EPP Europe P2.2023
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» CONTENTS 11 | 2023 29. YEAR OF PUBLICATION<br />
Koh Young<br />
highlights the<br />
importance of<br />
integrating IPC<br />
communication<br />
standards into its<br />
tools<br />
COVER STORY<br />
AI-based<br />
process<br />
controls for<br />
Industry 4.0<br />
» Page 16<br />
Source: Koh Young<br />
NEWS & HIGHLIGHTS<br />
Industry News<br />
Heraeus Electronics to partner in joint ‘KuSIn’ project 6<br />
EU launches risk assessments of critical technologies 6<br />
Interview<br />
Guenther Lauber, ASMPT<br />
The road to sustainability 7<br />
Industry News<br />
New platform to raise awareness robotics advantages 10<br />
Infineon heads EU project for ‘greener’ electronics industry 10<br />
CEA & Siemens to collaborate on digital twin capabilities 11<br />
TSMC to build semiconductor factory in Dresden, Germany 12<br />
Kamic Group acquires SmartRep 12<br />
IPC: Eurozone economy grows 0.3% in Q2 2023 13<br />
TRADE SHOWS & EVENTS<br />
Shaping the future of electronics production<br />
Productronica 2023 to foreground AI, power electronics 14<br />
COVER STORY<br />
Get ahead with real time inspection<br />
AI-based process controls for Industry 4.0 (Koh Young) 16<br />
PCB & ASSEMBLY<br />
Moving beyond manual ID methods<br />
Applying IMSs in lighting and power conversion (Ventec) 22<br />
Product Updates – PCB + Assembly 25<br />
Full traceability in hand soldering<br />
Laser labelling in electronics manufacturing (Altus) 26<br />
Transforming labour shortages into business advantages<br />
Address staffing challenges using digitalization (Siemens) 30<br />
Experiment & analysis of QFN assemblies<br />
Minimizing voiding in SMT assembly of BTCs (Indium) 34<br />
White paper: ‘flying’ SMD components - part two<br />
Combatting the ‘flying’ components phenomenon (Rehm) 38<br />
Product Updates – PCB + Assembly 43<br />
5S lean manufacturing methodology in PCB production<br />
Improve benchtop cleaning, reduce waste (MicroCare) 44<br />
Implementing robots in a time and cost-efficient manner<br />
Why no-code/low-code tools are vital in robotics (ArtiMinds) 48<br />
Product Updates – PCB + Assembly 51<br />
TEST & QUALITY ASSURANCE<br />
Achieving autonomous inspection<br />
How AI is revolutionising AOI and AXI systems (Goepel) 52<br />
Product Updates – Test + Quality Assurance 55<br />
Verifying board mechanical stress on flying probe<br />
Programmer tool for flying prober (Seica) 56<br />
COLUMNS<br />
Editorial 3<br />
Imprint/List of advertisers 58<br />
4 <strong>EPP</strong> <strong>Europe</strong> » 11 | 2023
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