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EPP Europe P2.2023

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Product Updates « PCB & ASSEMBLY<br />

Removal of residual solder in rework processes<br />

Kurtz Ersa introduces auto scavenger module for rework system<br />

Kurtz Ersa has unveiled the Auto Scavenger Module,<br />

an extension for the Ersa HR 600 XL rework platform.<br />

Designed to enhance the efficiency and effectiveness<br />

of non-contact removal of residual solder from circuit<br />

boards, this module represents a significant advancement<br />

in rework technology.<br />

With just three simple clicks, users can define the<br />

specific area on the assembly where residual solder<br />

needs to be removed after desoldering a component.<br />

The module then automatically identifies the required<br />

tracks and initiates the cleaning process promptly,<br />

while ensuring the board remains preheated.<br />

Featuring cleaning speeds ranging from 1 mm/s to<br />

3 mm/s, the module ensures efficient and thorough removal<br />

of residual solder from large electronic assemblies.<br />

Moreover, users have the flexibility to finetune<br />

the cleaning performance by adjusting parameters<br />

such as nitrogen temperature and track speed. Individual<br />

profiles can be saved for each assembly, enabling a<br />

customized and optimized cleaning process.<br />

The module operates with a constant base temperature<br />

for the entire assembly. The solder to be removed<br />

is heated on the board surface using an<br />

N2-fed hot gas nozzle and then extracted via a vacuum<br />

nozzle. Importantly, the automatic height control<br />

feature ensures that the assembly remains untouched<br />

physically throughout the process. Additionally,<br />

users can mark ‘keep out areas’ directly in the<br />

live image, designating specific regions where suction<br />

is not required. Once the solder removal is com-<br />

plete, the assembly is efficiently cooled down and<br />

ready for the seamless reinstallation of a component.<br />

“The introduction of the Auto Scavenger Module represents<br />

another step forward in rework technology,”<br />

said Todd DeZwarte, Director of Sales – North America,<br />

Rework & Inspection at Ersa. “We are excited to<br />

offer our customers a solution that not only enhances<br />

the cleaning performance of the HR 600 XL<br />

rework system but also provides the flexibility and<br />

precision required for diverse assembly requirements.<br />

This module enables efficient and reliable removal of<br />

residual solder, contributing to improved productivity<br />

and high-quality results.”<br />

The Auto Scavenger Module is available as an optional<br />

feature for the Ersa HR 600 XL rework system.<br />

Productronica, Booth A4.171<br />

www.kurtzersa.de<br />

Source: Kurtz Ersa<br />

Designed to enhance<br />

the efficiency and<br />

effectiveness of<br />

non-contact removal<br />

of residual solder from<br />

circuit boards, the<br />

company says this<br />

module represents<br />

a significant advancement<br />

in rework<br />

technology<br />

Visit us!<br />

Hall A4,<br />

Booth 255<br />

2023<br />

November 14-17, 2023, Messe München<br />

Scalable Vacuum Soldering System VADU modular<br />

• Easy expansion of productivity or functionality by adding modules<br />

• Effortless maintenance and operation<br />

• Well-known void-free soldering quality<br />

• Soldering with preforms and/or pastes<br />

• Flux-free soldering with formic acid<br />

• Flux management system for solder paste processes<br />

• Individual, easy and free programmable soldering profiles<br />

• Low energy and media consumption<br />

PINK GmbH Thermosysteme · Am Kessler 6 · 97877 Wertheim-Bestenheid · info@pink.de · www.pink.de<br />

<strong>EPP</strong> <strong>Europe</strong> » 11 | 2023 25

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