EPP Europe P2.2023
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Product Updates « PCB & ASSEMBLY<br />
On show at Productronica 2023<br />
Sustainable replacements for discontinued cleaning fluids<br />
MicroCare will exhibit its newest product innovations<br />
at Productronica 2023 and highlight its sustainable,<br />
high-performing replacements for the soon-to-be discontinued<br />
3M Novec specialty cleaning fluids.<br />
Due to emerging regulations on PFAS (per-and polyfluoroalkyl<br />
substance) manufacturing, 3M will cease<br />
manufacturing fluoropolymers, fluorinated fluids,<br />
and PFAS-based additive products by the end of<br />
2025, which includes popular Novec variants like<br />
7100, 71DE, 7200, 72DE, 72DA, and 73DE. MicroCare<br />
is stepping up to offer outstanding alternatives.<br />
These replacement fluids deliver superior performance<br />
in removing various soils encountered during<br />
manufacturing processes, including oil, grease, particulate,<br />
inks, and fingerprints while prioritizing sustainability.<br />
Among the portfolio highlights are the Tergo HDF<br />
(Heavy Duty Fluid) and Tergo GCF (General<br />
Cleaning Fluid). Both solutions have low GWP<br />
(Global Warming Potential) and zero ODP<br />
(Ozone Depleting Potential) ratings, ensuring<br />
compliance with strict environmental regulations.<br />
Additionally, their azeotropic properties<br />
make them chemically stable and nonflammable<br />
in vacuum and vapour degreasers, providing<br />
a reliable and safe cleaning process. These<br />
fluids are the perfect replacement for products<br />
under scrutiny or being discontinued.<br />
“Productronica presents an exceptional platform for<br />
us to engage directly with industry professionals, enabling<br />
us to showcase our cutting-edge cleaning<br />
fluids and tools,” said Scott Wells, General Manager.<br />
Productronica, Booth A4–101<br />
www.microcare.com<br />
Source: MicroCare<br />
Due to regulations on<br />
PFAS manufacturing, 3M<br />
will cease manufacturing<br />
fluoropolymers, fluorinated<br />
fluids, and PFASbased<br />
additive products<br />
by the end of 2025<br />
Low-temperature solder (LTS) materials<br />
Low temperature ball attachment process solutions<br />
Source: Shenmao<br />
PF734-S, built upon an<br />
improved low-temperature<br />
alloy PF734, outperforms<br />
conventional<br />
low-temperature alloys<br />
like 42% Sn and 58%<br />
Bi, says the company<br />
Shenmao America has introduced a range<br />
of low-temperature solder (LTS) materials<br />
in response to the growing demand for<br />
ultra-thin packages in the electronics industry.<br />
The company says its (LTS) materi-<br />
als are specially engineered to reduce reflow<br />
temperatures, mitigating PCB and<br />
substrate deformation, saving energy, reducing<br />
thermal stability requirements of<br />
substrates and components, and ultimately<br />
enhancing yield rates.<br />
PF734-S, built upon an improved lowtemperature<br />
alloy PF734, outperforms<br />
conventional low-temperature alloys like<br />
42 % Sn and 58 % Bi. The low-temperature<br />
flux solutions, SMF-80 and SMF-<br />
WC63, deliver excellent workability and<br />
are formulated with special activators<br />
that optimize wettability and solderability.<br />
The no-clean flux SMF-80 eliminates<br />
the need for post-reflow cleaning while<br />
maintaining high reliability and insulation<br />
with minimal flux residue. On the<br />
other hand, the water-soluble flux SMF-<br />
WC63 offers outstanding cleanability, and<br />
any flux residue left after reflow can be<br />
easily cleaned with water, ensuring exceptional<br />
surface cleanliness.<br />
www.shenmao.com<br />
Productivity. Profitability.<br />
We Connect<br />
Munich Trade Fair, November 14-17<br />
Hall B4, Booth 119<br />
<strong>EPP</strong> <strong>Europe</strong> » 11 | 2023 43
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