPT, a global leader in hardware and software solutions for the semiconductor and 

electronics manufacturing industries, recently unveiled its strategy for carbon neutrality. 

Guenter Lauber, EVP & Chief Strategy and Digitalization Officer, responsible for 

ESG in ASMPT’s management, spoke to EPP Europe about the company’s plans. 

Our vision proclaims: “Shaping a bright & 

sustainable future for customers, employees, 

investors, partners and society” 

Source: ASMPT 

EPP Europe: We‘re pleased to hear that 

ASMPT aims to be carbon neutral by 

2035... 

Guenter Lauber: Wait a minute, let me 

stop you there and clarify that our goal is 

Net Zero 2035 for Scope 1 and Scope 2. 

This means that we want to become carbon 

neutral in terms of our direct 

emissions - from heating systems or company 

vehicles (Scope 1), for example, and 

indirect emissions from our electricity 

suppliers (Scope 2). As with all statements 

about sustainability, it is very important 

to be precise and transparent regarding 

the framework you are referring 

to – as we are in our ESG Reports. Anyone 

who makes overly general statements 

about sustainability will rightly have to 

put up with the accusation of greenwashing. 

Can you provide a bit more insight into 

ASMPT’s sustainability goals? 

ASMPT’s ESG strategy is based on UN 

SDGs 3, 4, 5, 7, 8, 9, 11, 12, and 13. But let 

me be a little more specific. Although 

sustainability and ESG are highly complex 

topics that affect all processes, departments, 

segments and regions of ASMPT, 

we have already made good progress in 

this field. In the area of governance, we 

have carried out our risk assessment, established 

our processes, and are actively 

meeting the requirements placed on us by 

governments and markets. We have published 

an ESG Report, in which we disclose 

ESG targets and results, since 2017, 

for instance. 

What is your new net-zero strategy? 

To achieve a CO 2 

-free footprint as quickly 

as possible, we decided some time ago to 

switch to solar and wind power and to 

save energy in all areas of the company. 

What is new is that we have defined a 

roadmap and published our commitment 

to a concrete goal. In so doing, we are 

challenging ourselves and, at the same 

time, wanting to live up to the responsibility 

we have through our prominent 

position in the industry – an industry 

which Dr. Isabel Al-Dahir, technology 

analyst at IDTechEx, says accounts for up 

to 4 percent of global greenhouse gas 

emissions. Regardless of how high the 

value really is, it is clear we must not 

stand still. 

You already mentioned that companies 

must focus on the sustainability goals 

that are most relevant to them, but that 

this is also determined by economic factors. 

How does this apply at ASMPT? 

Traditionally, profitability assessments 

have been dominated by the interests of 

shareholders, often at the expense of 

other interest groups. Sustainability initiatives 

were thus often rejected by the 

argument “no customer is going to pay us 

for that”. But this has changed. Not least 

because products that do not meet customers‘ 

sustainability requirements will 

not be sold in the future. Sustainable 

companies are redefining the business 

ecosystem by designing models that create 

value for all stakeholders, including 

employees, shareholders, supply chains, 

society, and the planet. In terms of the 

environment, we have prioritized topics 

based on the materiality matrix. While 

climate change, greenhouse gas 

emissions, energy-efficient products and 

energy management are of great importance 

to our stakeholders, they also have a 

major impact on ASMPT’s business. The 

economic benefits of some measures are 

obvious: energy-efficient products are 

more attractive, and energy-saving 

measures, including generating your own 

energy, pay for themselves after a certain 

period of time. The positive impact on the 

recruitment of workers, especially the 

younger generation, is equally obvious. 

What is often overlooked, however, is 

that, according to recent reports, investors 

are increasingly using companies’ 

non-financial disclosures to make investment 

decisions. In one meta-study, 90 

percent of 200 studies analyzed concluded 

that good ESG standards reduce 


the cost of capital; 88 percent show that 

good ESG practices lead to better operational 

performance, and 80 percent 

show that share price performance is 

positively correlated with good sustainability 

practices. The development of sustainable 

alternatives in products and operational 

processes is a driver of innovation. 

How exactly does ASMPT 

approach ESG, SDG and net-zero? 

Our vision proclaims: “Shaping a bright & 

sustainable future for customers, employees, 

investors, partners and society”. 

All employees must be able to develop 

awareness of ESG and sustainability issues 

in general, and of ASMPT’s focused 

activities in particular. To achieve this, we 

have established a central and crossfunctional 

Environmental, Social & Governance 

(ESG) Team. This global team focuses 

on achieving our ambitious netzero 

targets across all ASMPT segments. 

It has also defined and communicated our 

net-zero targets for Scopes 1 and 2. To 

this end, we have identified the most effective 

emission-reducing levers and 

measures, prioritized, and selected suitable 

and proven practices for CO 2 

avoidance, 

and provided the necessary financial 

resources. With a focus on our targets, 

these measures are reviewed and reported 

on every two months at each 

ASMPT site. 

What kinds of measures would those be? 

Measures to reduce emissions include, for 

example, reducing the energy demand at 

each of our sites by investing in new systems. 

Others include generating electricity 

from renewable sources in-house, and 

the electrification of vehicles. All this is 

supported by OpEx measures, such as the 

procurement of electricity from renewable 

energy sources and the purchase of 

green electricity and CO 2 

compensation 

certificates. When discussing such 

measures, we must consider each location 

separately. We cannot generate 

our own energy at will at all our locations, 

and not all our sites have providers 

who supply electricity from renewable 

sources. 

Can you give us a few examples of 

measures that have already been taken? 

Let me mention a few. Since 2019, we 

have achieved some initial success with 

our ESG measures and reduced CO 2 

emissions by 30 percent at our sites in 

Munich, Weymouth and Singapore. A few 

months ago we completed the installation 

of more than 1,200 solar panels at 

our global headquarters in Singapore. 

Solar panels are also already in use in 

Weymouth, UK, and in Huizhou, China. 

You mentioned that your Net Zero 2035 

program applies to Scope 1 and Scope 2 

of the Greenhouse Gas Protocol. What 

are your plans for Scope 3? 

Scope 3 refers to indirect emissions resulting 

from activities along the supply 

chain. This includes pollutant emissions 

which result from purchased goods and 

services, the use of products by customers, 

and the transportation of goods to 

customers – all highly complex issues. 

ASMPT has started to define the basics of 

Scope 3 emissions, such as those from the 

use of our products, whose energy efficiency 

is an issue that has long been close 

to our hearts. We are in the process of 

measuring Scope 3 emissions so that we 

will be able to set Scope 3 targets and reduction 

pathways. But reducing Scope 3 

emissions is not possible without cooperation 

across the industry. This is one of 

the reasons we launched the Semiconductor 

Climate Consortium (SCC) in 

November 2022 as a Leadership Level 

founding member. The SCC is the first 

global consortium of semiconductor companies 

that focuses on reducing greenhouse 

gas emissions. We hope that the 

consortium will empower each member 

to make an impact that goes far beyond 

its individual capabilities to combat climate 

change. 

Finally, what advice would you give to 

colleagues in the industry who are still 

in the very early stages of ESG? 

In a few words: do not be deterred by 

tasks that may seem complex at first. 

Educate yourself and identify possible 

starting points for your company. Just get 

started and take it one step at a time. 

Even if some measures seem like a drop in 

the ocean, we know many drops add up 

to the ocean. 

Mr. Lauber, we thank you for this interview. 

Productronica, Booth A3.377 

www.asmpt.com 

Source: UN 



International Federation of Robotics - addressing labour shortages 

Online platform to raise awareness of advantages of robotics 

Source: International Federation of Robotics 

The International Federation of Robotics (IFR) has 

launched a new online platform called Go4Robotics 

to raise awareness of the advantages of robotics and 

provide independent guidance for companies on 

their automation journey. 

“Labour shortage has become one of the most pressing 

challenges for small and mid-sized enterprises 

(SME) in OECD countries,” the IFR said. “The manufacturing 

sector has been hit especially hard by high 

job vacancy rates. Since robots are becoming easier 

to install, implement and operate, SMEs have greater 

access to automation.” 

“The lack of skilled labour is a strong driver for automation 

in many countries,” said Dr Susanne Bieller, IFR´s 

General Secretary. “In fact, statistics from the EU say that 

three quarters of all companies across the EU have a 

problem attracting workers with the required skills.” 

Given a choice, many young people prefer to work in 

a company that uses future technology. If there is a 

robot operating on the shopfloor, the employer can 

advertise a job to prospective employees as work 

that involves controlling a robot. This can often be a 

game-changer. 

The new online platform by IFR raises awareness of 

the many advantages robotics provide. Small and 

mid-sized enterprises can find educational content 

and an automation checklist. Experts on the platform 

dispel myths about segments that are relatively new 

to automation, and managers can learn how to 

benefit from trends like easy-to-program robots. 

www.ifr.org 

European EECONE project to reduce e-waste 

Infineon to head EU research project for ‘greener’ electronics industry 

German semiconductor manufacturer 

Infineon Technologies has taken over as 

head and coordinator of the research project 

EECONE (European ECOsystem for 

greeN Electronics), which aims to drive 

sustainability in the European electronics 

industry by reducing e-waste. 49 partners 

are participating in the EUR 35 million 

project. EUR 20 million will be provided 

by the EU and the governments of the 

partners. The research project was inaugurated 

on 20 September 2023 in Toulouse, 

France and will run for three years. 

Project aims 

The goal of EECONE is to dramatically reduce 

the consumption of valuable resources 

in electronics production. To 

achieve this, the project aims to research 

more efficient methods of recycling, repairing, 

and reconditioning electronic 

components, as well as exploring alternative 

materials. The project will also 

focus on minimizing non-recyclable 

Source: Infineon 

49 partners 

from 16 European 

countries 

are taking part 

in the threeyear 

project 

waste and enhancing recycling systems. 

“Electronics are fundamental to improving 

the sustainability of many applications. 

But this is not sufficient, electronics 

themselves have to become 

greener,” said Constanze Hufenbecher, Infineon 

Management Board member and 

Chief Digital Transformation Officer. “Infineon 

is pleased to take on the lead role 

in the research project EECONE in order 

to advance the circular economy together 

with our partners along the value chain. 

The only way to achieve sustainability 

from design and use and all the way to 

recycling is by working together.” 

Applications in various sectors, including 

automotive, consumer electronics, health, 

information and communication, aviation, 

and agriculture, will be investigated. 

Key focus areas include reducing 

material usage by making circuit boards 

thinner or smaller and introducing materials 

that are easier to separate during 

recycling. 

The project will also look at ways to facilitate 

the replacement of circuit board 

and semiconductors to make it easier to 

repair devices and make it possible to 

reuse and recycle electronic components. 

The research will also look at developing 

technologies which generate and store 

power in IoT devices. Tools for more sustainable 

electronic design, including 

comprehensive impact assessments for 

the use of electronics, are also planned. 

www.infineon.com 


Expanding digital twin applications for industry 

CEA and Siemens to collaborate to advance digital twin capabilities 

Siemens Digital Industries Software and 

CEA-List, technological research institute 

focused on smart digital systems research, 

have signed a memorandum of 

understanding to collaborate on research 

to further extend and enhance digital 

twin capabilities with AI and explore 

greater integration of embedded software 

on both virtual and hybrid platforms. 

This brings together the two organizations’ 

combined tools and expertise to help break 

down the barriers between electronics design, 

software development and mechanical 

engineering disciplines using digital 

twin technologies. This is expected to help 

customers to significantly reduce the time 

and cost of verification and validation and 

to drive significant improvements in product 

quality and accelerate time to market 

across the full electronics systems product 

lifecycle. Alongside this, the research will 

further explore the use of digital twin 

technologies for autonomous driving, 

smart robotics and health domains. 

“With the strong increase in electronics 

and software content of products and 

systems, there is a clear need for multidomain, 

multi-fidelity system simulation 

solutions to relieve multiple design and 

verification challenges,” said Jean-Marie 

Brunet, VP&GM of Hardware Assisted 

Verification Division, Siemens Digital Industries 

Software. “We share a vision 

with CEA of an even more comprehensive 

Digital Twin and believe we can implement 

this vision through the power of the 

Siemens Xcelerator portfolio because it 

covers everything from Electronic Design 

Automation software and hardware tools 

to system, sensors and multi-physics 

simulation software,” “From chip-to-system, 

this collaboration with CEA-List is 

“There is a clear need for multi-domain, multifidelity 

system simulation solutions to relieve 

multiple design and verification challenges. We 

share a vision with CEA of an even more comprehensive 

Digital Twin,” said Jean-Marie Brunet, 

VP&GM of Hardware Assisted Verification 

Division, Siemens Digital Industries Software 

expected to further expand the application 

domains and technology breadth 

of these solutions.” 

www.sw.siemens.com 

Source: Siemens Digital Industries Software 



Joint venture to bring advanced semiconductor manufacturing to Europe 

TSMC to build semiconductor factory in Dresden, Germany 

Source: Taiwan Semiconductor Manufacturing 

The facility in Dresden 

will be TSMC‘s fourth 

outside of Taiwan 

TSMC, the world‘s largest manufacturer of semiconductors, 

will invest EUR 3.5 billion in a joint project 

with three other European industrial companies to 

build a semiconductor production facility in Dresden 

in eastern Germany. The joint venture known as 

European Semiconductor Manufacturing Company 

(ESMC) will be 70 % owned by TSMC, with Bosch, Infineon, 

and NXP each holding 10% equity stake, subject 

to regulatory approvals and other conditions. 

The factory will cost around EUR 10 billion in total. 

The plant, which will be operated by TSMC, will provide 

advanced semiconductor manufacturing services 

to support the future capacity needs of the 

fast-growing automotive and industrial sectors. It is 

expected to have monthly production of 40,000 

300 mm (12-inch) wafers on TSMC’s 28/22 nanometer 

planar CMOS and 16/12 nanometer FinFET 

process technology, further strengthening Europe’s 

semiconductor manufacturing ecosystem with advanced 

FinFET transistor technology and creating 

about 2,000 direct high-tech professional jobs. Construction 

is expected to begin in the second half of 

2024 with production to begin by the end of 2027. 

Under the framework of the European Chips Act, the 

German government will reportedly provide subsidies 

of EUR 5 billion to support the project. 

“This investment in Dresden demonstrates TSMC’s 

commitment to serving our customers’ strategic capacity 

and technology needs, and we are excited at 

this opportunity to deepen our long-standing partnership 

with Bosch, Infineon, and NXP,” said Dr. CC 

Wei, Chief Executive Officer of TSMC. “Europe is a 

highly promising place for semiconductor innovation, 

particularly in the automotive and industrial 

fields, and we look forward to bringing those innovations 

to life on our advanced silicon technology 

with the talent in Europe.” 

www.tsmc.com 

Germany equipment distributor bought by Swedish production technology group 

Kamic Group acquires SmartRep 

Through its subsidiary Sincotron Holding 

AB, Swedish Kamic Group has acquired all 

the shares in the German company SmartRep 

GmbH, a leading supplier of electronic 

production equipment in the DACH 

region. 

