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OVERVIEW OF PROFESSIONAL DEVELOPMENT COURSE Monday, August 8, 2011 Venue Time Topic Speaker Room 1 Room 2 08:30--12:30 PDC-1 Signal Integrity and Power Integrity Design for Advanced Electronic Packaging 12:30--13:30 Lunch 13:30--17:30 PDC-2 Thermo-mechanical Modeling & Simulation of Electronics Packaging & Its Applications PDC-3 Achieving High Reliability of Lead-free 8:30--12:30 Soldering and Flip Chip 3D/TSV Packaging & Materials Consideration 12:30--13:30 Lunch 13:30--17:30 PDC-4 Wafer Level Package – Design for Reliability & Advanced Failure Analysis Prof. Bill CHEN Tsinghua University, China Dr. Jiangqi HE Intel,USA Dr. Yong LIU Fairchild, USA Prof. Sheng LIU HUST, China Dr. Ningcheng LEE Indium,USA Dr. Tim CHEN Darbond, China Dr. Tong Yan TEE Nepes, Singapore Mr. Ming XUE Infineon, Singapore Introduction of PDC Lecturers Prof. Bill CHEN Tsinghua University, China Dr. Bill Chen is a professor and the head of Department of Information Technology of Yangtze Delta Region Institute of Tsinghua University, Zhejiang. He received his BS and MS degrees from Tsinghua University, China, in 1990 and 1993 respectively, and his PhD from Texas A&M University, USA in 1996. Recently, He was a senior manager with Cisco systems Inc, worked on high performance datacenter networking product design. Previously he was an engineering manager at Andiamo Systems, Inc.. Before that, he worked for Raza Foundries, Inc., Nplab, Inc. and Texas Instruments, Inc.. His main research interests include high performance networking system architectures, high performance low power ASIC technologies, high speed system signal integrity and power integrity design methodologies. Dr. Jiangqi HE Intel, USA Dr. Jiangqi He is a senior staff engineer of Enterprise Platform Technology Development Division, Intel. He obtained his BS from Xiamen University and PhD from Duke University, in 1992 and 2000 respectively. After that, Dr. He has been worked on packaging technology, power integrity, signal integrity and system level electrical design for more than 10 years at Intel. He has been an active liaison working with multiple universities such as Georgia Tech, University of Arizona, University of Washington and ASU on researches for electrical packaging and system through SRC funding. Dr. He has published more than 40 papers and holds more than 45 patents. He is an IEEE senior member and his current interests are on efficient power delivery technology for high performance computing, on-die & on package power integrity and high frequency power noise versus signaling. 10
Dr. Yong LIU Fairchild, USA Dr. Yong Liu is a Senior Member Technical Staff of Fairchild Semiconductor Corp in South Portland, USA. He is also a Fairchild global team leader of electrical, thermal-mechanical modeling and analysis. His main interest area is advanced IC packaging, modeling and simulation, reliability and assembly process. He has been invited to give keynotes talks and presentations at international conferences Eurosime, ICEPT-HDP, EPTC and universities in US, Europe and China. He has co-authored over 140 papers and filed over 40 US patents. Dr. Liu obtained his BS, MS and PhD degrees in Nanjing University of Science and Technology in 1983, 1987 and 1990 respectively. After that, Dr. Liu studied and worked at different organizations including Zhejiang University of Technology, China in 1994, Tech University of Braunschweig, Germany in 1995, University of Cambridge, England in 1997, and Rensselaer Polytechnic Institute, USA in 1998 and Nortel Networks, USA in 2000. Since he joined Fairchild in 2001, he was awarded the first Fairchild President Award in 2008, Fairchild Key Technologist in 2006 and 2009, Fairchild BIQ award in product innovation in 2005, and Fairchild award for power of pen first place in 2004. Dr. Liu is currently an IEEE Senior member and has been actively in technical committees of IEEE ECTC, EuroSime, ESREF, ESTC, EPTC and ICEPT. Prof. Sheng LIU HUST, China Prof. Sheng Liu is a Changjiang scholar professor of Mechanical Engineering at Huazhong University of Science and Technology, China. He once was a tenured faculty at Wayne State University, USA. He has over 18 years experience in LED/MEMS/IC packaging. He once