confidential - EUFANET

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LASER / Acid … Goal: Balls and stitch access without revealing all top die surface. Methodology: 1. EMC removal from the side with LASER. 2. Acid final touch to reveal balls and stitch. Benefits: Top die were nearly not revealed. LASER preparation allowed an accurate positioning of the chemical etch.
LASER / Plasma / Acid … LASER decapsulation: Plastic ablation down to passive die backside (Si). Wet chemical (HNO3) underfill etching down to active die. Plasma etching (Ar then SF6): Silicon etching down to passive die backside. Wet & dry etching, down to underfill. Xrays analysis, zoom on active die: No visible damage on 1st and 2nd interconnects.
Page 1 and 2: LASER Chip Access in 3D ICs … …
Page 3 and 4: Why open a component? § Now, you h
Page 5 and 6: AGENDA -Why open a component? - - 4
Page 7 and 8: Papers about these techniques • E
Page 9 and 10: ACID § § § § § Drop technique
Page 11 and 12: Temperature … 255°C 85°C 75°C
Page 13 and 14: AGENDA - - - Why open a component?
Page 15 and 16: PICTURE SUPERIMPOSITION jpeg PICTUR
Page 19 and 20: A : LASER Ablation • STEP 1 : Pla
Page 21 and 22: CONFIDENTIAL C : Plasma O2/CF4 •
Page 23 and 24: Step C & D repeats Plasma for 15mn
Page 27 and 28: Mechanical : Milling … a 3D dream
Page 29 and 30: AGENDA - - Why open a component? 4
Page 31: LASER / Acid … Goal: Reach both d
Page 35: AGENDA - Questions … Please help

confidential - EUFANET

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