SmartRep was founded in 2004 by Rudolf 

Niebling and is one of the leading distributors 

in the DACH region (Germany, Austria 

and Switzerland) of machines and consumables 

for electronics manufacturers. It 

represents a number of leading machine 

suppliers such as MODI, Koh Young, Europlacer, 

YJ LINK, Techvalley, LPKF and PVA, 

and can offer complete solutions at the 

leading edge of technology development. 

Its head office is in Hanau, just east of 

Frankfurt, and there is also a sales office 

and demonstration centre in Günzburg in 

southern Germany. The company has some 

35 employees and annual sales of approximately 

EUR 15 million (about SEK 175 million). 

As a result of the acquisition, SmartRep 

becomes part of Kamic Group’s Production 

Technology business area led by 

Björn Johnsson. 

“SmartRep has a strong position as a supplier 

in the DACH countries with in-depth 

Source: SmartRep GmbH 

knowledge of how to best satisfy customers’ 

needs,” Johnsson said. “In Production 

Technology we have the same strong 

position in the Nordic and Baltic countries 

as well as in Poland. We therefore 

complement each other particularly well 

and it is a real pleasure to welcome 

SmartRep into the Kamic family.” 

The entire management of the company 

will continue in their current roles following 

the change of ownership. Rudolf 

Niebling and Andreas Keller, sellers and 

Chief Executive Officers, said: “We are 

very pleased to be able to align our company 

with Kamic Group. By sharing experiences, 

skills and contacts both parties 

will be even stronger and more attractive 

to electronics manufacturers in our different 

geographical markets.” 

www.kamicgroup.com | www.smartrep.de 


Source: Pixabay 

IPC August 2023 Economic Outlook report 

IPC: Eurozone economy grows in Q2 2023 

zone region. While Germany’s 

economy remained 

stagnant, showing no signs 

of growth, Italy’s economy 

shrunk by 0.3 %, a decline 

exacerbated by a worsening 

manufacturing sector. 

Meanwhile, the economies 

of France and Spain demonstrated 

positive growth. 

France expanded 0.5 % 

and Spain was up 0.4 % 

This growth was propelled 

by a surge in exports in 

France and a rebound in 

domestic demand in Spain. 

The forecast for U.S. economic 

growth, initially expected 

to be 0.5 percent at 

the beginning of 2023, is 

now expected to grow by 

2 percent, the report said. 

Additional data in the August 

IPC Economic Outlook 

showed: 

• In the U.S., infrastructure 

investments are poised to 

give a boost to the construction 

sector, potentially 

offsetting some of 

the slowdown in other 

areas of the economy. 

• The U.S. manufacturing 

sector recorded a strong 

month, reporting output 

gains rose 0.5 percent in 

July, the first gain in three 

months. Auto and nonauto 

manufacturing both 

posted increases, rising 5.2 

percent and 0.1 percent, 

respectively. 

• In Europe, the economies of France and 

Spain demonstrated positive growth, 

spurred by a surge in exports in France 

and a rebound in domestic demand in 

Spain. 

• In the second quarter of 2023, employment 

rose by 0.2 percent in both the Eurozone 

and the EU. During the first 

quarter of 2023, both regions witnessed a 

The 0.3 % growth compared to the previous 

quarter is most substantial growth since Q2 2022 

Economic growth in the Eurozone expanded 

by 0.3 % in Q2 compared to the 

previous quarter, IPC has reported in its 

August economic outlook. This marks the 

most substantial growth since Q2 2022 

and follows a Q1 that saw no sequential 

growth. The industry association also reported 

that there were significant variations 

across different areas in the Euromore 

substantial increase in employment, 

with a growth rate of 0.5 percent. 

Visit www.ipc.org/advocacy/industry-in 

telligence for more. 

www.ipc.org 

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Shaping the future of electronics production 

Productronica to foreground 

AI, power electronics 

AI in electronics production, automation, and the growing significance of power electronics 

will be major focus topics at this year’s trade show, organizers say. 

Productronica 2021 - the last time the event was held - was affected by social 

distancing and extensive safety measures as a result of the Covid-19 pandemic 

Having taken place mid-pandemic, Productronica 

2021 attracted 894 exhibitors from 36 

countries and about 20,000 visitors from nearly 70 

countries. This may sound like a large number but, 

according to Exhibition Director Barbara Mueller, 

Productronica 2023 numbers are expected to instead 

reflect those from four years ago, in 2019 - when 

1,500 companies from more than 40 countries exhibited, 

and over 44,000 visitors were in attendance. 

So what can they expect to see? 

Mueller explained that, alongside overarching 

topics such as the shortage of skilled workers and 

sustainability, this year’s event will focus on power 

electronics, AI, sensors, and the second generation of 

quantum technologies. To reflect this, a programme 

of lectures and live demonstrations on these key 

areas will take place in Hall B2, Stand 448 in collaboration 

with the Productronics division of the 

VDMA, the conceptual sponsor of the event. 

AI in AOI 

The most important driver of AI technologies in 

electronics production is in the field of automated 

optical inspection (AOI). Repetition-based learning 

algorithms—systems have been in the process of replacing 

conventional IT for over a decade. ”Since the 

Source: Messe Muenchen 

frequency of errors in electronics production is manageable, 

engineers have to create ‘artificial’ error 

patterns using image processing in order to achieve a 

more relevant learning sample for the AI and create 

an even greater learning effect,” explained Volker 

Pape, Chairman of the Board in the Productronics 

division of the VDMA, and co-founder of Viscom. 

Almost all automated inspections systems in electronics 

production are now smart factory ready. 

Leading providers of AOI in Europe, including Goepel, 

Koh Young, Saki, and Viscom – all of whom are exhibiting 

at Productronica 2023 – are actively transitioning 

to using AI in their systems. 

“Even without AI, two thirds of assemblies tested 

are classified as good,” Dr. Sebastian Mehl, whose 

task at Siemens is to integrate mature and working 

AI applications into production environments in 

electronics production, explained. “Of the around 

30% that don’t pass the first time, only the smallest 

portion actually have an error. If humans undertook 

inspection for this number of false calls in the second 

pass, it would entail significant additional inspection 

effort. Moreover, there would be a high risk 

of several of the actual errors being overlooked. 

”In SMT production lines at Siemens, the number 

of false calls has been halved, and the first pass rate 

increased by 15% with the aid of AI. The additional 

inspection effort that is no longer required can be 

tangibly measured in annual six-digit savings.” 

Power electronics 

Analysts from the Yole Group expect the global 

power electronics market to grow from USD 20.9 billion 

(2022) to USD 33.3 billion by 2028 at a compound 

annual growth rate (CAGR) of 8.1 percent. 

Governmental regulations, the expansion of renewable 

energies and the demand for energy-efficient 

solutions are further driving the trend. 

According to Spherical Insights, the industrial sector 

currently holds a 24 percent share of the market 

as power electronics devices and systems become 

ever more widespread in motor drives, power 

supplies, robotics and process control. The growth of 


industrial automation is also an important driver in 

the expansion of this market. 

Productronica exhibitors Rohde&Schwarz, Viscom, 

Löhnert, CRS Prüftechnik and SPEA will exhibit 

relevant solutions in this area. 

Silicon carbide & gallium nitride 

The competitive cost/performance ratio of silicon 

makes it still the most widespread semiconductor 

material but it reaches its limits when higher operating 

frequencies and breakdown voltages are 

required. Because of this, components made of gallium 

nitride (GaN) and silicon carbide (SiC) are increasingly 

entering the field. Inverters based on wide 

bandgap semiconductors enable faster and lowerloss 

switching with significantly higher efficiencies. 

They are able to switch to higher voltages at higher 

frequencies—with less cooling required. Shorter 

switching times significantly reduce energy losses at 

are also able to tolerate more compact passive components 

such as inductors or capacitors. 

Because of the lengthier and more complex manufacturing 

processes required, chips made from silicon 

carbide and gallium nitride are significantly more expensive 

than their silicon counterparts. However, 

manufacturers expect to reduce costs by switching 

to 300-mm wafer technology. 

SiC in automotive applications 

Silicon carbide offers significant advantages in 

power electronics applications in electric vehicles. 

More efficient and more compact drive and charging 

systems can increase a vehicle’s range and shorten 

charging time. In Hall B2, Stand 448, VDMA co-exhibitor 

Breuer-Motoren will present a SiC inverter 

power amplifier developed as part of the research 

project ”SiC-Mobil—SiC frequency converter for 

electromobility” as a test platform for investigating 

the reliability, service life, EMC and efficiency of 

fast-switching SiC power semiconductors. 

Semiconductors 

Co-located with Productronica, SEMICON Europa, 

one of the world’s leading trade fairs for semiconductor 

equipment, materials and services in Europe, 

will host the Advanced Packaging Conference and a 

forum on fab management. 

productronica.com/en 

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Visit us at productronica in Munich 

November 14 – 17, booth A4.335 

www.rehm-group.com 


COVER STORY » INSPECTION & PROCESS CONTROL 

Get ahead with real time inspection 

AI-based process 

controls for 

Industry 4.0 


AT A GLANCE 

Here, Koh Young explains how 

real-time inspection and process 

control can prevent defects 

at the source, and highlights 

the importance of integrating 

IPC communication 

standards into its tools. 

In the relentless pursuit of manufacturing excellence, 

the advent of the smart factory has brought 

about a new era of innovation and efficiency. At the 

forefront of this transformation is Koh Young Technology, 

an industry leader driving the evolution of 

inspection-based process control tools to reshape 

modern electronics manufacturing. 

The smart factory: a paradigm shift 

Gone are the days of inefficient, error-prone 

manufacturing. The smart factory has emerged as a 

catalyst for change, powered by advanced technologies 

like IoT (Internet of Things), AI (artificial intelligence), 

and machine learning. At the heart of this 

transformation lies a synergy between advanced inspection 

systems and process control tools. These 

work together to ensure quality is maintained at 

every stage of production. We recognise this transformative 

potential and have harnessed it to lead the 

charge towards a smart factory. 

With unwavering dedication to 

accuracy, quality, and efficiency, 

Koh Young is driving a new era of 

production in which inspection and 

process control seamlessly merge 

to create optimized processes for 

electronics manufacturers of all 

shapes and sizes. 

The convergence of inspection and 

process control 

At Koh Young, we envision a world in which inspection 

is not just a post-production ritual but an 

integral part of the production process itself. 

Traditional methods of quality control often lead to 

the identification of defects after products have already 

been manufactured, resulting in increased 

costs and wastage. Our approach is different. We advocate 

real-time inspection and process control that 

identifies issues at the source, preventing potential 

defects. 



Using advanced 3D measurement-based inspection 

and AI algorithms, our machines accurately 

evaluate product quality. This real-time data integrates 

seamlessly into process control tools that dynamically 

adjust parameters to maintain optimal 

production conditions. This holistic approach ensures 

consistent quality, reduces rework, and enhances 

production efficiency. 

The power of data: from insights to 

action 

In the smart factory ecosystem, data fuels continuous 

improvement. Inspection-based process 

control tools generate valuable data, offering 

insights into trends, patterns, and potential improvements. 

By analysing this data, manufacturers can 

identify bottlenecks, fine tune processes, and even 

predict maintenance needs, all while maintaining the 

highest possible quality standards. 

“We envision a world in which inspection 

is not just a post-production ritual 

but an integral part of the production 

process itself.” 

Our tools enable predictive analytics that help 

manufacturers anticipate deviations from optimal 

conditions and take corrective action proactively. 

This predictive capability minimizes downtime, prevents 

costly defects, and fosters a culture of lean, 

agile manufacturing. 

Empowering the workforce: 

bridging skills gaps 

As industries evolve, the demand for skilled labour 

continues to rise. However, the intricacies of modern 

manufacturing processes can be a steep learning 

Find out more 

To learn more about how Koh Young 

Technology and IPC are driving the 

future of manufacturing excellence 

through Industry 4.0, visit: 

www.kohyoung.com & www.ipc.org 

curve. Our inspection-based process control tools 

serve as a bridge, empowering the workforce by providing 

real time guidance and insights. Operators are 

equipped with a digital companion that guides them 

through processes, alerts them to potential issues, 

and fosters a deeper understanding of the production 

line. This symbiotic relationship between technology 

and human expertise is the cornerstone of 

the smart factory. 

Revolutionizing control: KPO 

At the epicentre of our commitment to manufacturing 

excellence lies the groundbreaking Process 

Optimizer (KPO). This innovation epitomizes the 

company‘s mission to synergize inspection and process 

control: a single tool designed to boost efficiency 

and precision. 

KPO is the keystone that integrates our inspection 

systems with real-time process control. Through an 

intuitive interface, operators gain access to a dashboard 

of vital production insights - ranging from the 

minutiae of individual measurements to macroscopic 

trends that influence overall product quality. KPO is 

more than a data aggregator, however. It is a decision-making 

engine that gives operators the knowledge 

to tweak production parameters, optimise 

workflows, and eliminate defects before they 

happen. 

Leveraging AI algorithms that learn and adapt, 

KPO evolves in tandem with the production line. It 

assesses production data to predict potential deviations, 

and offers recommendations to maintain 

peak efficiency and quality. In enabling operators to 

make informed decisions swiftly and confidently, 

KPO bridges the gap between experience and automation, 

creating a holistic production environment 

where expertise is enhanced – not replaced. 

Beyond machine-to-machine 

connectivity 

As manufacturing evolves towards Industry 4.0, inspection-based 

process control tools become even 

more critical. Koh Young’s innovative approach has 

already set the stage to revolutionize the manufacturing 

process. Nonetheless, the journey towards a 

fully realized smart factory involves a synergy of 

standards that facilitate communication across production 

assets. IPC communication standards — IPC 

CFX, IPC HERMES, and IPC DPMX — build on our 

tools, enabling comprehensive connectivity and data 

exchange, and ultimately enhancing manufacturing 

efficiency. 



Using advanced 3D measurement-based inspection and AI algorithms, Koh Young‘s machines accurately evaluate product quality 

IPC CFX: enabling seamless 

communication 

IPC CFX (Connected Factory Exchange) is an open, 

neutral, and secure standard designed to enable real 

time, bidirectional communication between machines, 

devices, and enterprise systems in a factory. 

By integrating IPC CFX into the smart factory framework, 

manufacturers can benefit from: enhanced visibility 

of production processes; faster decision-making, 

and better overall equipment effectiveness. 

Our inspection-based process control tools, 

coupled with IPC CFX, support the exchange of 

critical data across the manufacturing floor. These 

inspection systems generate real-time insights, 

which are seamlessly communicated through the IPC 

CFX standard to other machinery and systems. This 

exchange of data ensures that the entire production 

line operates in harmony. This, in turn, enables rapid 

responses to deviations, which reduces downtime, 

and optimizes production quality. 

IPC HERMES: 

facilitating intelligent logistics 

IPC HERMES is another communication standard 

that complements an Industry 4.0 transformation. 

Focused on streamlining communication between 

different machines in the electronics assembly line, 

IPC HERMES ensures an efficient flow of production 

materials and products, allowing for reduced lead 

times, enhanced traceability, and minimal errors. 

