DS 7-7R 17-12R Semiconductor Fabrication Facilities ... - FM Global

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7-7R (11.34 kg) for one minute without permanent deformation. The valve shall withstand a static force of 100 lb (45.36 kg) for one minute applied normal to its longitudinal axis at the outermost extremity of the body. When specified, the venting port, on the outward side of the valve head set, shall be protected to prevent entry of dust, moisture, and insects before and after the valve has actuated; or a weather-cap-type indicator shall be provided, which will remain attached to the valve and provide positive indication to an observer that the valve has operated. Venting and sealing characteristics shall be as follows: 7.6 Tanks Cracking pressure: 10 psig ± 2 psig Resealing pressure: 6 psig minimum. Zero leakage from resealing pressure to –8 psig. Flow at 15 psig: 35 SCFM minimum (where SCFM is flow at cubic feet per minute corrected for air pressure of 14.7 psi and air temperature of ° 21.1C) 7.6.1 The tank shall be of sufficient strength to withstand a pressure of 7 psig without permanent distortion; and 15 psig without rupturing or affecting cabinet security as described in ANSI C57.12.28-1988. A 1-inch NPT upper plug (or cap) for filling and pressure testing shall be provided in the low voltage compartment. A 1-inch NPT drain plug (or cap) for transformers rated 75-500 kVA and 1-inch NPT drain valve with built-in sampling device for transformers rated 750- 2500 kVA shall be provided in the low-voltage compartment. Suitable means for indicating the correct liquid level at 25°C shall be provided. 2.1.6.5 Ion Implanter Loss Experience No fires have been reported in mineral oil insulated transformers in cleanrooms. However, all of the major fire loss experience in the five year period analyzed in Data Sheet 5-4 Transformers has involved mineral oil insulated transformers. During this period there were 13 fires involving mineral oil filled transformers inside buildings. In all but four incidents, damage was limited to the transformer, adjacent cable and switchgear. In four incidents damage was substantially larger than expected. One incident involved damage to the automatic sprinkler system. The loss of protection resulted in damage to switchgear and cable in this large room. In a second incident, wall and ceiling penetrations were not sealed. This resulted in fire and smoke damage to an MCC room above the transformer room. The other two incidents involved PCB contamination. The cost of cleanup of PCB contamination in an industrial facility would probably be on the order of magnitude of the cost of cleanup of heavy smoke deposits in a cleanroom. 2.1.7 Diffusion The high process temperature (1652°F–2372°F [900°C– 1300°C]) and use of process gases such as phosphine, arsine, diborane, boron trichloride in a hydrogen carrier makes diffusion one of the most hazardous processes in the manufacture of semiconductor devices. A vertical furnace used in the diffusion process is shown in Figure 24 (see Data Sheet 7-7/17-12). Numerous adverse incidents have occurred and generally business interruption was considerable since diffusion is the workhorse of the doping process. These incidents included ignition of unreacted pyrophoric and/or flammable gases, ignition of combustible vacuum pump oil residue and backstreaming of vacuum pump oil. A foreline trap or antibackstreaming device should be installed between the vacuum pump and quartz tube in all diffusion furnaces where backstreaming is thought to be possible. This device is an optically dense, wool type filter barrier reinforced with copper or stainless steel mesh. The filter will cause the oil to condense and drop back into the vacuum pump. 2.1.8 Spill Hazard REFERENCE DOCUMENT 17-12R SEMICONDUCTOR FABRICATION FACILITIES Page 12 The use of hydrofluoric, sulfuric, hydrochloric, nitric and other acids constantly presents a spill hazard potential. Certain cleanroom designs utilize a perforated raised floor and/or an open waffle slab (see Figs. 4 and 5 in Data Sheet 7-7/17-12). A spill of these acids through such open floors could contaminate the cleanroom via the recirculating air system or cause corrosion damage to equipment below. In addition, a spill of flammable liquids through open floors could result in a flammable liquids fire below the floor. ©2003 Factory Mutual Insurance Company. All rights reserved.
2.2 Fire Hazards of Wet Benches Wet benches (see Figs. 17 and 18 in Data Sheet 7-7/17-12) are used in the semiconductor industry for the fabrication of integrated circuits. Due to exposure to atmospheres which corrode metal, wet benches are typically constructed from plastic material; polypropylene (PP) or fire-retardant polypropylene (FRPP) have been commonly used in the United States. Polyvinylchloride (PVC) is commonly used in Japan and is increasingly being used in facilities operated by Japanese companies in the United States. Wet benches also contain a considerable amount of electrical equipment which represent a potential ignition source. Over the past 10 years, 40 wet bench fires have been reported to FM Global. 2.2.1 Fire Tests Conducted by FM Approvals on Wet Benches REFERENCE DOCUMENT 7-7R SEMICONDUCTOR FABRICATION FACILITIES 17-12R Page 13 FM Approvals has conducted extensive fire testing on plastic wet benches to evaluate fire propagation and fire suppression. For these tests, 8 ft (2.4 m) long, open face-style wet benches were used. The first of these tests was a free burn test conducted under the FM Approvals fire products collector. The objective of these tests was to evaluate fire propagation within a bench constructed of polypropylene once ignition had been established in the bench. This test showed that fire developed rapidly after an incubation time of approximately 10 minutes. Peak heat release rate exceeded 10 MW and the entire bench was consumed during the test. Figure 2 shows the bench at peak fire involvement. Fig. 2. Wet bench free burn test. Fire suppression tests were conducted on wet benches placed in a mockup cleanroom facility constructed at FM Global Research. In this facility, typical cleanroom ventilation and wet bench exhaust systems were installed, so that typical air velocities and flow rates could be maintained in both the room and wet bench. All fire suppression tests were conducted with the room ventilation system and wet bench exhaust system in full operation. Three different fire suppression systems were tested: fine water spray (FWS), carbon dioxide (CO 2), and FM-200. These suppression systems were tested with fires of different sizes placed at the bench working surface and subsurface areas. Fire tests were also conducted with FWS in unventilated ©2003 Factory Mutual Insurance Company. All rights reserved.
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Page 3 and 4: 1.0 SCOPE This reference data sheet
Page 5 and 6: REFERENCE DOCUMENT 7-7R SEMICONDUCT
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Page 9 and 10: 3 SiH4 Silane 3 SiH2Cl2 Dichlorosil
Page 11: for dielectric and dissolved gas in
Page 15 and 16: FM Global Research does not limit v
Page 21 and 22: The final step in wafer form of int
Page 25 and 26: 3.3.1 Chemical Mechanical Polish Ch
Page 27 and 28: Chill Water Supply/Return Heating W
Page 29 and 30: Typically, these codes have separat
Page 31 and 32: Conformance can be demonstrated by
Page 33 and 34: 5.0 SEMICONDUCTOR TERMINOLOGY Align
Page 35 and 36: Junction—The interface at which t
Page 37 and 38: Soft Baking—A heating process use

DS 7-7R 17-12R Semiconductor Fabrication Facilities ... - FM Global

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