EPP Europe P2.2023
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Product Updates « PCB & ASSEMBLY<br />
Eliminate manual placement and orientation errors<br />
BIB loader/unloader for semiconductor industry<br />
ation and options that can meet specific<br />
requirements and applications. Featuring<br />
ergonomic control panels and userfriendly<br />
software, the system eliminates<br />
the need for manual placement and<br />
orientation, ensuring reliable, accurate operations.<br />
With its automation capabilities,<br />
the system enhances operational efficiency<br />
and reduces manufacturing defects.<br />
“Lykos represents a significant leap forward<br />
in board handling technology, offering<br />
distinct advantages over traditional<br />
manual systems,” said Josef Weinberger,<br />
Head of Business Unit, Esmo semicon.<br />
The system features fully automated open<br />
top sockets loading, flexible BIB clamping<br />
Source: Esmo Group<br />
The system features fully automated open top<br />
sockets (OTS) loading, flexible BIB clamping for<br />
different sizes, and a conversion time of less<br />
than 3 minutes, including BIB change<br />
Esmo Group (esmo) has launched Lykos, a<br />
modular Burn-in Board (BIB) loading and<br />
unloading system designed to eliminate<br />
manual placement and orientation errors.<br />
With high demand for microchips, the industry<br />
needs an efficient way to manage<br />
the volume and turnaround time during<br />
burn-in, a process to detect early failures<br />
in semiconductor devices. Manual burn-in<br />
methods — including hand placement,<br />
manual flipping, and manual stacking —<br />
are slow, error-prone, and can damage<br />
delicate wafers, ultimately leading to<br />
costly downtime and product defects.<br />
Lykos, a portable device handling system,<br />
offers users modular machine configurfor<br />
different sizes, and a conversion time of<br />
less than 3 minutes, including BIB change.<br />
www.esmo-group.com<br />
Bonding technologies for OPV and perovskite-based systems<br />
Adhesives for flexible photovoltaics<br />
Source: Panacol<br />
Adhesives are applied on barrier foil to seal the<br />
delicate OPV modules<br />
Provider of adhesives, coatings, and UV/<br />
LED curing equipment, Panacol has developed<br />
a range of multi-functional adhesives<br />
for applications in flexible photovoltaics<br />
and electronics.<br />
Organic photovoltaics (OPV) and perovskite-based<br />
systems are enabling radical<br />
new applications in consumer electronics<br />
such as indoor light harvesting to<br />
extend the battery life of wearables, and<br />
outdoor energy generation solutions<br />
which would have been impossible using<br />
conventional photovoltaics.<br />
A key contributor to these advancements<br />
is in the area of bonding technologies. In<br />
line with these changes, Panacol now<br />
offers multi-functional adhesives for applications<br />
in flexible photovoltaics. In<br />
OPV applications, these provide higher resistance<br />
to environmental stresses, improved<br />
compatibility with the PV material<br />
and good adhesion to the substrates. New<br />
conductive adhesives efficiently adhere<br />
and protect electrical connections for<br />
SMD components in flexible assemblies.<br />
www.panacol.de<br />
The answer to avoid voiding<br />
Setting up a profile with our<br />
Vapour Phase Soldering Machines is like a short flight<br />
Enter the data, “take off“ and you´ve reached the destination.<br />
Trust the world market leader. Come with us on board.<br />
We are looking forward to your visit at Productronica Hall A4, Booth 216<br />
IBL-Löttechnik GmbH Messerschmittring 61-63, D-86343 Königsbrunn Tel.: +49(0)8231/95889-0 www.ibl-tech.com<br />
<strong>EPP</strong> <strong>Europe</strong> » 11 | 2023 51