When integrated with our inspection-based process 

control tools, IPC HERMES facilitates dynamic 

adjustments to the assembly process based on inspection 

results. For instance, if a Koh Young SPI or 

AOI detects a defect, the information can be communicated 

through IPC HERMES to other machines 

downstream, triggering immediate adjustments to 

rectify the issue. This level of intelligent communication 

results in a production line that runs with 

agility and adaptability, minimizing waste and maximizing 

efficiency. 




Koh Young‘s inspection-based process control tools generate valuable data, offering insights into trends, patterns, and potential improvements 

“Operators are equipped with a digital 

companion that guides them 

through processes, alerts them to potential 

issues, and fosters a deeper 

understanding of the production line. 

This symbiotic relationship between 

technology and human expertise is the 

cornerstone of the smart factory” 

IPC DPMX: data exchange for 

process optimization 

IPC DPMX (Digital Product Model Exchange) focuses 

on improving digital product model data exchange 

across different stages of the manufacturing 

process. This standard enhances the collaboration 

between design, manufacturing, and inspection 

teams by ensuring that accurate and up-to-date 

product data is consistently available across the production 

lifecycle. 

Adding IPC DPMX helps make sure inspection systems 

have access to the latest digital product 

models. This ensures that inspection algorithms are 

aligned with current product specifications - leading 

to more precise defect detection, and fewer false 

calls. Additionally, the data generated by our inspection 

systems can be seamlessly communicated 

through IPC DPMX to design and manufacturing 

teams, enabling them to refine and optimize the 

product design and production processes. 

Koh Young and IPC standards 

Koh Young‘s dedication aligns with IPC communication 

standards. Integrating IPC CFX, IPC HERMES, 

and IPC DPMX into our tools makes for a connected, 

intelligent production environment. Manufacturers 

can make data-driven decisions in real-time, improve 

processes, and respond to deviations. This results in 

quality production and operational efficiency. 

In the quest for a smart factory that thrives on the 

collaboration between human expertise and technological 

advancement, our tools and IPC communication 

standards stand as cornerstones, allowing the 

industry to attain new heights of productivity, innovation, 

and quality. Together, they shape the future 

of manufacturing: one in which the convergence of 

inspection, process control, and communication 

standards facilitates a production landscape that is 

not only intelligent but transformative. 


Zusammenfassung 

Im Zeitalter der intelligenten Fabriken gehen Inspektion 

und Prozesskontrolle nahtlos ineinander 

über, um durch den Einsatz von prüfungsbasierten 

Prozesssteuerungsinstrumenten optimierte Prozesse 

für Elektronikhersteller jeder Größe zu 

schaffen. 

The road ahead 

The journey towards manufacturing excellence is 

far from over. As technology advances and industries 

evolve, we remain committed to pushing boundaries 

and redefining industry standards. By continually innovating 

our inspection systems, AI-driven analytics, 

and process control tools, we hope to create a world 

in which defects are eradicated before they manifest, 

where inefficiencies are eliminated, and where every 

product is of uncompromised quality. 

The smart factory era is here, and we stand at the 

vanguard of this revolution. By championing inspection-based 

process control tools, we are not only 

shaping the future of production but also ensuring 

that every product that rolls off the assembly line is 

a testament to the relentless pursuit of excellence. In 

this new industrial dawn, the collaboration between 

human ingenuity and technological prowess will 

propel us to reach even greater heights. 

Résumé 

À l’ère de la fabrication intelligente, l’inspection et 

le contrôle des processus se confondent et créent 

des procédures optimisées pour tous les fabricants 

d’électronique en s’appuyant sur des instruments 

de contrôle des processus et des audits. 

Резюме 

В эпоху „умных“ заводов контроль качества и 

контроль технологического процесса плавно 

переходят друг в друга, что создает 

оптимизированные процессы для 

производителей электроники любого размера 

за счет применения инструментом управления 

технологическими процессами на основе 

проверок. 

Productronica, Stand A2.359/A2.377 

www.kohyoung.com 

Using advanced 3D measurementbased 

inspection and AI algorithms, 

Koh Young‘s machines accurately 

evaluate product quality 



» PCB & ASSEMBLY 

Typical EV power scheme 

Source: Ventec International Group 

Thermal management using insulated metal substrates 

Applying IMSs in lighting and 

power conversion 

The first article in this two-part series described the composition, principles, and thermal 

properties of insulated metal substrates (IMSs). This article looks at use cases in power 

conversion and lighting, the effects of high-emissivity coating, and often overlooked design 

considerations. 

» Chris Hanson, Global Head IMS Technology, Ventec International Group 

LED lighting dominates new designs for building 

and automotive applications. However, excessive 

operating temperature can change the chromaticity 

of the emitted light, reduce lifetime, and may 

destroy the LED. Proper thermal management must 

therefore restrict the temperature to below the safe 

maximum for a semiconductor device. 

Applications 

Among automotive lighting applications, matrix 

headlamps contain multiple emitters closely spaced 

on a single substrate to provide a high lumen output. 

Typically, a high-conductivity IMS featuring either an 

aluminium or copper baseplate is used. Non-reinforced 

dielectric, usually about 0.05mm-thick, minimizes 

CTE-related stresses between an aluminium 

baseplate and copper foil. In very high-power applications, 

a copper baseplate can avoid excessive 

stress due to CTE mismatch. 

Spotlights or daytime running lamps (DRLs) often 

comprise multiple small boards, each containing two or 

three emitters. An IMS aluminium baseplate and 

0.075–0.010 mm dielectric, resulting in thermal conductivity 

of 2–3 W/m.K is commonly used in these cases. 

Turn signals are often subject to extreme constraints 

in size and shape because of their placement 

on a vehicle’s extremities. A three-emitter unit 

would need to dissipate about 7 watts, which can be 

achieved using an IMS with 0.05–0.075 mm dielectric 

thickness and thermal conductivity of about 3 

W/m.K. Attaching the IMS to the vehicle chassis 

further enhances thermal dissipation. 

General lighting and power 

conversion 

Applications such as street lighting require powerful, 

reliable illumination with extended replacement 

intervals. An IMS with thermal conductivity of about 

3 W/m.K and a 0.075–0.10 mm dielectric effectively 

limits the LED temperature and preserves chromaticity, 

while allowing a high drive current. 

In very high-power applications such as industrial 

welders, where the torch can draw 50 A to 400 A or 

more from chopper or inverter circuits, a heavy-duty 

copper foil, high-voltage dielectric, and a high-conductivity 

baseplate are combined with heatsinks and 

oil cooling. 

High-power air-conditioners commonly use IMSs 


to connect power inverters and triac circuits to the 

air-cooled chassis or heatsink. An aluminium baseplate 

and conductivity of up to 10 W/m.K are typical. 

Automotive electrification 

In addition to LED lighting, electric power steering 

(EPS) and electrical pumps and fans are replacing 

traditional mechanical or hydraulic units in today’s 

cars. Additionally, electric and hybrid vehicles contain 

AC/DC converters for regenerative braking and 

on-board chargin; DC/DC converters for dual-battery 

management and bi-directional power supply; highvoltage 

batteries, and traction motors. The power 

semiconductors in these systems can dissipate total 

power from several hundred watts up to tens of kilowatts. 

Targets for module size and reliability can be met 

cost-effectively using a high-performing IMS with 

thermal conductivity of 3–4.2 W/m.K and 

0.10–0.15 mm dielectric. Power transistors can be 

soldered to the IMS circuit layer as bare die. The 

baseplate is often integrated with a cast metal chassis 

or may be attached to a liquid-cooled heatsink. 

Source: Ventec International Group 

Maximising IMS performance 

The application depicted above in the diagram 

shows a small automotive lighting assembly originally 

built using FR-4 board fitted with a heatsink. Exchanging 

this for IMS as seen in the lower image with 

a high-emissivity surface treatment helped achieve a 

Automotive lighting 

assembly with heatsink 

(above), and equivalent 

with high-emissivity 

IMS (below) 

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thinner, heatsink-free assembly. The required thermal 

dissipation of 5 W was originally achieved using 

20 mm x 20 mm FR-4 PCB with a 35mm heatsink; 

calculated using an online heatsink design tool. 

Ventec has created a similar software application 

to calculate IMS parameters. This predicts that a 

100 mm x 100 mm Ventec VT-4B5 IMS with standard 

brushed aluminium finish could dissipate 5 W without 

needing a heatsink (thus also eliminating the 

need for a thermal interface material). Recalculating 

with the added effect of a ER1 high-emissivity coating 

shows the IMS size can be reduced to 70 mm x 70 mm. 

Potentially overlooked… 

Although thermal conductivity, cost, and material 

thickness are the dominant selection criteria when 

choosing an IMS, there are several other factors to 

consider. 

When choosing the dielectric, ensure that the 


Im ersten Artikel dieser zweiteiligen Serie wurden Zusammensetzung, 

Prinzip und die thermischen Eigenschaften 

von isolierten Metallsubstraten (IMS) beschrieben. Dieser 

Artikel befasst sich mit Anwendungsfällen in der Energieumwandlung 

und Beleuchtung, dem Effekt von Beschichtungen 

mit hohem Emissionsgrad sowie häufig 

übersehenen Designbetrachtungen. 

Résumé 

Le premier article de cette série en deux volets a présenté 

la composition, le principe et les propriétés thermiques 

des substrats métalliques isolés (SMI). Cette seconde 

partie adresse des cas pratiques de la transition 

énergétique et de l’éclairage, les effets des revêtements à 

haute émissivité et certaines considérations de conception 

souvent négligées. 

Резюме 

В первой статье этой серии из двух частей 

описывается состав, принцип и термические свойства 

изолированных металлических подложек. В этой 

статье рассматриваются варианты использования в 

сфере преобразования энергии и освещения, 

влияние покрытий с высокой эмиссионной 

способностью и часто упускаемые из виду 

конструктивные вопросы. 

breakdown voltage and thickness provide sufficient 

electrical insulation. 

To decide the copper-foil weight, based on the application 

operating current, note that the IMS reduces 

I2R-induced temperature rise, thereby increasing 

the effective current-carrying capacity. 

Consider creepage distance (also known as leakage 

distance) when designing for power applications. 

Creepage is dependent on the insulator’s comparative 

tracking index (CTI). Datasheets often give a 

CTI of 600 V for IMS materials, whereas the CTI for 

conventional FR4 is usually 175 V–249 V. 

When choosing the base metal layer, consider the 

coefficient of thermal expansion (CTE) in addition to 

cost, rigidity, and weight - particularly in applications 

that experience intensive thermal cycling. 

Selecting a value that closely matches component 

and circuit-layer expansion can minimise solder joint 

fatigue. Large devices, extreme temperature differentials, 

and lead-free minimum solder thicknesses 

can all contribute to increased cyclic shear stress on 

solder joints. 

Also consider the base material’s suitability for 

machining and post-forming operations. 

Test methodologies 

When characterising the thermal conductivity of 

their IMS products, manufacturers may choose from 

several standardised test methodologies. These include 

ASTM E1461 which is a contactless high-temperature 

test. Another is ISO 22007–2, performed 

using a 3mm-thick disc of the test material. ASTM 

D5470 also uses a disc-shaped sample of the test 

material and establishes a temperature gradient that 

can be measured in the steady state. In addition, 

there are various theoretical mathematical models 

such as the Bruggeman model. 

All approaches have intrinsic inaccuracies, and all 

typically give different answers with the same material 

under the same conditions. Moreover, manufacturers’ 

datasheets do not always state the method 

used, which can prevent designers from making accurate 

comparisons. Independent testing is therefore 

recommended to predict performance accurately in 

the intended application. 

Conclusion 

IMSs can provide accurately controlled thermal 

management in systems that dissipate significant 

quantities of self-generated heat. There are many 

parameters that can be optimised, allowing for an 

effective, compact, and reliable solution. 

Productronica, Booth B3.242 

www.venteclaminates.com 


Product Updates « PCB & ASSEMBLY 

Removal of residual solder in rework processes 

Kurtz Ersa introduces auto scavenger module for rework system 

Kurtz Ersa has unveiled the Auto Scavenger Module, 

an extension for the Ersa HR 600 XL rework platform. 

Designed to enhance the efficiency and effectiveness 

of non-contact removal of residual solder from circuit 

boards, this module represents a significant advancement 

in rework technology. 

With just three simple clicks, users can define the 

specific area on the assembly where residual solder 

needs to be removed after desoldering a component. 

The module then automatically identifies the required 

tracks and initiates the cleaning process promptly, 

while ensuring the board remains preheated. 

Featuring cleaning speeds ranging from 1 mm/s to 

3 mm/s, the module ensures efficient and thorough removal 

of residual solder from large electronic assemblies. 

Moreover, users have the flexibility to finetune 

the cleaning performance by adjusting parameters 

such as nitrogen temperature and track speed. Individual 

profiles can be saved for each assembly, enabling a 

customized and optimized cleaning process. 

The module operates with a constant base temperature 

for the entire assembly. The solder to be removed 

is heated on the board surface using an 

N2-fed hot gas nozzle and then extracted via a vacuum 

nozzle. Importantly, the automatic height control 

feature ensures that the assembly remains untouched 

physically throughout the process. Additionally, 

users can mark ‘keep out areas’ directly in the 

live image, designating specific regions where suction 

is not required. Once the solder removal is com- 

plete, the assembly is efficiently cooled down and 

ready for the seamless reinstallation of a component. 

“The introduction of the Auto Scavenger Module represents 

another step forward in rework technology,” 

said Todd DeZwarte, Director of Sales – North America, 

Rework & Inspection at Ersa. “We are excited to 

offer our customers a solution that not only enhances 

the cleaning performance of the HR 600 XL 

rework system but also provides the flexibility and 

precision required for diverse assembly requirements. 

This module enables efficient and reliable removal of 

residual solder, contributing to improved productivity 

and high-quality results.” 

The Auto Scavenger Module is available as an optional 

feature for the Ersa HR 600 XL rework system. 


www.kurtzersa.de 

Source: Kurtz Ersa 

Designed to enhance 

the efficiency and 

effectiveness of 

non-contact removal 

of residual solder from 

circuit boards, the 

company says this 

module represents 

a significant advancement 

in rework 

technology 

Visit us! 

Hall A4, 

Booth 255 

2023 

November 14-17, 2023, Messe München 

Scalable Vacuum Soldering System VADU modular 

• Easy expansion of productivity or functionality by adding modules 

• Effortless maintenance and operation 

• Well-known void-free soldering quality 

• Soldering with preforms and/or pastes 

• Flux-free soldering with formic acid 

• Flux management system for solder paste processes 

• Individual, easy and free programmable soldering profiles 

• Low energy and media consumption 

PINK GmbH Thermosysteme · Am Kessler 6 · 97877 Wertheim-Bestenheid · info@pink.de · www.pink.de 



Moving beyond manual ID methods 

Laser labelling in electronics 

manufacturing 

With many customers concerned that manual product labelling, used to identify 

and monitor parts, is unable to meet the stringent demands of modern electronics 

manufacturing, could laser labelling be the answer? Joe Booth, CEO of Altus 

Group, weighs up the pros and cons. 

