Content

soldering reaction
L. Y. Gu, L. Qu, H. T. Ma 1
Dalian University of Technology, China
B-050
Effect of Electromigration on Creep Rupture Life of
Sn-Ag-Cu Solder Joints
H. Y. Liu, Q. S. Zhu 1 , Z. G. Wang, J. K. Shang
Institute of Metal Research, Chinese Academy of
Sciences, China
B-051
Thermal and Dielectric Properties of Bismaleimide-
Triazine resin/Boron Nitride Composite
Xiaoliang Zeng, Shuhui Yu 1 , Rong Sun, Ruxu Du
Shenzhen Institutes of Advanced Technology, Chinese
Academy of Sciences, China
B-052
Carboxyl-Terminated Polyesterimide/Epoxy Resin
System: Preparation and Thermomechanical Properties
Dayong Gui 1 , XinMiao, Jingfeng Hao, Wentao Zeng,
Jianhong Liu
Shenzhen University, China
B-053
Analysis of Cu6Sn5 grain orientations in Sn3.0Ag0.5Cu
lead-free solder joints
Lina Niu, Yanhong Tian 1 , Chunqing Wang
Harbin Institute of Technology, China
B-054
Dielectric properties of BaTiO3 -based mu ltilayered thin
films for capacitors prepared by sol-gel technique
Bin Li 1 , Chunqing Wang, Wei Zhang, Ying Zhong, Weiwei
Wu
Harbin Institute of Technology, China
Area 3 (Session C): Packaging Design &
Modeling
C-027
Morphology and nano-indentation properties of
intermetallic compounds in solder joints
ZHONG Weixu, QIN Fei 1 , AN Tong
Beijing University of Technology, China
C-028
3D Modeling and Simulation of Heat Transfer for
Internal Channel Cooling of 3D-Chip Stacks
Jing Zhang 1 ,Guidotti.Daniel, Xueping Guo, Jing Zhou,
Liqiang Cao, Daquan Yu, Lixiwan
Institute of Microelectronics, Chinese Academy of
Sciences, China
C-029
Modeling and Finite-Element Full-wave Simulation of
Glass Interposer with TGVs (Through-Glass-Vias) for 3D
packaging
Zhang jing 1 , Sun xiaofeng, Yu daquan, Cao liqiang, Wan
lixi
Institute of Microelectronics, Chinese Academy of
Sciences, China
C-030
Ultra-Wideband Noise Isolation on Power Distribution
Network of High-speed Package Substrate
Baoxia Li 1 and Lixi Wan
Institute of Microelectronics, Chinese Academy of
37
Sciences, China
C-031
A novel cooling structure for electronic package
Jun Li 1 , Xueping Guo, Jing Zhang, Liqiang Cao, Lixi Wan
Institute of Microelectronics, Chinese Academy of
Sciences, China
C-033
Power Integrity Simulation for Multilayer Power
Distribution Networks Based on GTLE and Via Model
Yunyan Zhou 1 , Lixi Wan, Shuhua Liu, Liqiang Cao, Jia jia
Institute of Microelectronics, Chinese Academy of
Sciences, China
C-037
Geometric optimization of Carbon nanotubes(CNTs)
microchannel with liquid flow
Wang Dianxiao 1 , Wang Xiaojing, Wang Jia, Li Zongshuo
Shanghai University, China
C-038
Current optimization of different chips for High Power
Light-emitting diodes
Liang Yang, Sheng Liu 1 , Run Chen, Zhicheng Lv
Huazhong University of Science & Technology, China
C-040
Effects of Package Type, Die Size, Material and
Interconnection on the Junction-to-Case Thermal
Resistance of Power MOSFET Packages
Cong Yue 1 , Jun Lu, Xiaotian Zhang, Yueh-Se Ho
Agape Package Manufacturing Ltd., China
C-041
Modeling and Design of Coplanar Structure in QFP80
Package for RFIC Applications
Sun haiyan 1 , Wu jianhui
Southeast University, China
C-044
Thermal Stress Simulation of PBGA under Natural
Convection Using A Fluid-solid Coupling Method
Zhimin Wan, Ling Xu, Xiaobing Luo 1 , Sheng Liu
Huazhong University of Science & Technology, China
C-046
Low Electromagnetic Interference Optoelectronic
Packaging of a 40Gbps Optical Transceiver
WAN Lixi 1 , LI Zhihua, LI Baoxia, LIU Fengman, LI Jun,
SONG Jian, XIANG Haifei & ZHONG Hanmei
Institute of Microelectronics, Chinese Academy of
Sciences, China
Area 4 (Session E): Advanced Manufacturing
Technologies & Packaging Equipment
E-002
Development of a three-dimensional integrated solder
ball bumping & bonding method for MEMS devices
Lei Yang 1 , Wei Liu, Chunqing Wang, Yanhong Tian
Harbin Institute of Technology, China
E-004
Technology of Embedded Capacitance And Resistance
Hu Shaohua 1
Shennan Circuit Co., China
E-005
An Experimental Investigation on Thermal Contact
Resistance Across Metal Contact Interfaces
Xiaobing Luo 1 , Han Feng, Jv Liu, Minglu Liu and Sheng