confidential - EUFANET

More documents

Recommendations

Info

$Low frequency noise $1/f and RTS$ in submicron MOSFETs - Free$

CHIP ACCESS 4 MAIN WAYS AND ONE MORE ⬆ SESAME ACID ACIDS LASER ⬆ SESAME LASER ⬇FRONT SIDE ⬆BACK SIDE ⬆ ASAP-1 UC ⬆ ULTRAPOL-ADV ⬆ SESAME PLASER ⬆ CAN OPENER MECHANICAL PLASMA ⬆ DIP OPENER ⬆ MICRO ABRASIVE BLASTING ⬆ SESAME PLASMA
Papers about these techniques • EPTC 2006 • ANADEF 2006 • ESREF 2007 • ANADEF 2008 • ESREF 2008 • ISTFA 2008 • ANADEF 2010 • IPFA 2010 • ESREF 2011 • ISTFA 2011 • EPTC 2011 …
Page 1 and 2: LASER Chip Access in 3D ICs … …
Page 3 and 4: Why open a component? § Now, you h
Page 5: AGENDA -Why open a component? - - 4
Page 9 and 10: ACID § § § § § Drop technique
Page 11 and 12: Temperature … 255°C 85°C 75°C
Page 13 and 14: AGENDA - - - Why open a component?
Page 15 and 16: PICTURE SUPERIMPOSITION jpeg PICTUR
Page 19 and 20: A : LASER Ablation • STEP 1 : Pla
Page 21 and 22: CONFIDENTIAL C : Plasma O2/CF4 •
Page 23 and 24: Step C & D repeats Plasma for 15mn
Page 27 and 28: Mechanical : Milling … a 3D dream
Page 29 and 30: AGENDA - - Why open a component? 4
Page 31 and 32: LASER / Acid … Goal: Reach both d
Page 33 and 34: LASER / Plasma / Acid … LASER dec
Page 35: AGENDA - Questions … Please help

confidential - EUFANET

Create successful ePaper yourself

Delete template?

Save as template?