The inside of the YJ Link YLM Laser Marking Machine and the variety of code types and sizes possible on their demonstration board 

Source: Altus 

The UK is home to a substantial portion of the 

world‘s contract electronics manufacturing 

(CEM) sector which produces high volumes of critical 

high-value electronics like medical devices, automotive 

and telecoms equipment. This complex, high-mix 

production landscape has driven an increased emphasis 

on quality control and traceability – both essential 

to manufacturers embracing Industry 4.0 

practices. It has also led to concerns about product 

identification processes, with many finding manual 

product labelling for the identification and monitoring 

of parts inadequate for today’s stringent demands. 

Moreover, labour shortages in the UK mean 

that CEMs are now looking to automate repetitive, 

manual processes. To address these issues, a growing 

number of manufacturers are transitioning to automated 

laser marking systems. 

Manual labelling - pros and cons 

Manual labelling was previously been seen as a 

simple and inexpensive option for basic product 

identification. Workers quickly applied pre-printed 

stickers by hand or added markings to PCBAs with 

stencils or ink pens to designate logos, serial 

numbers, and barcodes. This made manual labelling 

an appealing starting point when production volumes 

were smaller and products less complex. As 

manufacturing has exponentially increased, products 

have become more sophisticated, and technical 

specifications have grown more exacting, however, 

manual labelling has proved limited in meeting the 

complex requirements of cutting-edge electronics 

manufacturing. 

Undoubtedly manual labelling remains a good option 

for prototyping and early development. The low 

cost and flexibility of a simple sticker means labels 

on prototypes can be applied and modified as designs 

evolve. This adaptability enables quick iteration 

without specialised equipment. In a high-volume 

production environment, however, there are several 

important drawbacks to manual labelling methods, 

outlined below. 


Human error and inconsistency 

Manual label application is subject to human error. 

Even the most skilled operator will make the occasional 

mistake – and the probability of this happening 

increases as production runs get longer. Different 

operators also apply labels differently. Inconsistencies 

and inaccuracies in component identification 

can lead to defective products, recalls, and traceability 

problems. 

Time-consuming 

Manually adding individual labels onto components 

is a slow process, especially with small electronic 

components. Even for an experienced worker, 

handling and positioning each tiny label is time consuming. 

The more labels required per product, the 

greater the time involved. This process becomes 

highly labour intensive and can cause a bottleneck in 

production flows, which significantly decreases 

manufacturing throughput and efficiency. 

Source: Altus 

Lack of adaptability 

Pre-printed labels used in manual labelling processes 

offer minimal flexibility when design changes 

are required. Companies using manual labels must 

discard obsolete label stocks and order new preprinted 

labels whenever they want to adjust label 

content or position. This wastes inventory and 

requires production downtime during changeovers. 

With pre-printed labels, unique serial numbers cannot 

be generated, nor is customisation, or variable 

data like date codes possible. 

Typical manual label 

application, manually 

applied to the PCB by 

hand or with tweezers 



Questionable reliability 

The adhesives used in manual stick-on labels can 

fail over time if exposed to humidity, high temperatures, 

abrasion, or chemicals. Labels can peel, fall off, 

become illegible or disappear completely – resulting 

in products with missing or incorrect identification 

markers. This makes ongoing traceability and warranty 

tracking difficult. 

Restricted options 

Manual labels can only be applied on accessible 

surfaces with enough area for adhesion. Irregular 

shapes, smaller sizes, and hidden areas restrict where 

labels can be placed. Only certain materials can be 

labelled, and these must meet size requirements for 

human handling. All these constraints limit options 

for product design and labelling location. 

Additionally, manual labelling cannot fulfil the obligations 

for permanent marks mandated by certain 

regulatory requirements like unique device identification 

(UDI). Overall, the limitations and disadvantages 

inherent to manual labelling make it unsustainable 

for high-quality electronics production. 

Is laser labelling the answer? 

Automated and precise, modern laser marking systems 

bypass the limitations of manual labelling by 

offering permanent marking capabilities. Although 

manufacturers may be put off by the initial outlay to 

purchase the equipment, laser marking has numerous 

advantages that far outweigh the investment 

cost. Such systems have become integral to production 

lines, prompting many CEMs to opt for laser 

marking technology. 

Range of labels with a range of sizes and information attributed 

Source: Altus 

Permanent marks 

Lasers create marks by altering the surface structure 

of materials through ablation, oxidation, melting 

or other photochemical processes. This means labels 

become integral, permanent parts of the product 

and are not just stuck on. Laser marked identification 

withstands wear, abrasion, temperature extremes 

and chemical exposure. Electronics OEMs can trace 

labelled products across their entire lifecycle. 

Precision and legibility 

Lasers can etch intricate details and small font 

sizes down to micron levels. Complex machine-readable 

codes like barcodes can be inscribed with perfect 

precision and accuracy. This prevents errors in 

component identification – especially critical for 

complex miniature electronics parts. Laser labelling 

is effective on unusual shapes and designs, including 

on curved, angled or hidden surfaces not reachable 

using manual methods. 

Hands-free 

Laser marking is a non-contact process. It does not 

require physical contact with the PCB surface, unlike 

ink printing or mechanical engraving methods. The 

laser imprints by directing focused light energy onto 

a material to alter its structure without touching it. 

This non-contact process eliminates any risk of damage, 

distortion, or stress to delicate electronic 

components during marking. This enables safe, clean, 

and damage-free identification of even the most 

sensitive, densely-packed PCB designs. It can also be 

applied on various surfaces, from metals and ceramics 

to laminates and plastics, making it ideal for 

modern high-mix electronic components. 


Easy to integrate 

Laser marking methods seamlessly integrate with 

fully automated production lines and material handling 

systems. Parts can be precision marked quickly 

with no manual intervention. Programmable laser 

systems also enable rapid changeovers between label 

formats and data variables. This allows for highthroughput 

production runs without delays. 

Source: Altus 

Adaptable 

Laser systems excel at on-demand marking of labels 

with variable information like dates, times, and 

serial numbers. Programming is fast and flexible – 

allowing for quick customer-specific customisation. 

Regulatory compliant 

Stringent government traceability regulations like 

UDI require permanent product labels that remain 

intact over long periods and harsh conditions. Laser 

marking satisfies labelling permanence regulations 

that manual methods cannot. 

The clear choice for the future? 

After considering the advantages and disadvantages 

of manual and laser labelling, it is evident that 

laser technology is the best option for the electronics 

manufacturing of today. The drawbacks and bottlenecks 

inherent to manual methods hinder quality, 

throughput, and responsiveness. Laser labelling addresses 

these shortfalls and facilitates state-of-theart 

production. 

Laser systems meet the rigorous demands of highprecision 

Industry 4.0 electronics production, enabling 

immediate and flexible product identification, 

intricate coding, automated workflows, and label 

permanence. As electronics manufacturing processes 

evolve and smart factories and data-driven production 

strategies take over, laser labelling can fit in 

seamlessly. Laser systems interface directly with central 

automation controls, production databases, enterprise 

resource planning systems and machine 

learning platforms, making laser-marked labels essential 

components of advanced PCBA manufacturing 

practices. 

www.altusgroup.co.uk 

The inner workings of 

the YJ Link YLM Laser 

Marking Machine, 

highlighting the internal 

flip which is utilised 

for double sided 

PCB marking 

Less scrap – longer 

tool lifetimes 

961-757e-04.23 ©2023 Kistler Group 

Maximize your machining efficiency 

Cut smarter! Dynamometers and monitoring solutions from Kistler deliver ultra-precise cutting 

force measurements – for optimum machining quality and maximum tool lifetimes. 

www.kistler.com 



Transforming labour shortages into business advantages 

Addressing labour challenges 

in electronics manufacturing 

In 2014, a study conducted by the Boston Consulting Group predicted that many countries 

would experience labour shortages in the 2020s and “a massive shortfall” by 2030. This 

is proving correct. In an age of supply chain disruptions and generational workforce 

evolution, manufacturers are struggling to find qualified employees. Increasing digitalization 

may be the key to finding and retaining talent. 

» Oren Manor and Markus Sauter, Siemens Digital Industries Software 

Staffing and resource constraints 

According to Ranstad, an aging global population is a 

significant factor in the current labour shortage. By 

2030, 16 percent of the world population will be 65 and 

over, and, by 2050, this proportion will have doubled. 

Finding skilled replacements is an urgent matter. 

Manufacturing today’s complex products demands 

a higher level of skilled workers. Adaptability and 

flexibility are increasingly important as shorter lead 

times create the need for more versatile workers who 

can perform multiple functions. 

The convergence of 

various major global 

trends is increasing the 

complexity of electronics 

manufacturing 

and impacting the 

workforce 

Even before Covid-19, staffing was a challenge. 

Then, with the arrival of the great resignation, 

the challenge became even more acute. Today, the 

convergence of various global events and industry 

trends is increasing the complexity of electronics 

manufacturing, and this is having a knock-on effect 

on recruitment. Understanding how each factor impacts 

the workforce is vital to finding effective solutions 

to labour shortages, so here’s a short overview. 

Supply and component shortages 

Global events such as the pandemic, the Russian 

war with Ukraine, international trade tensions, global 

shipping bottlenecks and surges in demand for 

materials all contribute to supply chain volatility. 

This impacts every sector from metals to chemicals, 

including, of course, manufactured components, as 

well as semiconductors and related devices. This 

level of unpredictability directly affects manufacturing 

workflows. 

Source: Siemens 

Sustainability 

The desire to create a more sustainable work environment 

that lowers ecological impact, reduces 

energy usage, reduces waste and improves operational 

excellence is transforming the workplace into 

a healthier space for employees. 

Fortunately, solutions to these issues are beginning 

to emerge. According to Ranstad’s 2022 study, “Why 

is there a global labor shortage?”, it is vital that employers 

understand the candidate-driven employment 

market, and the factors valued most-highly by 

workers. These are competitive salaries (58 %), job 

security (56 %) and work environment (55 %). The 

biggest opportunity for employers to attract skilled 

workers is to address the working environment. And 

digitalization could be the key to success in this area. 

Finding and retaining talent 

If you want to land talented individuals in today’s 

competitive hiring environment, it is essential to 

think outside the box. Increased digitalization can 

help upgrade production environments and elevate 

worker experience, paving the way for new recruitment 

opportunities. 

Digitalization can help make the working environment 

a more enjoyable place for younger workers. 



With the shift to high-mix manufacturing and increasing supply chain disruption, manufacturers need 

to find creative and effective new ways to attract, train and maintain their workforce 


Ensuring consistency and traceability of product 

and process for all manufacturing strategies 

With increased automation, skilled personnel will have 

greater opportunities to expand their skillsets and become 

upwardly mobile as they learn to perform a variety 

of jobs across various manufacturing processes. 

Digitalized planning and advanced automation enable 

a flexible, optimized workflow. Options such as offering 

a four-day work week to recruits who would 

value this arrangement could give your company a 

competitive edge. Another option is to prioritize the 

recruitment of young talent. Young people can be 

brought in at a lower level and gradually move up 

into positions of increasing responsibility as they 

learn the manufacturing system and acquire a variety 

of skills. Surprisingly, only 38 percent of organizations 

currently make it a priority to recruit young 

talent, according to the Ranstad study. 

Digitalization can facilitate options for remote 

working including remote roles, remote monitoring 

and job variations. These options can help companies 

manage critical processes and still provide workers 

with flexibility at work and at home, making jobs 

more attractive to a wider range of people. 

Recruiting talent for specific skill sets from abroad, 

from South America, Africa and Asia, for instance, becomes 

easier if you offer remote working. This means 

new hires do not have to physically relocate across 

borders to your plant location, avoiding extra expense. 

The digitalization difference 

“In a world where more than half the population is 

under 25, businesses cannot afford to ignore digital 

transformation,” McKinsey & Company recently observed. 

Digital transformation is one variable that 

can enable manufacturers to significantly improve 

performance, both on the shop floor and in terms of 

the quality of their workforce. A talented workforce 

that spans generations has the potential to take a 

company’s performance to an entirely new level. 

Young talent is attracted to digital transformation 

and digital technology. Unlike older workers, many 

younger workers have experienced digital classrooms 

firsthand. They are better prepared to adapt to the 

greater flexibility of skills needed for an evolving 

manufacturing workplace as digitalization and automation 

expand. A talented workforce that spans 

generations has the potential to take your company 

performance to an entirely new level. 

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Ensuring consistency 

and traceability of 

product and process 

for all manufacturing 

strategies 


Top tips 

Keep the following in mind when designing your 

recruitment strategy for a revitalized workforce: 

• Digitalization is attractive to skilled workers and younger 

talent 

• Streamlined engineering and manufacturing processes 

make your workplace and your job opportunities more 

appealing 

• Seamless data flow from engineering to execution 

increases productivity and reduces stress 

• Using digitalization supports a diversity of tasks, 

minimizes monotonous work, and allows easy job rotation 

using guided and automated operations 

• Leveraging digitalization helps create a more productive 

and profitable company that can offer employees more 

advancement opportunities 

• Digitalization enables opportunities for automation 

and artificial intelligence (AI) to create a working 

environment that supports advanced skills 

• Adopting digitalization enables recruitment of a more 

talented workforce with the ability to improve company 

performance 

• Remote work options enable you to tap new pools of talent 

When recruiting today, it is important to develop an 

appealing image. Talented workers are drawn to clean 

workplaces that offer career advancement in high 

tech fields, so we should design our workplaces and 

our recruiting strategies to promote these benefits. 

Siemens digitalization solutions 

Digital solutions such as a manufacturing execution 

system (MES) can play a critical role in addressing 

labour challenges. Digitalization can increase 

your appeal as a company by providing stress-relieving 

solutions for workers in the fields of both IT and 

production. 

Problems with integrating IT and operating technology 

(OT) often lead to extra work and undue 

stress on the workforce. This is exacerbated when 

multiple legacy information systems are unconnected, 

lack a common data platform or language, 

and cannot work together, resulting in an enormous 

workload. Fragmented systems need to be digitally 

transformed so they work more efficiently together, 

and the effort needed to sustain them is reduced. 

Fortunately, this fragmentation and the stress can be 

alleviated by adopting an end-to-end digital solution 

that provides a single digital thread with connected 

systems. This enables efficient, unified operation 

from product design to manufacturing execution. 

The Siemens Xcelerator business platform, comprising 

software, hardware and services, provides an 

integrated digital thread spanning from design to 

production engineering, streamlining processes 

through one end-to-end digital solution. The MES 

solution also includes a manufacturing operations 

management (MOM) system to address labour-related 

challenges. When we start breaking down disconnected 

silos this transformation can begin. 

The MOM system combines all machine programming 

into a single platform, and better defines workflows, 

resulting in better quality, and saving time and 

stress for workers. It consolidates production processes 

to optimise MESs, quality management, and 

improve planning and scheduling. It also reduces the 

workload so staff can focus instead on value-added 

tasks. MOM advantages include: 

• Providing guidance in setup and execution tasks 

• Prompting workers for required actions 

• Avoiding errors and rework 

• Supplying automated control and traceability of 

tasks, process, material and tools 

• Using maintenance management to minimize machine 

breakdowns 

• Improving operator efficiency by allowing them to 

run multiple machines and lines 


Electronics production process 


Changing perceptions 

The notion of manufacturing as a gritty working environment 

is an image that needs to be updated. By 

increasing their focus on digitalization, manufacturers 

can change these outdated perceptions, and win new 

recruits. Digitalization can streamline engineering and 

production processes to create a lean, modern, and 

productive working environment. These changes elevate 

quality of life for the workforce and enable companies 

to be more competitive. With digitalization 

underway, you are ready to recruit a more talented 

workforce. And with an improved workforce, company 

performance can reach a whole new level. 


siemens.com/software 


Um den Herausforderungen des herrschenden Fachkräftemangels 

in der Elektronikbranche zu begegnen 

ist es von Vorteil, die Digitalisierung bei der Rekrutierung 

der Arbeitskräfte der Zukunft zu nutzen. 

