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EPP Europe P2.2023

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Product Updates « PCB & ASSEMBLY<br />

Eliminate manual placement and orientation errors<br />

BIB loader/unloader for semiconductor industry<br />

ation and options that can meet specific<br />

requirements and applications. Featuring<br />

ergonomic control panels and userfriendly<br />

software, the system eliminates<br />

the need for manual placement and<br />

orientation, ensuring reliable, accurate operations.<br />

With its automation capabilities,<br />

the system enhances operational efficiency<br />

and reduces manufacturing defects.<br />

“Lykos represents a significant leap forward<br />

in board handling technology, offering<br />

distinct advantages over traditional<br />

manual systems,” said Josef Weinberger,<br />

Head of Business Unit, Esmo semicon.<br />

The system features fully automated open<br />

top sockets loading, flexible BIB clamping<br />

Source: Esmo Group<br />

The system features fully automated open top<br />

sockets (OTS) loading, flexible BIB clamping for<br />

different sizes, and a conversion time of less<br />

than 3 minutes, including BIB change<br />

Esmo Group (esmo) has launched Lykos, a<br />

modular Burn-in Board (BIB) loading and<br />

unloading system designed to eliminate<br />

manual placement and orientation errors.<br />

With high demand for microchips, the industry<br />

needs an efficient way to manage<br />

the volume and turnaround time during<br />

burn-in, a process to detect early failures<br />

in semiconductor devices. Manual burn-in<br />

methods — including hand placement,<br />

manual flipping, and manual stacking —<br />

are slow, error-prone, and can damage<br />

delicate wafers, ultimately leading to<br />

costly downtime and product defects.<br />

Lykos, a portable device handling system,<br />

offers users modular machine configurfor<br />

different sizes, and a conversion time of<br />

less than 3 minutes, including BIB change.<br />

www.esmo-group.com<br />

Bonding technologies for OPV and perovskite-based systems<br />

Adhesives for flexible photovoltaics<br />

Source: Panacol<br />

Adhesives are applied on barrier foil to seal the<br />

delicate OPV modules<br />

Provider of adhesives, coatings, and UV/<br />

LED curing equipment, Panacol has developed<br />

a range of multi-functional adhesives<br />

for applications in flexible photovoltaics<br />

and electronics.<br />

Organic photovoltaics (OPV) and perovskite-based<br />

systems are enabling radical<br />

new applications in consumer electronics<br />

such as indoor light harvesting to<br />

extend the battery life of wearables, and<br />

outdoor energy generation solutions<br />

which would have been impossible using<br />

conventional photovoltaics.<br />

A key contributor to these advancements<br />

is in the area of bonding technologies. In<br />

line with these changes, Panacol now<br />

offers multi-functional adhesives for applications<br />

in flexible photovoltaics. In<br />

OPV applications, these provide higher resistance<br />

to environmental stresses, improved<br />

compatibility with the PV material<br />

and good adhesion to the substrates. New<br />

conductive adhesives efficiently adhere<br />

and protect electrical connections for<br />

SMD components in flexible assemblies.<br />

www.panacol.de<br />

The answer to avoid voiding<br />

Setting up a profile with our<br />

Vapour Phase Soldering Machines is like a short flight<br />

Enter the data, “take off“ and you´ve reached the destination.<br />

Trust the world market leader. Come with us on board.<br />

We are looking forward to your visit at Productronica Hall A4, Booth 216<br />

IBL-Löttechnik GmbH Messerschmittring 61-63, D-86343 Königsbrunn Tel.: +49(0)8231/95889-0 www.ibl-tech.com<br />

<strong>EPP</strong> <strong>Europe</strong> » 11 | 2023 51

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