susref - Construction IT research at VTT
susref - Construction IT research at VTT
susref - Construction IT research at VTT
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SUSREF<br />
Sustainable Refurbishment of Building<br />
Facades and External Walls<br />
7th framework programme<br />
Theme Environment (including clim<strong>at</strong>e change)<br />
Small or medium scale <strong>research</strong> project<br />
Grant Agreement no. 226858<br />
D<strong>at</strong>e:2012-4-30<br />
Version: Final<br />
1 (57)<br />
Deliverable:<br />
D4.2 - General refurbishment concepts<br />
Introduction, Background, Description of refurbishment concepts and Aspects of<br />
assessment<br />
Authors: Antti Ruuska, Sirje Vares, Tarja Häkkinen<br />
List of contents:<br />
1. Introduction ........................................................................................................................... 1<br />
2. Objectives ............................................................................................................................. 2<br />
3. Background - refurbishment technologies - liter<strong>at</strong>ure review ................................................. 5<br />
3.1 Introduction .................................................................................................................... 5<br />
3.2 Classific<strong>at</strong>ion of refurbishment technologies .................................................................. 5<br />
3.2.1 Role of insul<strong>at</strong>ion m<strong>at</strong>erials ........................................................................................ 6<br />
3.3 Technologies for replacing existing walls ....................................................................... 8<br />
3.4 Technologies for applying external thermal insul<strong>at</strong>ion layers ......................................... 8<br />
3.4.1 Thermal bridges in external thermal insul<strong>at</strong>ion ........................................................... 8<br />
3.4.2 Air tightness in external thermal insul<strong>at</strong>ion ................................................................. 9<br />
3.4.3 Different concepts for applying external thermal insul<strong>at</strong>ion layers ............................ 10<br />
3.4.3.1 External thermal insul<strong>at</strong>ion composite systems (ETICS) .................................. 10<br />
3.4.3.2 Ventil<strong>at</strong>ed façades............................................................................................ 11<br />
3.4.3.3 External thermal insul<strong>at</strong>ion panel systems ....................................................... 12<br />
3.4.3.4 Insul<strong>at</strong>ing plasters ............................................................................................ 13<br />
3.5 Internal thermal insul<strong>at</strong>ion of the envelope ................................................................... 15<br />
3.5.1 Risk of condens<strong>at</strong>ion................................................................................................ 15<br />
3.5.2 Thermal bridges and air tightness in internal thermal insul<strong>at</strong>ion ............................... 15<br />
3.5.3 Different concepts for applying internal thermal insul<strong>at</strong>ion ....................................... 16<br />
3.5.3.1 Plasterdboard lamin<strong>at</strong>es................................................................................... 17<br />
3.5.3.2 Insul<strong>at</strong>ion boards covered with plasterboard .................................................... 17<br />
3.5.3.3 Insul<strong>at</strong>ion boards fixed to wall and plastered directly ........................................ 18<br />
3.5.3.4 Insul<strong>at</strong>ion fixed to a freestanding studwork ....................................................... 18<br />
3.6 Cavity insul<strong>at</strong>ion .......................................................................................................... 19<br />
3.6.1 Thermal bridges and humidity .................................................................................. 20<br />
3.6.2 Insul<strong>at</strong>ing with bulk m<strong>at</strong>erial ..................................................................................... 21