Résumé 

À l’avenir, la numérisation est un outil de recrutement 

avantageux pour contrer la pénurie de main-d’œuvre 

qualifiée qui sévit dans le secteur de l’électronique. 

Резюме 

Чтобы решить насущные проблемы с дефицитом 

квалифицированных кадров в электронной 

отрасли, предпочтительно использовать 

дигитализацию при наборе рабочей силы 

будущего. 



Experiment & analysis in QFN assemblies 

Minimizing voiding in SMT 

assembly of BTCs 

Voiding in BTCs and, more specifically, QFNs, is arguably the most critical issue in 

electronic assembly today. In response to this concern, Indium Corporation and 

BTU International developed and executed a series of investigations to understand 

quantitatively the causes of voiding. 

» Christopher Nash, Ronald C. Lasky, Ph.D., PE, Emily Belfield, Indium Corporation; Kim Flanagan, 

Claire Hotvedt & Thomas Tong, BTU International 

Source: Indium Corporation 

X-ray images of voiding. These ‘lake voids’ with a greater than 40% area of voiding 

would likely cause reliability and performance problems for most QFNs 

Bottom terminated components (BTCs) are one of 

the most important components in electronics 

today. Their combination of small size, excellent 

electrical performance, and ability to transfer heat 

away from the integrated circuit (IC) has resulted in 

their becoming one of the most common packages 

with the highest growth rate. More than 15% of all 

electronic packages assembled are BTCs, with their 

numbers over 50 billion a year. One of the most common 

BTCs is the quad-flat pack no-leads (QFN). One 

of the primary attributes of QFNs is dissipating heat, 

therefore, any voiding of the solder connecting the 

thermal pad on the QFN to the printed wiring board 

(PWB) will degrade the intended performance of the 

QFN. This degraded thermal performance may result 

in reliability and operational issues. While degraded 

thermal performance may not be a critical issue for 

some consumer products, the rapid growth of automobile 

electronics and the emergence of 5G telecom 

equipment makes robust thermal performance of 

QFNs vital. 

Original investigation 

Generally, there are no industry standards as to 

what is an acceptable voiding level, although there is 

agreement that an average void area should be less 

than 50% with no single void above 40%. For thermal 

pads, a void area of less than 25% is preferred, 

and some automotive applications aim for an average 

void area of less than 10%. Clearly, all assemblers 

desire a minimum amount of voiding. However, 

the processes and materials available may limit 

this goal. 

Significantly reducing voiding is not necessarily a 

quick fix. Optimized solder paste and process conditions; 

control of the PWB and components; and a 

stencil printer, component placement equipment, 

and a reflow oven that are optimized to minimize 

voiding are needed. 

In our experiments, the PWB pad finish was ENTEK 

Plus CU-106A-HT OSP. We used laser cut, non-nanocoated 

steel stencils that were 0.004“ and 0.005“ 

thick. We used a window pane stencil design in the 

PWB thermal pad area to allow volatiles to escape. 

The window pane squares were 0.088“ on each side. 

The squeegee printing speed was 100mm/s with a 

pressure of 6 kg. Printer separation speed was 5mm/s 

at a distance of 2mm. We performed a stencil wipe 

(W/D/V) before each board. The QFN we assembled 

had a square ground plane of 7.75mm (0.30“) per side. 

We performed reflow in air with Profile #1—a 

straight ramp profile (0.9˚C/second ±0.1˚C/second) 

and a peak temperature of 241˚C ±4˚C for most investigations. 

However, a second profile (Profile #2) 

with a peak temperature of 254˚C ±4˚C was also investigated 

to determine the effect of the reflow profile 

on voiding. A variety of solder pastes was used 

that had halogen-free and halogen-containing 

fluxes and different solder particles sizes (e.g., Type 

3, Type 4, Type 4.5, and Type 5). 



Many parameters affect voiding, as shown in this cause and effect diagram 

Reflow profile effects 

Profile #1 is a ramp-to-peak profile with a maximum 

temperature of approximately 240˚C ±4˚C. 

Profile #2 has a slight soak and a peak at 254˚C ±4˚C 

and has a slightly higher time above liquidus of 77 

seconds versus 70 seconds.Profile #2 had significantly 

better voiding results, yielding less than 8% 

void area versus 22% for Profile #1. Not only does 

Profile #2 significantly reduce the area of voiding, 

the scatter in the data is also greatly reduced. 

Our theory is that the hotter profile is more successful 

in driving out the volatiles than the cooler 

profiles. This concept is easy to understand when one 

considers that the vapour pressure of most solvents 

increases considerably at higher temperatures. 

this difference is significant. We believe that the 

5mil stencils exhibit less void area because the 

higher stand-off (0.005“ vs. 0.004“) allows for easier 

outgassing/venting of the solder paste flux volatiles. 

Stencil thickness 

We performed experiments in the conditions described 

with Profile #1 using two stencil thicknesses 

of 4mils and 5mils. A Tukey analysis indicated that 

Many parameters affect 

voiding, as shown in this 

cause and effect diagram 


Hall A4 - Booth 155 




Profile #1 vs. Profile #2 

Solder paste particle size 

We experimented with varying the solder paste 

particle size. The stencil thickness of 0.004“ and Profile 

#1 were used. The results of this indicate that 

there appears to be a slight reduction in void area 

with small solder paste particle sizes going from Type 

4 to 4.5 to 5; however, there is a significant increase 

in voiding area percent with Type 3 paste. 


The void area percentages for Profile #1 and Profile #2. Note 

the dramatic reduction with Profile #2 


Obwohl es viele Faktoren gibt, die beim Lötprozess zu 

Lunkern führen, können durch die Anwendung eines 

Standardprozesses, wie er hier beschrieben wird, 

mehrere Parameter eingestellt werden, um Lunker zu 

minimieren. 

Résumé 

De nombreux facteurs peuvent causer l’apparition de 

creux à la soudure, mais ce problème peut être évité 

grâce au réglage de plusieurs paramètres d’un 

processus standard, comme expliqué ici. 

The voiding area percent for selected solder pastes for Profile 

#1 and Profile #2. Note that Profile #2 not only reduces 

the void percentages, but significantly reduces the standard 

deviation or spread in the data 


Резюме 

Хотя существует множество факторов, 

приводящих к образованию пустот в процессе 

пайки, использование описанного здесь 

стандартного процесса позволят настроить 

некоторые параметры для сведения пустот к 

минимуму. 

The 0.004“-thick stencils exhibit more than 4% more void 

area than 0.005“ stencils 




The 0.004“-thick stencils exhibit more than 4% more void 

area than 0.005“ stencils 


There appears to be a 

slight reduction of 

void area with smaller 

particle sizes in the 

solder paste from 

types 4 to 4.5 to 5. 

Only the difference 

between type 3 and 

the other sizes is 

statistically significant 

The top X-ray images 

show poor area voiding 

percentages greater than 

30%, while the bottom 

photos show voiding of 

less than 10% 


Void percent area as a function of solder pastes. Note the 

significant difference between pastes, some as low as 5% 

voids and others around 45% 


Solder pastes 

We performed a final experiment in which we 

evaluated the effect of different solder paste flux vehicles 

on voiding. Three PCBs with 12 QFNs each 

were used for each solder paste, for a total of 36 

QFNs per paste. The results were striking, as seen in 

Figure 11. Some pastes produced about 5% voids, 

while others produced as much as 45%. These results 

were not only surprising, but also very encouraging. 

While the generation of voids is a complicated 

process with many variables, selecting the solder 

paste alone, with a standard assembly process can 

assure voiding area levels of less than 10%. 

Conclusions 

Although the factors that generate voids are many, 

by adopting a standard process as described, several 

parameters can be set to minimize voiding. The 

strongest determinant in the assembly process is to 

have a hotter peak temperature reflow profile. This 

factor alone reduced voiding area percent from an 

average of about 22% to less than 8%. Although 

finer solder particle size reduces solder voiding, the 

result was only statistically significant by going from 

Type 3 to Type 4 or finer. Type 3 pastes produced 

more than 10% more void area than Type 4 or finer. 

Using a stencil thickness of 5mils reduced voiding 

about 4% on average as compared to 4mil stencils. 

The greatest surprise, however, was how significant 

solder paste formulations were in reducing voiding. 

The better solder pastes significantly reduced voiding 

to less than 6% void area, whereas the worst paste 

produced greater than 45% voiding. 


www.indium.com 

To be continued... 

The second part of this paper, in 

which Flanagan, Belfield, and 

Hotvedt detail the additional 

investigations they have undertaken 

to identify and refine void reduction 

strategies will be published in our 

April 2024 issue. 



White paper: ‘flying’ SMD components - part two 

How to combat the ‘flying’ SMD 

components phenomenon 

The first part of this white paper - published in our April 2023 issue - described how 

the investigation to determine the influence of flow temperature on SOD323s being 

blown away was conducted. This second part examines the test results, and reveals 

the best methods to ensure these components are reliably processed. 

» Dr. Paul Wild, Carsten Giersberg, Rehm Thermal Systems GmbH 

The simulation results demonstrate that the 

maximum forces act upon different components 

and that there is no component for which a force resulting 

from all three directions of action must be 

taken into account as the greatest force. 

As the graphs opposite show, the maximum force 

in the X direction acts upon the smaller side surface 

of component 8. This force amounts to 45 µN. The 

maximum force in the Y direction (buoyancy force) 

acts upon the upper side of component 14 and 

amounts to 25 µN. The maximum force in the Z direction 

(graph on page 40) acts upon the larger side 

surface of component 25 and amounts to 52 µN. As 

the forces in the X and Z directions act upon component 

side surfaces of equal size, only the force in the 

Z direction will be regarded as the blowing force in 

the following, and the force in the Y direction will be 

regarded as the buoyancy force. The table below 

summarizes simulation results for the Y and Z directions. 

If flow velocity can be measured or determined 

numerically as described above, the force acting 

upon an object as a result of such flow can be calculated 

using the equation: F W 

=c 1 W 

/ 2 

pv 2 A 

The case in hand involves a rectangular body with 

a flow circulating around it. With a body of this type, 

resistance coefficient c W 

comprises 100% of the 

form resistance of the body and amounts to 1.1 [J. 

Zeitler & G. Simon, Physik für Techniker, 2016]. 

Forces in the Z-direction can be calculated using 

density of air p (1.225kg/m³), the largest side surface 

area A of the component (1.53 x 10–6m²) and velocity 

values shown in the table below. 

Comparison of the forces reveals that, especially 

for higher velocities, the results of the two methods 

differ greatly. This can be attributed to finer flow 

state resolutions achieved with the CFD method, including 

detachment phenomena and so on. 

Calculation & comparison of forces 

The holding forces for the three cases are calculated 

and compared with those numerically ascertained. 

1. Without solder paste at 45% fan power 

In the Y direction 

In accordance with the formula: F G 

=mg 

with a component mass m of 0.0045g and gravitational 

acceleration of 9.81m/s², force due to 

weight amounts to 44 µN. This is greater than the 

buoyancy force of 16.2 µN, so the component cannot 

be raised. 

In the Z direction 

Without solder paste and according to the 

equation: F H 

=μmg 

Simulated maximum flow velocities and blowing forces acting on SOD323 

Direction 

45 

Fan Power [%] 

91 

100 

Force [µN] 

Velocity [m/s] 

Force [µN] 


Force [µN] 


Y 

16.2 

31 

34.5 

Z 

33.7 

5.1 

65 

9.6 

71.3 

10.5 


Forces in X direction (transport direction) on all SOD323s, parts 1 through 

20 at right angle to and parts 21 through 36 parallel to transport direction 

Source: Rehm Thermal Systems 

Forces in Y direction (positive, upwards) on all SOD323s, parts 1 through 

20 at right angle to and parts 21 through 36 parallel to transport direction 


static frictional force is 32.7 µN assuming a static 

friction coefficient µ of 0.74 for tin on tin [P. J. Blau, 

Friction Science and Technology: From Concepts to 

Applications, 2008]. Static frictional force is smaller 

than the determined lateral wind force of 33.7 µN, 

and thus the component is blown away. 

2. With solder paste at 100% fan power and 23°C 

Solder paste rheology 

Solder paste has to meet a broad range of requirements 

for the production of electronic PCBs. The 

solder paste’s flux has to demonstrate specific properties 

for each process step. Solder pastes can be 



Forces in Z direction (at 

right angle to transport 

direction) on all SOD323s, 

parts 1 through 20 at 

right angle to and parts 

21 through 36 parallel to 

transport direction 


Comparison of forces in the Z direction from CFD simulation and calculation 

About Rehm 

Rehm Thermal Systems is a specialist in the area of thermal 

system solutions for the electronics and photovoltaic 

industries and is among the leaders in technology 

and innovation in the modern, cost-effective production 

of electronic assemblies. As a global manufacturer of reflow 

soldering systems with convection, condensation or 

a vacuum, drying and coating systems, functional testing 

systems, equipment for metallisation of solar cells 

and numerous customised special systems, we have a 

presence in all the relevant growth markets and, as a 

partner with over 30 years of industry experience, we arrive 

at innovative production solutions that set new standards. 


classified as non-Newtonian and thixotropic fluids. 

Viscosity, and thus any response to a force, is dependent 

on the shear rate for this reason. 

In solder paste, stress is converted by means of 

shear into an elastic strain component and a plastic 

deformation component. After stressing has ended, 

the elastic strain component causes the solder paste 

to relax. The transition from the elastic to a plastic 

strain component is called the yield point [G. Diepstraten 

& D. Wu, ‘Estimating Stencil Life and Ideal 

Heating Profile of Solder Paste Using Advanced 

Thermo-Gravimetric Analysis’]. The yield point is 

temperature-dependent and should be determined at 

lower shear rates. The shows the yield points of various 

solder pastes as a function of temperature. 

A further solder paste characteristic is its so-called 

wet tackiness. The solder paste’s adhesive strength 

over a period of time ensures that components adhere 

to the printed paste not only immediately after 

assembly, but rather up through the soldering process 

as well. Wet tackiness counteracts component 

uplift due to the buoyancy force resulting from the 

flow of air or nitrogen. 

Force relationship 

for an SOD323 

model 



Yield points of various solder 

pastes as a function of temperature 

[A. Sharma, S. Mallik, 

N. Ekere and J.-P. Jung, 

‘Printing Morphology and 

Rheological Characteristics of 

Lead-Free Sn-3Ag-0.5Cu 

(SAC) Solder Pastes’, 2014] 


In the Y direction 

Buoyancy force in the Y direction at 100% fan 

power is 34.5 µN and is thus smaller than the weight 

force of the component which amounts to 44 µN. 

