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Semiconductor Economics 101 Cost – the prime drive for technology Manufacturing cost/transistor falls rapidly higher performance/cost ratio Complexity increasing with each technology advancement Test cost falls slowly Increasing test cost contribution to overall cost Tester time extremely valuable Important to find defective chip early in test cycle or manufacturing flow
Basic Testing Methodology Input 1 0 1 1 0 1 0 1 Apply inputs to excite the defect 1 0 defect (Fault-free) Output 1 1 1 0 1 0 1 0 and propagate its effect to the output (Faulty) Output 1 0 1 0 1 0 0 0 Defect detected only if output different from fault-free output
Page 1 and 2: “Research is to see what everyone
Page 3 and 4: Outline Introduction Problem Defi
Page 5: Smaller Needle, Bigger Haystack ©
Page 9 and 10: IC Testing Methods Functional test
Page 11 and 12: Leakage Current (I DDQ) Test Prima
Page 13 and 14: Defect Types Active (pattern-depen
Page 15 and 16: Conventional I DDQ Testing Single
Page 17 and 18: ITRS Projections for I DDQ Year Gat
Page 19 and 20: I DDQ and Defect Severity Frequency
Page 21 and 22: I DDQ Only a Part of the Puzzle Inc
Page 23 and 24: Why Use Outlier Detection? Continu
Page 25 and 26: Outlier Identification Methods Rel
Page 27 and 28: Frequency No Silver Bullet 180 160
Page 29 and 30: Approach 1: Reducing Fault-free I D
Page 31 and 32: Die 1 I DDQ Variation Level 2 Level
Page 33 and 34: Die 1 and Die 2 I DDQ Variation Die
Page 35 and 36: Four Dice From a Wafer Difficult to
Page 37 and 38: Current Signature [Gattiker,Maly]
Page 39 and 40: Differential/Delta I DDQ [Thibeault
Page 41 and 42: Current Ratios [Maxwell et al.] CR
Page 43 and 44: Threshold Selection Challenge Max I
Page 45 and 46: Motivation: Spatial Correlation Si
Page 47 and 48: Local Neighborhood Definition Cente
Page 49 and 50: Correlation Methods Spatial/plane
Page 51 and 52: Neighbor Current Ratios (NCR) Two
Page 53 and 54: Max NCR Max NCR CR/NCR Insights 100
Page 55 and 56: Immediate Neighbor Difference I DDQ
Page 57 and 58:
I DDQ & Flush Delay Correlation Flu
Page 59 and 60:
Research Plan - I Extensive analys
Page 61 and 62:
Research Contributions Systematic
Page 63 and 64:
Summary Defect-based VLSI testing
Page 65 and 66:
Backup Slides
Page 67 and 68:
I/P Pattern Independent Defect O/P
Page 69 and 70:
Process Variation Levels Frequency
Page 71 and 72:
Technology Impact on Testing Reduc
Page 73 and 74:
Scaling Implications on IOFF I OFF
Page 75 and 76:
Non-uniform Scaling Trends Source :
Page 77 and 78:
“All Pass” Chips I DDQ Variatio
Page 79 and 80:
Leakage Current Components Input =
Page 81 and 82:
Major I DDQ Components I D (Log sca
Page 83 and 84:
Two Signature Types IDDQ (uA) 54.5
Page 85 and 86:
Handling Defect Clustering Scratch
Page 87 and 88:
Why I DDQ Correlates to Delay? Sma
Page 89 and 90:
All Tests Are Needed Distribution o
Page 91 and 92:
Fewer Vectors,Higher Coverage Fault
Page 93 and 94:
Wafer-level Analysis: Advantages D
Page 95 and 96:
Delta I DDQ Illustration First meas
Page 97 and 98:
Technology Trends
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