won prestigious White House/NSF Presidential Faculty Fellow Award in 1995, ASME Young Engineer Award in 1996, NSFC Overseas Young Scientist Award in 1999, IEEE CPMT Exceptional Technical Achievement Award in 2009, and Chinese Electronic Manufacturing and Packaging Technology Society Special Achievement Award in 2009. He has been an associate editor of IEEE Transaction on Electronic Packaging Manufacturing since 1999 and an associate editor of Journal of Frontiers of Optoelectronics in China since 2007. He is currently one of 11 National Committee Members in LED under Ministry of Science and Technology of China from 2006-2011. He obtained his PhD from Stanford University in 1992, his MS and BS degrees from Nanjing University of Aeronautics and Astronautics in 1986 and 1983 respectively. He is ASME Fellow. He has filed and owed more than 100 patents in China and USA, and has published more than 400 technical papers, has given more than 100 keynotes and invited talks, edited more than 9 proceedings in English for ASME and IEEE. Dr. Ningcheng LEE Indium, USA Dr. Ning-Cheng Lee is the Vice President of Technology of Indium Corporation. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 20 years of experience in the development of fluxes and solder materials for SMT industries. He received his PhD from University of Akron in 1981, and a BS from National Taiwan University in 1973. Dr. Lee is the author of “Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies”, and co-author of “Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials”. He received 1991 award from SMT Magazine and 1993 and 2001 awards from SMTA for best proceedings papers of SMI and SMTA international conferences, and 2008 award from IPC for Honorable Mention Paper: USA Award of APEX conference. He was honored as 2002 SMTA Member of Distinction, and received 2003 Lead-free Co-Operation Award from Soldertec, and received 2006 Exceptional Technical Achievement Award from CPMT. He serves on the SMTA board of directors. Dr. Tim CHEN Darbond, China Dr. Tim Chen is currently the general manager of Darbond Electronic Materials, China. He is elected as a “Thousand Talents Plan” distinguished scholar by China central government, as well as a “Taishan Scholar” overseas distinguished scholar by Shandong provincial government in 2010. He was the Global Business Director of Packaging for Honeywell Electronic Materials. Prior to joining Honeywell, Dr. Chen worked at Henkel Corp in Asia as the Greater China General Manager for Electronic material business. Prior to Henkel, he had 15 years work experience in the US and held positions at Intel, BP AMOCO Polymers. Dr. Chen received his PhD from University of Nebraska-Lincoln. He had a Post-Doctor Research Associate experience with Professor Alex Jen, he has been working on electronics materials, opto-electronic materials and electronic packaging areas for 20 years. He has more than 50 scientific and technical publications in electronic materials, processes, and applications, especially in semiconductor area and holds more than 40 US patents in the field. 11
Page 3 and 4: CONTENTS WELCOME FROM THE GENERAL C
Page 5 and 6: WELCOME FROM THE GENERAL CHAIR Star
Page 7 and 8: CONFERENCE CHAIRS( 大会主席
Page 9 and 10: Chiar for PDC & Forum Wenhui ZHU Se
Page 11 and 12: Prof. Yuming WANG Dr. Jianhua WU Dr
Page 13: OVERVIEW OF CONFERENCE PROGRAM( 会
Page 17 and 18: Introduction of TSV Forum Speakers
Page 19 and 20: Prof. C.P. WONG GT, USA Prof. C.P.
Page 21 and 22: Dr. Thorsten MATTHIAS EV Group, Aus
Page 23 and 24: Engineering at The University of To
Page 25 and 26: Chairs 08:00--09:20 OVERVIEW OF ORA
Page 27 and 28: ORAL SESSIONS Note: Only the contac
Page 29 and 30: Electromigration Behavior in In-sit
Page 31 and 32: Nepes, Singapore Session14: Advance
Page 33 and 34: University of Maryland, USA F-052 1
Page 35 and 36: Ziyang Wu, Chuanguo Dou, Yanhong Wu
Page 37 and 38: POSTER SESSION 1 Note: Only the con
Page 39 and 40: Model Zhao Wang 1 , Heming Zhao, We
Page 41 and 42: soldering reaction L. Y. Gu, L. Qu,
Page 43 and 44: Area 1 (Session G): Solid State Lig
Page 45 and 46: Area 5 (Session F): Quality & Relia
Page 47 and 48: 会议结束时间 :8 月 11
Page 49 and 50: TRANSPORTATION MAP 45

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