Taking the additional wet tackiness of the solder 

paste into account, the component cannot be displaced 

in this direction by the wind forces. 

In the Z direction 

As described in ‘Experimental Investigations’, 

blown off components (at 91% fan power and 180° 

C) in proximity to the pads exhibit failure due to 

shear stress. The diagram overleaf offers a schematic 

representation of shear stress on the solder paste 

layer as a result of lateral wind force. 

The fact that the shear stress on the solder paste 

does not occur abruptly, but gradually, must also be 

taken into account. The component moves into the 

flow of air at 16.7 mm/s, and blowing force increases 

as it gets closer to a nozzle. When this force exceeds 

the solder’s yield force, the component moves. 

Yield force F F 

with cross-sectional surface area A 

amounting to 1.35 x 10–7 m², which is equivalent to 

the contact surface of a lead, and a yield point σ F 

of 

273 N/m² at 23° C can be calculated with the 

formula: F F 

=2Aσ F 

and amounts to 73.7 µN. Blowing force in this direction 

is 71.3 µm and is smaller than the calculated 

yield force. It should also be noted that the solder 

paste is squeezed out around the lead after placement, 

increasing the effective surface area of the 

paste being sheared. If this arises, an area larger than 

just the connection area must be anticipated. 

Stress-free Cutting Services 

Laser cutting of the smallest geometries with excellent 

cutting quality and high flexibility of rigid and flexible PCBs. 

Find out more: www.lasermicronics.com 

productronica: November 14–17, Hall B2, Booth 303 

LaserMicronics is a brand of LPKF Group: 

LPKF Laser & Electronics SE Phone +49 (5131) 7095-0 



3. With solder paste at 91% fan power and 180° C 

Component blow-off was observed at 180° C with 

91% fan power. As shown in the graph on page 41, 

the yield point of the solder paste decreases as a 

function of temperature. In zone 2, in which the 

knocked over components were discovered, the PCB 

had a temperature of 67° C. No results for the yield 

point of the solder paste are available for this temperature. 

For this reason, the yield point for solder 

paste 3 is extrapolated from the graph based on the 

assumption of a linear characteristic curve. The yield 

point is 162 N/m² and the resulting yield force is 

43.74 µN. This is smaller than the simulated force of 

65 µN, and the component is blown off. Considerable 

deviation of these forces can be attributed to the 

lack of yield point data at higher temperatures. 


Der erste Teil des Whitepapers zeigte auf, wie die 

Untersuchung zur Bestimmung des Einflusses der 

Vorlauftemperatur auf wegfliegende SOD323-Bauteile 

durchgeführt wurde. In diesem zweiten Teil 

werden die Testergebnisse untersucht und die 

besten Methoden aufgezeigt, um eine zuverlässige 

Verarbeitung dieser Bauteile zu gewährleisten. 

Résumé 

La première partie du livre blanc détaille le 

protocole des recherches autour de la 

détermination de l’influence de la température du 

flux sur les pièces SOD323 projetées. Cette seconde 

partie expose les résultats des tests et les 

meilleures méthodes pour garantir une préparation 

fiable de ce composant. 

Резюме 

В первой части технического описания было 

показано, как проводилось исследование для 

определения влияния температуры 

подаваемого теплоносителя на отлетающие в 

сторону компоненты SOD323. В этой второй 

части рассматриваются результаты испытаний 

и показаны наилучшие методы, гарантирующие 

надежную обработку этих компонентов. 

Schematic representation of shear stress on the solder paste 

due to wind force 

Summary 

The investigation results presented here show that 

the SOD323 can be reliably processed by selecting 

appropriate solder and using the right oven settings. 

The default setting, i.e. 73% fan power, provides a 

sufficient safety margin relative to determined limit 

loads at 91% fan power. For some PCBs, for example 

with very large coils or pin-in-paste technology, frequencies 

and thus fan power as well must be increased 

in order to intensify heat transfer into the 

PCB. It’s advisable to check these PCBs for the presence 

of flow-sensitive SOD323s and, if necessary, to 

run a test with an assembled PCB if the frequencies 

need to be increased. 

If fluctuations occur for other parameters like connection 

surface tolerances or solder paste properties, 

different relationships must be reckoned with. For 

example, the tolerance-related reduction of the connection 

surface area to 0.25 x 0.3 mm, instead of the 

typical 0.3 x 0.45 mm, causes a yield force reduction 

to 40.9 µN. As a result, the component can no longer 

withstand the ascertained blowing force of 71.3 µN. 


www.rehm-group.com 

Check out part one 

The first part of this white paper was 

published in our April 2023 issue, 

and described how the investigation 

on the influence of flow temperature 

on SOD323s being blown away was 

set up and conducted. 




On show at Productronica 2023 

Sustainable replacements for discontinued cleaning fluids 

MicroCare will exhibit its newest product innovations 

at Productronica 2023 and highlight its sustainable, 

high-performing replacements for the soon-to-be discontinued 

3M Novec specialty cleaning fluids. 

Due to emerging regulations on PFAS (per-and polyfluoroalkyl 

substance) manufacturing, 3M will cease 

manufacturing fluoropolymers, fluorinated fluids, 

and PFAS-based additive products by the end of 

2025, which includes popular Novec variants like 

7100, 71DE, 7200, 72DE, 72DA, and 73DE. MicroCare 

is stepping up to offer outstanding alternatives. 

These replacement fluids deliver superior performance 

in removing various soils encountered during 

manufacturing processes, including oil, grease, particulate, 

inks, and fingerprints while prioritizing sustainability. 

Among the portfolio highlights are the Tergo HDF 

(Heavy Duty Fluid) and Tergo GCF (General 

Cleaning Fluid). Both solutions have low GWP 

(Global Warming Potential) and zero ODP 

(Ozone Depleting Potential) ratings, ensuring 

compliance with strict environmental regulations. 

Additionally, their azeotropic properties 

make them chemically stable and nonflammable 

in vacuum and vapour degreasers, providing 

a reliable and safe cleaning process. These 

fluids are the perfect replacement for products 

under scrutiny or being discontinued. 

“Productronica presents an exceptional platform for 

us to engage directly with industry professionals, enabling 

us to showcase our cutting-edge cleaning 

fluids and tools,” said Scott Wells, General Manager. 

Productronica, Booth A4–101 

www.microcare.com 

Source: MicroCare 

Due to regulations on 

PFAS manufacturing, 3M 

will cease manufacturing 

fluoropolymers, fluorinated 

fluids, and PFASbased 

additive products 

by the end of 2025 

Low-temperature solder (LTS) materials 

Low temperature ball attachment process solutions 

Source: Shenmao 

PF734-S, built upon an 

improved low-temperature 

alloy PF734, outperforms 

conventional 

low-temperature alloys 

like 42% Sn and 58% 

Bi, says the company 

Shenmao America has introduced a range 

of low-temperature solder (LTS) materials 

in response to the growing demand for 

ultra-thin packages in the electronics industry. 

The company says its (LTS) materi- 

als are specially engineered to reduce reflow 

temperatures, mitigating PCB and 

substrate deformation, saving energy, reducing 

thermal stability requirements of 

substrates and components, and ultimately 

enhancing yield rates. 

PF734-S, built upon an improved lowtemperature 

alloy PF734, outperforms 

conventional low-temperature alloys like 

42 % Sn and 58 % Bi. The low-temperature 

flux solutions, SMF-80 and SMF- 

WC63, deliver excellent workability and 

are formulated with special activators 

that optimize wettability and solderability. 

The no-clean flux SMF-80 eliminates 

the need for post-reflow cleaning while 

maintaining high reliability and insulation 

with minimal flux residue. On the 

other hand, the water-soluble flux SMF- 

WC63 offers outstanding cleanability, and 

any flux residue left after reflow can be 

easily cleaned with water, ensuring exceptional 

surface cleanliness. 

www.shenmao.com 

Productivity. Profitability. 

We Connect 

Munich Trade Fair, November 14-17 

Hall B4, Booth 119 



The 5S lean manufacturing methodology in PCB production 

Improve benchtop cleaning, 

reduce waste with 5S 

Developed in Japan, 5S is a workplace organisation method used in physical 

manufacturing to eliminate waste. Elizabeth Norwood, Senior Chemist at cleaning 

solutions provider MicroCare, reveals how this lean, clean philosophy can be 

usefully applied in benchtop cleaning practices. 

extremely valuable process in PCB production, and 

especially benchtop cleaning. Adopting the 5S lean 

manufacturing method can help PCB manufacturers 

achieve better cleaning results at the benchtop, and 

thus increase efficiency and yield by reducing the 

number of faulty components and boards that land 

in the scrap pile. 

Optimising cleaning 

tools and workflow 

will lead to increased 

efficiency and reduced 

waste 

Although PCB shortages may be starting to stabilise, 

but the electronics industry continues to 

feel their impact. Exacerbating this issue for PCB 

manufacturers is the fact that the electronic components 

market continues to rapidly expand – with the 

sector predicted to grow by USD 122.44 billion (EUR 

116 billion) between 2022 and 2027, at a CAGR of 

7.02%. To avoid delays, PCB fabricators must find 

flexible and innovative strategies to ensure production 

continues. Options may include modifying designs or 

using alternative parts, but there is a more obvious 

solution: increase efficiency by decreasing waste. 

Electronics manufacturers must implement 

methods to ensure every electronic component is optimally 

utilised. An effective way to do this is to 

adopt tried and tested lean manufacturing processes 

such as the 5S methodology. This approach benefits 

all kinds of production environments and can be an 


What is 5S? 

The 5S philosophy can be summed up as: ‘a place 

for everything and everything in its place’. The name 

refers to five Japanese words beginning with ‘S’ that 

represent a 5-step process to organize the working 

environment. These terms can be translated into 5 

comparable English words: 

• Seiri/Sort: Separate tools/components that are 

necessary from those that are not. 

• Seiton/Set: Organise and categorise tools/components 

for ease of access and ease of use. 

• Seiso/Shine: Clean up the working environment. 

• Seiketsu/Standardise: Create standards and guidelines 

to uphold these practices. 

• Shitsuke/Sustain: Follow the first four ‘S’s on a 

long-term basis by always maintaining the correct 

procedures. 

Toyota first introduced something akin to the 5S 

methodology into its production in the 1950s – hoping 

to reduce manufacturing waste and inefficiency. 

It was discovered that by applying what later became 

known as the 5S concept, production ran more 

effectively because the workplace was clean and 

well-organised. This made it easier to see defects, all 

of which ultimately reduced waste and improved 

quality and output. 

The 5S strategy offers a large number of benefits 

to companies that adopt it. As well as reducing 

waste and optimising productivity, it also helps to 

enhance safety, improve quality and reduce costs. It 

is estimated that efficiency gains of 10% to 30% can 

be achieved using this method. 


5S and cleaning processes 

One of the main causes of PCB failure is contamination. 

If not cleaned sufficiently, PCBs are susceptible 

to many problems – from electrochemical migration 

and delamination to parasitic leakage, dendrite 

growth and shorting. Cleaning is crucial to ensuring 

the reliable, long-term performance of a PCB. 

Cleaning processes should be quick and consistent. 

Implementing the 5S methodology helps achieve this 

goal. 

Seiri / Sort 

To begin, it is essential to look at all the items on 

the benchtop and ask yourself the following questions: 

• Is this item necessary to clean the PCB and electronic 

components? 

• When was it last used? 

• Does it clean effectively? 

In this way, you can determine which items on the 

benchtop are required for the job. Certain tools and 

cleaning fluids may have worked well last year but as 

new designs and components are introduced, these 

may no longer perform as they once did. A no-clean 

solder paste may have been added to the assembly 

process and the available flux remover may not be 

strong enough to remove the stubborn no-clean flux 

white residue, for instance. Perhaps a fragile or 

moisture-sensitive component has been added to the 

design which can only be hand-soldered. Selectively 

soldered PCBs usually undergo ‘spot-cleaning’ at the 

benchtop using aerosol flux remover and a brush but 

if the cleaning fluids are too strong for these delicate 

components, they can cause damage and result in 

scrapped boards. 

A controlled cleaning fluid dispensing system is an 

essential tool on every PCB cleaning bench. When 

appropriately used, this system improves PCB cleaning 

results by targeting dirty areas on the board, getting 

under low-mounted components and permeat- 

Contaminated PCBs 

typically will not pass 

final inspection 


Messe Frankfurt Group 

11 – 13.6.2024 

NUREMBERG, GERMANY 

DRIVING 

MANUFACTURING 

FORWARD 

Shape the future of electronics 

manufacturing and become 

part of the community. 

Join us an 

exhibitor 

smtconnect.com 


A dispensing system 

controls the fluid flow 

to reduce cleaning 

fluid waste and enhances 

worker safety 

by limiting the amount 

of cleaning fluid 

fumes released into 

the air 


ing tight spaces for perfect for spot cleaning. It also 

controls the fluid flow to reduce waste and enhances 

worker safety by limiting the amount of cleaning 

fluid fumes released into the air. 

Seiton / Set 

The second step is ‘set’ or ‘straighten’. This is at the 

heart of the phrase ‘a place for everything and everything 

in its place’. All items that have been deemed 

necessary should be organized logically and 

methodically. This can be achieved by giving each a 

designated area and labelling it for quick identification. 

This lessens the need for extra inventory and 

cuts down on search time. 

Think about how the cans of aerosol cleaning fluid 

are arranged on the work surface, for example. Removing 

aerosol cans and storing them in mounted 


Die in Japan entwickelte 5S-Methode zur Arbeitsplatzorganisation 

wird in der Fertigung eingesetzt, um 

Verschwendung zu vermeiden. Der Artikel zeigt auf, 

wie diese Philosophie sinnvoll auf Praktiken der Labortischreinigung 

angewendet werden kann. 

Résumé 

La méthode des 5 S développée au Japon pour 

organiser l’espace de travail est utilisée dans la 

fabrication pour éviter le gaspillage. L’article dévoile 

comment appliquer cette philosophie au nettoyage 

des tables de laboratoire. 

Резюме 

В производстве используется разработанный в 

Японии метод организации рабочего места 5S, 

направленный на избежание расточительного 

использования ресурсов. В статье показано, как 

эту философию можно рационально применить к 

практике очистки лабораторных столов. 

holders on the work bench legs frees up workspace 

and keeps cleaning fluids easily accessible – meaning 

less time spent looking for the appropriate fluid. 

Seiso / Shine 

Shine refers to cleaning. Everything must be clean, 

tidy, and neatly stored in its place. How can the PCB 

or components be clean if the benchtop you are 

working from isn’t? If a benchtop is covered in dirt 

and dust, it will negatively affect the cleaning process 

and exacerbate other problems like electrostatic 

discharge (ESD). 

ESD is a major cause of PCB failure and is estimated 

to cause a third of PCB losses. It occurs when 

a board comes in contact with an object with the opposite 

electrical charge and creates an ESD spike, 

This damages boards and their sensitive electronic 

components. 

