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DS 7-7R 17-12R Semiconductor Fabrication Facilities ... - FM Global

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7-<strong>7R</strong><br />

Mini-environment enclosures will most always create shielded areas which are not adequately protected by<br />

cleanroom sprinkler systems. The protection guidelines developed by <strong>FM</strong> <strong>Global</strong> for specific tools and equipment<br />

address the need to provide internal protection to mitigate the shielding problem when a minienvironment<br />

enclosure is provided around that tool.<br />

3.3.5 Vacuum Pumps<br />

Data Sheet 7-7 recommends that a foreline trap be installed to prevent oil backstreaming and damage to<br />

the furnace. Backstreaming can occur as a furnace tube or reactor chamber cools and pressure drops in the<br />

tube relative to pressure at the vacuum pump. This can allow oil mist from the vacuum pump to be drawn<br />

back into the furnace or reactor if the mechanical pump vanes can turn backwards.<br />

Mechanical pumps typically have a ratchet or other mechanism that prevents the pump from turning backwards.<br />

If, during a pump maintenance teardown and rebuild, the ratchet is inadvertently omitted during reassembly,<br />

then the pump could turn backwards, causing a potential problem. Diffusion pumps are also<br />

susceptible to backstreaming but are not usually directly connected to a furnace tube. The use of a dry type<br />

vacuum pump or one lubricated with an inert fluid eliminates the fire exposure.<br />

3.4 Bulk Chemical Distribution<br />

A chemical delivery system filters, blends and transports chemicals through tubing/piping to the point-ofuse<br />

where controllers regulate the flow rate and pressure of delivery. This system includes the means to pressurize<br />

a chemical and control its distribution throughout the fab. It consists of a source of chemical, or storage<br />

vessel, a chemical delivery module and a piping system.<br />

Fluoropolymer tubing and components are typically used for acidic and caustic chemicals.<br />

The most common method of liquid transfer is by local distribution systems which are generally located in<br />

the service chases close to the equipment they serve. A liquid source supply and piping connected directly<br />

to the process equipment is provided. Liquids are manually delivered to these systems.<br />

Bulk chemical distribution systems represent a greater exposure than local distribution systems due to long<br />

runs of pressurized distribution piping which results in a much larger liquid release scenario.<br />

3.5 Liquid Damage Exposures<br />

The most common causes of liquid release from distribution systems include items such as component failure<br />

on distribution piping, corrosion of fittings, and physical damage caused by personnel. When a liquid<br />

is released from its distribution system, contaminants can be quickly picked up by the cleanroom air handling<br />

system and distributed throughout the cleanroom space served by the air handling system. Depending on<br />

the type and amount of the liquid released, contamination of the cleanroom space, in-process product and<br />

process equipment is probable.<br />

The spread of airborne contaminants can be minimized following a spill by shutdown of the recirculating air<br />

system, operation of the smoke/contaminant control system and proper action by the Emergency<br />

Organization.<br />

Hydrochloric Acid (HCL)<br />

Sulfuric Acid (H 2SO 4)<br />

Nitric Acid (HNO 2)<br />

Hydrofluoric Acid (HF)<br />

Phosphoric Acid (H 3PO 4)<br />

Acetic Acid (CH 3COOH)<br />

Chromic Phosphoric Acid (CrPO 4)<br />

Hydrogen Peroxide (H 2O 2)<br />

Sodium Hydroxide (NaOH)<br />

Potassium Hydroxide (KOH)<br />

Ammonium Hydroxide (NH 4OH)<br />

REFERENCE DOCUMENT<br />

<strong>17</strong>-<strong>12R</strong> SEMICONDUCTOR FABRICATION FACILITIES<br />

Page 26<br />

Table 7. Common Nonflammable <strong>Semiconductor</strong> Process Liquids<br />

©2003 Factory Mutual Insurance Company. All rights reserved.

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