confidential - EUFANET

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$Low frequency noise $1/f and RTS$ in submicron MOSFETs - Free$

B : LASER/Plasma Ablation • Decrease of power LASER • Increase of power PLASMA • The hard coating is removed
CONFIDENTIAL C : Plasma O2/CF4 • Removing of organic material with O2/CF4 plasma or pure O2 • Approximately 15mn
Page 1 and 2: LASER Chip Access in 3D ICs … …
Page 3 and 4: Why open a component? § Now, you h
Page 5 and 6: AGENDA -Why open a component? - - 4
Page 7 and 8: Papers about these techniques • E
Page 9 and 10: ACID § § § § § Drop technique
Page 11 and 12: Temperature … 255°C 85°C 75°C
Page 13 and 14: AGENDA - - - Why open a component?
Page 15 and 16: PICTURE SUPERIMPOSITION jpeg PICTUR
Page 19: A : LASER Ablation • STEP 1 : Pla
Page 23 and 24: Step C & D repeats Plasma for 15mn
Page 27 and 28: Mechanical : Milling … a 3D dream
Page 29 and 30: AGENDA - - Why open a component? 4
Page 31 and 32: LASER / Acid … Goal: Reach both d
Page 33 and 34: LASER / Plasma / Acid … LASER dec
Page 35: AGENDA - Questions … Please help

confidential - EUFANET

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