While it is impossible to prevent or eliminate all 

ESD, some practical ways to reduce it during SMT 

(surface mount technology) production include 

keeping the benchtop clean. Many work surfaces and 

tools used to assemble, clean and test PCBs hold 

static charges. It is important to dissipate the 

charges and remove the dirt by wiping down all tools 

and surfaces with pre-saturated, ESD-reducing 

cleaning wipes. 

ESD wipes are formulated to remove grime, grease 

and fingerprints without leaving lint, residue or 

static charges behind. They are a good general cleaner 

that will not dry out the ESD mats, cause fissures 

or leave mats brittle. Cleaning with ESD pre-saturated 

wipes helps ensure tools, surfaces and equipment 

are both clean and non-conductive. 

Seiketsu / Standardise 

This step ensures that all the progress made in the 

first three steps are not for nothing. By standardising 

these steps, 5S becomes a repeatable process that 

every technician follows. Creating a checklist and 

ensuring all workers follow the same procedures, and 

carry out cleaning processes correctly, will help ensure 

that consistent, high-quality PCB cleaning becomes 

standard practice. This in turn will help to reduce 

waste. 


PCB & ASSEMBLY « 

Shitsuke / Sustain 

Sustain is the final stage that helps technicians 

maintain all that has been implemented over the 

previous four stage. Companies must maintain the 

5S procedures and update and adapt them as 

necessary. 

It is essential to involve the entire workforce in the 

5S approach: the management team, those working 

at the PCB cleaning workbench, and staff in inspection 

and quality control. Regular training is a good 

way to keep everyone updated on the process and to 

ensure long-term success. 

The sixth ‘S’ 

An additional sixth step that some companies 

adopt when using the 5S methodology is ‘Safety’. It 

concentrates on eliminating workplace risks and 

raising standards. 

It is important to examine cleaning fluids and 

equipment and carefully review the SDS (safety data 

sheets) to make sure they are appropriate for usage. 

Advanced PCB cleaning solutions are safer for exposed 

employees since they are designed to be nonflammable, 

have better toxicity profiles, and high 

threshold limit values (TLVs), making them safer for 

users. 

As mentioned above, a controlled cleaning fluid 

dispensing system is an effective tool. Cleaning fluid 

is distributed through a closed aerosol system, restricting 

worker exposure to any gases and lowering 

the possibility of spillage 

and fire hazards. 

As component shortages 

continue, PCB manufacturers 

are making every part 

count. Ineffective PCB 

cleaning not only affects the 

quality and reliability of any 

electronic device but can 

also leave the PCB unusable. 

When considering PCB 

cleaning, look for methods 

like ‘5S Plus Safety’ to help 

to optimise the process, and 

reduce waste. 


www.microcare.com 

About the author 

Elizabeth Norwood is a Senior 

Chemist at MicroCare, provider 

of precision cleaning solutions. 

She has been in the industry for 

more than 25 years and has a 

BS in Chemistry from the University 

of St. Joseph, Connecticut. 

Norwood researches, develops 

and tests cleaning-related 

products. She currently has one 

patent issued and two pending 

for her work. 

There are always two 

sides to every story! 

New AOI system for top 

and bottom inspection 

www.viscom.com 

Booth A2.177 

NEW 

3D AOI 



Source: ArtiMinds Robotics 

No-code / low-code tools simplify and speed up robot programming thanks to their template-based approach 

Implementing robots in a time and cost-efficient manner 

Why no-code & low-code tools 

are vital in robotics 

There are various stumbling blocks when it comes to implementing automation tools 

that users often underestimate. In this article, automation solutions provider Artiminds 

reveals how new no-code and low-code software tools can help manufacturers avoid 

these pitfalls and facilitate flexible, simplified robot programming. 

» Silke Glasstetter, Head of Marketing, ArtiMinds Robotics 

Using robots is almost always worthwhile for 

companies. They can reduce labour costs, relieve 

employees, and make production more flexible 

– particularly as batch sizes become smaller and production 

processes more individual. Another major 

advantage of robots or cobots is that they work 

without breaks or fatigue, thereby increasing product 

quality and reducing scrap. 

Almost all processes can be automated using modern 

robot systems. Robots are often used for simple, 

dirty, monotonous, physically demanding, and even 

dangerous tasks. With the right hardware and, more 

importantly, software, however, highly complex or 

demanding tasks can also be tackled using ‘Advanced 

Robotics’. Examples of such applications include the 

assembly of flexible and bendable components such 

as cables, wires, or hoses or force-controlled surface 

processing. 

In line with the no-code/low-code trend, various 

software solutions on the market now enable graphical 

(and therefore simplified) programming. The advantage 

of this is that no special programming skills 

are required. The portfolio of solutions in this area 

ranges from manufacturer specific to independent 

offerings that can be used to program robots from 

different manufacturers using just one single piece 

of software. In the latter case, experts recommend 

using tools that automatically generate native robot 

code for the particular robot controller instead of 

controlling the robot arm via a separate IPC. In the 

former case, users are able to remain flexible when it 

comes to adjustments or optimizations during operation 

because they can continue to program the 

robot using line code (even without using the software), 

and thus avoid a lock-in effect. 

Regardless of whether you are using external en- 


gineering tools or line code, there are obstacles on 

the path to robot-based automation that users often 

underestimate. Here are some tips on how to avoid 

three of the most important stumbling blocks. 

Programming effort 

The time required to program an application is not 

usually underestimated, but there are other pitfalls 

during this phase. These include process tolerances 

and variances that have not been taken into account; 

the increased complexity of incorporating 

sensors, or establishing communication between the 

robot and a PLC. Programming a system is often a 

tailor-made and complex process that is difficult to 

adapt. Programmers often have their own style, 

which can make the resulting code or program difficult 

for other programmers to understand and/or 

modify. In this case, the no-code/low-code solutions 

currently on the market can better support users. 

Thanks to pre-defined function blocks, programs can 

be constructed and structured in a clear and understandable 

manner. Using the right software, process 

tolerances and variances can also be automatically 

compensated, analyzed, and optimized. If the corresponding 

interfaces are already integrated, the effort 

required to connect sensors or set up a PLC communication 

is also significantly reduced. 

Effort during commissioning 

Programs can be structured and made traceable using pre-defined function blocks. 

Before commissioning, the process can be simulated as realistically as possible in a 3D 

simulation environment and tested 

A rule of thumb states that the cost of the robot 

itself is only about one third of the initial cost of the 

cell, and experience reveals that around 45 percent 

of typical costs are incurred during ramp-up. This is 

because users often underestimate the time required 

for commissioning. Although the system is programmed 

offline and simulated in advance, discrepancies 

between theory and practice often only become 

apparent during commissioning. This means 

that, despite preparation, the process can take significantly 

longer than 

planned, and necessary adjustments 

can quickly become 

expensive. Factors that were 

not apparent during digital 

preparation may need to be 

addressed on-site during commissioning. 

This makes this 

phase difficult to calculate. 

Using consistent tools, rampup 

can be implemented in a 

controlled manner, and with- 


Advanced robotics applications such as the assembly of flexible cables pose a major challenge for 

classical robot programming 




When teach points can 

be transferred from 

the robot back to the 

programming software, 

this seamlessly 

integrates into the 

commissioning process 

and saves effort 

Source: Ridvan/stock.adobe.com 

out a significant loss of time – ensuring this phase 

does not become a cost driver. It is important to 

combine simulation, programming, sensors, and data 

analysis in one single software package. This way, the 

engineering chain is consistent without the user 


Drei der wichtigsten Aspekte auf dem Weg zur roboterbasierten 

Automatisierung werden im Artikel 

aufgegriffen und erläutert, wie sich die damit verbundenen 

Stolpersteine vermeiden lassen. 

Résumé 

L’article aborde les trois aspects les plus 

importants d’une transition vers l’automatisation 

robotisée et explique comment éviter les obstacles 

sous-jacents. 

Резюме 

В статье рассматривается три важнейших 

аспекта на пути к роботизированной 

автоматизации и объясняется, как можно 

избежать связанных с этим серьезных 

препятствий. 

having to compromise on functionality. This makes it 

faster, more flexible and easier to make changes and 

adjustments. With automatically-generated code 

and the ability to transfer teach points back from the 

robot into the software, this kind of solution can integrate 

seamlessly into existing commissioning and 

maintenance processes. It also offers the greatest 

flexibility in terms of online and offline programming, 

allowing the user to choose the easiest option 

to complete the respective task. 

Changes during cell lifecycle 

Over the system runtime, various changes in general 

conditions may occur that necessitate adjustments 

in programming. These could be vibrations 

and shocks caused by forklifts or other machines; 

wear and tear of tools; replacement parts that react 

differently from previous components or changes in 

workpiece batches, available space, or operating personnel. 

Lighting or temperature fluctuations, or the 

contrast between a cold-started and warmed-up 

robot can also have an impact. 

Software that standardizes and simplifies programming 

allows the user to react quickly and flexibly 

to these and other changes in conditions and to 

make the necessary adjustments to the program. A 

worker can ensure they are best prepared by using a 

tool that is able to make changes or visualize consequences 

in terms of forces, cycle times, defects and 

quality even earlier. 

Productronica, Booth B4.404 

www.artiminds.com 



Eliminate manual placement and orientation errors 

BIB loader/unloader for semiconductor industry 

ation and options that can meet specific 

requirements and applications. Featuring 

ergonomic control panels and userfriendly 

software, the system eliminates 

the need for manual placement and 

orientation, ensuring reliable, accurate operations. 

With its automation capabilities, 

the system enhances operational efficiency 

and reduces manufacturing defects. 

“Lykos represents a significant leap forward 

in board handling technology, offering 

distinct advantages over traditional 

manual systems,” said Josef Weinberger, 

Head of Business Unit, Esmo semicon. 

The system features fully automated open 

top sockets loading, flexible BIB clamping 

Source: Esmo Group 

The system features fully automated open top 

sockets (OTS) loading, flexible BIB clamping for 

different sizes, and a conversion time of less 

than 3 minutes, including BIB change 

Esmo Group (esmo) has launched Lykos, a 

modular Burn-in Board (BIB) loading and 

unloading system designed to eliminate 

manual placement and orientation errors. 

With high demand for microchips, the industry 

needs an efficient way to manage 

the volume and turnaround time during 

burn-in, a process to detect early failures 

in semiconductor devices. Manual burn-in 

methods — including hand placement, 

manual flipping, and manual stacking — 

are slow, error-prone, and can damage 

delicate wafers, ultimately leading to 

costly downtime and product defects. 

Lykos, a portable device handling system, 

offers users modular machine configurfor 

different sizes, and a conversion time of 

less than 3 minutes, including BIB change. 

www.esmo-group.com 

Bonding technologies for OPV and perovskite-based systems 

Adhesives for flexible photovoltaics 

Source: Panacol 

Adhesives are applied on barrier foil to seal the 

delicate OPV modules 

Provider of adhesives, coatings, and UV/ 

LED curing equipment, Panacol has developed 

a range of multi-functional adhesives 

for applications in flexible photovoltaics 

and electronics. 

Organic photovoltaics (OPV) and perovskite-based 

systems are enabling radical 

new applications in consumer electronics 

such as indoor light harvesting to 

extend the battery life of wearables, and 

outdoor energy generation solutions 

which would have been impossible using 

conventional photovoltaics. 

A key contributor to these advancements 

is in the area of bonding technologies. In 

line with these changes, Panacol now 

offers multi-functional adhesives for applications 

in flexible photovoltaics. In 

OPV applications, these provide higher resistance 

to environmental stresses, improved 

compatibility with the PV material 

and good adhesion to the substrates. New 

conductive adhesives efficiently adhere 

and protect electrical connections for 

SMD components in flexible assemblies. 

www.panacol.de 

The answer to avoid voiding 

Setting up a profile with our 

Vapour Phase Soldering Machines is like a short flight 

Enter the data, “take off“ and you´ve reached the destination. 

Trust the world market leader. Come with us on board. 

We are looking forward to your visit at Productronica Hall A4, Booth 216 

IBL-Löttechnik GmbH Messerschmittring 61-63, D-86343 Königsbrunn Tel.: +49(0)8231/95889-0 www.ibl-tech.com 


» TEST & QUALITY ASSURANCE 

Achieving autonomous inspection 

How AI is revolutionising 

AOI and AXI systems 

Be it AI-supported inspection programme creation or AI 

classification of pseudo-defects at the verification station, the 

first steps towards achieving autonomous inspection have been 

taken. To take even more work off operators’ hands, AOI and AXI 

assistance systems are now being developed. Yet there’s still 

some way to go before optical inspection is fully automated. 

» Christina Schellbach, Public Relations Manager & Andreas Tuerk, 

Product Manager AXI, Goepel electronic 

Among other things, AI is 

used in the creation of 

inspection programmes 

and defect classification. 

The goal: to 

reduce effort and save 

costs. Personnel resources 

can be deployed elsewhere 

in the company 

AI evaluation of a welded 

joint in the X-ray image 

directly in the production line 

Historically, there have been several technological 

paradigm shifts in the field of AOI and AXI 

systems,” says Andreas Tuerk, product manager for 

X-ray systems at Goepel electronic. First, AOIs employed 

orthogonal cameras with illumination variants. 

Then oblique cameras and more sophisticated 

illumination of different wavelengths and directions 

were added. After that, 3D imaging technology was 

integrated to evaluate solder joints even more reliably. 

AXI systems have undergone a comparable 

trajectory. The vertical (2D) and oblique (2.5D) radiography 

of an assembly, mostly with analogue image 

intensifiers, gradually developed into 3D X-ray systems 

for solder joint inspection across several layers. 

The advent of 64-bit technology and powerful digital 

x-ray detectors then made AXI fast enough to use in 

the production line. “Until now, any fundamental 

Source: Tina Dietrich/Göpel 

Source: Göpel electronic 


changes in inspection technologies have been hardware 

related,” Tuerk explains. “The next paradigm 

shift will be in the area of software. And artificial intelligence 

will be the driver.” 

Saving costs and personnel 

In addition to machinery acquisition and maintenance 

costs, personnel costs have the biggest impact 

on the price of inspection processes. In addition to 

personnel to classify abnormalities at the verification 

station, experts are required for the creation of inspection 

programmes. In this area, AI can reduce 

human effort and save money. A clear trend for customisation 

is evident among electronics manufacturers 

across the world – small batch sizes need to be 

produced and inspected quickly and, of course, costeffectively. 

In this case, an inspection programme 

that works from the first assembly can be created in 

just a few clicks using various assistance functions. 

Thanks to artificial intelligence, this will be achievable 

without the intervention of an employee in the 

future - contributing significantly to a reduction in 

inspection costs for very small batches. 

The future of programme creation 

Artificial intelligence has been used in Goepel inspection 

systems for several years. The time employees 

require to conduct various processes is already 

being reduced. Step by step, beginning with 

the semi-automation of processes, we are moving 

towards the final goal – fully automated, 

autonomous inspection. 

In the past, inspection programmes began with 

data import. Article numbers were manually assigned 

to existing library entries. Finally, the test parameters 

were manually adjusted. All of this was time-consuming. 

Nowadays, this process looks a little different 

- although automated programme creation still 

starts with data import. Component parameters 

Christina Schellbach, 

Public Relations 

Manager at Goepel 

electronic 

(name, position, article number, and so on), layout 

and pad information are now readily available but 

detailed information about the housing and the 

solder joint (dimensions, height, pin shape) is still 

missing. To obtain this, the 3D AOI system creates an 

exact image of the respective housing and solder 

joints using the first produced assembly. This information 

is then used to determine the respective 

enclosure shape and to assign all required test functions. 

The test programme is created and a component 

library is automatically generated based on article 

numbers. In the final stage, the test programme 

is executed and the test parameters are automatically 

adapted to the real process variations. To avoid 

slippage, tolerance limits are placed tightly around 

the actual measured values and corrected according 

to real fluctuations, taking plausibility criteria into 

account. This is called knowledge-based intelligence. 

In the future, it will be possible to create a test programme 

without the real image of the first assembly. 

A completely digital image of the PCB with components 

and solder joints – a digital twin – will be used 

in the creation of a new test programme without the 

need for an actual physical assembly. 

“There are already AI inspection functions that do 

not require any setting parameters because they use 

a pre-trained AI model for classification,” explains 

Tuerk. Examples of this include the x-ray inspection 

Andreas Tuerk, 

Product Manager 

for X-ray systems at 

Goepel electronic 

Source: Tina Dietrich/Göpel electronic 

AI advisor reduces 

workload for verification 

station staff; 

AI also protects 

against human error 



Source: Göpel electronic 

AI evaluation of a QFN pin solder joint in a 3D X-ray image with AI advisor 

of prismatic battery cells for foreign objects or the 

AXI inspection of sheath thermocouples directly in 

the production line. As a human being, you often see 

certain defect features quickly – but the machine 

needs an expert who has mastered the parameterisation 

of an inspection function in order to be able 

to evaluate a feature correctly. This is where AI can 

help. The AI system is trained using example images. 

This results in an AI model that carries out the evaluation 

without any setting parameters. This is exemplified 

in the evaluation of welded joints on sheath 

thermocouples. 


Noch sind wir nicht bei autonomen Inspektionssystemen 

angekommen, doch KI-basierte Technologien in der Inspektion 

ermöglichen bereits heute die vollautomatische 

Erstellung sowie Optimierung von Prüfprogrammen. 

Résumé 

Bien que nous n’ayons pas encore de système 

d’inspection automatique, les technologies basées sur l’IA 

permettent déjà aujourd’hui de créer et d’optimiser des 

programmes de contrôle de manière entièrement 

automatique. 

Резюме 

Хотя мы еще не пришли к автономным системам 

контроля, тем не менее технологии на основе 

искусственного интеллекта в области контроля уже 

сегодня обеспечивают полностью 

автоматизированное изготовление и оптимизацию 

программ проверки. 

Further AI applications are in the works. In x-ray 

inspection, AI solutions for void detection, BGA 

head-in-pillow detection and short-circuit control 

are already being developed. AI approaches are 

emerging in predictive maintenance and for the 

analysis of results data from inspection systems 

across the whole SMT line. “There’s a long way to go 

before we achieve fully-automated inspection but 

we shouldn‘t forget how far we’ve come,” says Tuerk. 

AI at the verification station 

AI is not only saving human resources in the creation 

of inspection programmes. There is also the potential 

to save time and money at verification and repair 

stations. Goepel electronic relies upon the AI advisor 

software module for this purpose. Based on pretrained 

models, the AI advisor makes its own decision 

for each anomaly found by the inspection system. The 

AI‘s decision is based on the verification decisions 

made by humans in comparable cases in the past. 

Now there are different options for deploying AI decision-making. 

Anomalies that are classified with high 

confidence as pseudo errors can be evaluated directly 

by the AI – without human intervention. This saves 

time. The AI advisor can also warn us about whether 

a human error could lead to a so-called human slip. If 

an operator incorrectly classifies a real error as a 

pseudo error, the user is asked to reconsider his decision. 

Especially in the case of X-ray images – where 

error interpretation is often more demanding – the AI 

advisor can be a welcome aid. Its functionality is constantly 

being expanded with the aim of a fully autonomous 

classification of all abnormalities found. 

Trust is good – control is better! 

“Often there is still a sense of unease about the 

use of artificial intelligence in the field of inspection 

systems” notes Tuerk. “Why did the AI decide one 

way and not another? Will the AI find previously discovered 

defects even after it has been trained with 

new image samples? These are all legitimate questions. 

Luckily we already have some answers. The AI 

must be trustworthy – decisions must be comprehensible. 

With this in mind, Goepel electronic is 

working on ‘Comprehensible AI’ to increase trust and 

acceptance. We shouldn’t forget AI is only as good as 

the human who trained it, and this depends entirely 

on data selection, its completeness and consistently 

correct labelling and categorisation,” says Tuerk. 

There may still be some way to go before we 

achieve fully-autonomous inspection but, thanks to 

AI, the next paradigm shift is already well underway. 


www.goepel.com 


Inspection solutions on display in Munich 

High-throughput AOI & AXI at Productronica 

Provider of test and inspection solutions 

Test Research, Inc. (TRI) will unveil its 

Ultra-High-Speed 3D AOI, TR7700QH SII at 

Productronica 2023. Capable of inspecting 

at speeds of up to 80 cm²/sec, the system 

offers smart programming, AI algorithms, 

and metrology measurement capabilities. 

Also on display will be the newly-released 

high-throughput 3D AXI, TR7600 SV, 

which, the company says, offers up to 

20 % performance improvement compared 

to the TR7600 series. Powered by AI algorithms, 

the high-speed 3D AXI can accu- 

rately detect void defects. The test solutions 

provider will also showcase its 

high-speed multi-angle 3D AOI, TR7500QE 

Plus, equipped with four 20MP side cameras 

and 1 high-resolution camera, as well 

as its 3D SPI TR7007DI Plus, the 3D AXI 

TR7600F3D SII, and the multi-core ICT 

with in-system LED Analysis function 

TR5001Q SII Inline. AI solutions include AI 

training tool, AI station, verify host, AI 

smart programming, and more. The test 

and inspection solutions comply with Industry 

4.0 standards like the IPC- 

TR7700QH SII is capable of inspecting 

at speeds of up to 80cm²/sec 

Source: Test Research, Inc. 

Hermes-9852, IPC-CFX, and IPC-DPMX. 


www.tri.com.tw 

Enhancing THT inspection efficiency and accuracy 

Inline AOI system for inspecting THT components 

Mek (Marantz Electronics) has launched 

the Mek VeriSpector Inline, an inline THT 

AOI system designed for inspecting THT 

components before they enter wave or 

selective soldering machines to enhance 

inspection efficiency and accuracy in 

through-hole assembly processes. Devel- 

Source: Marantz Electronics 

oped in collaboration with Nutek, the system 

offers robustness and compatibility. 

Its inline configuration optimizes investment 

costs by minimizing the need for 

separate inspections at each manual assembly 

station. Manufacturers can fully 

automate the inspection process with a 

VeriSpector Inline for inspecting THT components 

before they enter soldering machines 

wide range of available options. 

Powered by the 22X Software, an inspection 

system used in the PCB assembly industry, 

the system is easy to program while 

maintaining the power and speed of the 

inspection algorithms. It offers flexible inspection 

including presence detection, 

orientation, shape, offset, polarity, text 

verification, fiducial reading, color check, 

1D and 2D barcode reading, assembly materials 

fittings, damaged object detection, 

and more. The standard 24MP camera and 

high-definition lens captures fine details at 

a clear resolution, while upgrades to 42MP 

or 60MP cameras are also available based 

on specific application requirements. 


www.marantz-electronics.com 

High resolution X-ray-/ and CT analysis as a service 

ADVERTISEMENT 

Foto: X-ray Service GmbH 

We have the view! 

In our X-ray laboratory near Graz, 

we inspect a wide variety of materials 

within a very short time, nondestructively, 

down to the smallest 

detail. Possible defects become visible 

immediately. Our customers 

from the electronics, automotive 

and aerospace industries have been 

relying on our high-tech testing process 

for 20 years. Two modern highresolution 

X-ray/CT systems are 

available for our services. Whether 

X-ray analyses of larger quantities, 

or in-depth individual CT analyses – 

we will be happy to advise you on 

the right inspection method and 

provide you with the results as digital 

X-ray images or as 3D volume data. 

Get certainty and save valuable 

time in quality assurance. 

CONTACT 

X-ray Service GmbH 

Bierbaum 44 

A-8141 Premstätten 

Tel.: +43 (0) 3135 54812–10 

E-Mail: office@xray-service.at 

www.xray-service.at 



Verifying board mechanical stress on flying probe 

Programmer tool for flying prober 

debuts in Nuremberg 

Shown for the first time at SMTConnect in Nuremberg this year, Seica’s FlyStrain 

Option is a programmer tool aimed at addressing the fundamental concerns of electronic 

board manufacturers looking to optimize their investment. 

The Flystrain 

Option is available 

only on Pilot VX 

About Seica 

Source: Seica 

Founded in 1986, Seica S.p.A. is a technology 

company that develops and manufactures 

leading-edge solutions for the test 

and selective soldering of electronic 

boards, and modules. It provides battery 

test solutions, automotive electronic 

board test solutions, infotainment test, as 

well as electric vehicle inverter and battery 

charging station test systems. Seica 

has fully embraced the concept of Industry 

4.0, developing solutions to monitor 

and collect information from machines 

and industrial plants to enable the optimization 

of manufacturing processes, 

maintenance and energy management. 

Company headquarters are located in 

Italy, with direct offices in USA, Germany, 

China, Mexico, France and Israel. 

www.seica.com 

Including a multitude of new hardware and software 

features, the Pilot VX with FlyStrain programmer 

tool is Seica’s new fully automated solution 

for verifying mechanical stress on boards using a flying 

probe. The system offers state-of-the-art mechanical 

performance and motion control, enabling a 

reduction of up to 50% in test time. 

Other features include: 

• 12 multi-function test heads with the capability 

of contacting up to 44 points simultaneously 

• Technologically-advanced measurement hardware 

• A microwave-based measurement technique 

• Optimized VIVA software management enabling 

the parallelization of different types of tests 

• Smart analysis capabilities, together with 

algorithms based on the principles of artificial 


Runtime tool to 

measure the force as 

soon the electrical 

contact is stable 

Source: Seica 

The coloured map generated after 

the test. It shows the most touched 

contact areas using a scale from 

blue (no contact/few contacts) to 

red (heavily touched areas) 

intelligence which automatically optimize the 

test flow in run-time, while maintaining test 

coverage targets 

The prober can accommodate fully loaded doublesided 

boards with components that need to be programmed; 

LEDs that require electrical and optical 

testing; flex circuits; and board sizes and components 

ranging from very small to very large. Using 

the FlyStrain option, the Pilot VX can now also generate 

pressure/force topology maps of the device 

under test. 

Once a necessity for traditional fixture-based solutions, 

these new tools have been migrated to the flying 

prober where testing of ceramics, wafers and 

avionics and satellite boards requires delicate probing 

and traceability. The new option generates a graphical 

interface for fast analysis and log file for statistical 

analysis. This kind of analysis is already conducted on 

sample boards for Bed-of-Nails systems. 

Using the new option, the runtime tool measures 

the force as soon the electrical contact is stable. The 

contact is continuously monitored, and when the 

probe reaches the contact height, the system reports 

the contact pressure for each single test point. The 

final result is visualised via a coloured map using a 

scale from blue (low stress point) to red (high stress 

point). 

In summary, the Pilot VX with FlyStrain programmer 

tool is a flexible, configurable test system 

with a set of technologically-advanced tools. It provides 

the test solutions required by the huge diversity 

of electronics which characterizes today’s high-volume 

production environment. 


www.seica.com 


Ein Flying Probe System inklusive Programmiertool 

stellt eine vollautomatische Lösung mit einer Vielzahl 

an Hard- und Softwarefunktionen dar, um eine Leiterplatteninspektion 

zu optimieren. 

Résumé 

Un système de sonde volante équipé d’outils de 

programmation constitue une solution entièrement 

automatisée avec un grand nombre de fonctionnalités 

logicielles et matérielles. 

Резюме 

Система летающих зондов, включающая 

инструмент программирования, представляет 

собой полностью автоматическое решение с 

множеством аппаратных и программных функций 

для оптимизации контроля печатных плат. 

Source: Seica 


» ADVERTISERS 

Altus Group 26 

ArtiMinds Robotics 48 

Bosch 12 

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CEA-List 11 

ESSEMTEC AG, CH-AESCH 13 

ERSA GmbH, Wertheim 3 

Esmo Group 51 

FUJI EUROPE CORPORATION GmbH, 

Kelsterbach 60 

GÖPEL electronic 52 

Heraeus Electronics 6 

IBL-Löttechnik GmbH, Königsbrunn 51 

Indium Corporation 34 

Infineon Technologies 10 

International Federation of Robotics (IFR) 10 

IPC 6, 13, 59 

Kamic Group 12 

Kistler Instrumente AG, CH-Winterthur 29 

Koh Young Europe GmbH, Alzenau 1, 11, 27 

Koh Young Technology 16 

Kurtz Ersa 25 

LPKF Laser & Electronics AG, Garbsen 41 

Marantz Electronics 55 

Mek (Marantz Electronics) 55 

Mesago Messe Frankfurt GmbH, Stuttgart 45 

Messe München GmbH, München 2, 14 

MicroCare Carp., US-New Britain, CT 39, 43, 44 

NXP 12 

Panacol 51 

PIEK International 

Education Centre (I.E.C.) GmbH, Aachen 23 

Pink GmbH Thermosysteme, Wertheim 25 

Panduit GmbH, Schwalbach 43 

Rehm Thermal Systems 38 

SEHO Systems GmbH, Kreuzwertheim 33 

Seica 56 

Shenmao America 43 

Siemens 30 

Siemens Digital Industries Software 11 

SmartRep GmbH 12 

SMT Maschinen- und 

Vertriebs GmbH & Co. KG, Wertheim 35 

Test Research, Inc. 55 

TSMC 12 

Ventec International Group 22 

VISCOM AG, Hannover 47 

X-ray Service GmbH, AT-Premstaetten 55 

Yamaha Motor Europe 

N.V. Niederlassung Deutschland, Neuss 31 

ZEVATRON Löttechnik GmbH, Volkmarsen 49 

ISSN 1618–5587 

Trade journal for all fields of production in the 

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EPP Europe 04/2024 will be published 27. April 2024 


ecwc16 

ELECTRONIC CIRCUITS 

WORLD CONVENTION 

WHAT S 

NEXT 

BECOMES 

SAVE 

THE 

DATE 

See you next year in Anaheim, California at IPC APEX EXPO 2024. 

Thank you to our sponsors, exhibitors, speakers 

and attendees for making 2023 a success! 

IPC.ORG/APEXEXPO-CFP | #IPCAPEXEXPO 


READY… 

… TO WORK REMOTE? 

Never overlook line errors and reduce down times 

Operators will be informed to take immediate action 

Also get notification for non-FUJI equipment 

Visit us at 

productronica 2023 

November 14 th –17 th , 2023 

in Munich 

Booth A3.317 

60 EPP Europe » 11 | 2023 

FUJI EUROPE CORPORATION GmbH 

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