Content

More documents

Recommendations

Info

Yifan GUO Jie XUE Kuoning CHIANG Ephraim SUHIR Moowhan SHIN R&D Director, Skyworks, USA Director, Cisco Systems Inc., USA Prof. of National Tsinghua University, Taiwan, China Prof. of University of California, USA Prof. of Myongji University, Republic of Korea Xicheng WEI Qing LI SECRETARY GENERAL( 大会秘书长 ) Prof. of Shanghai University, China EMPT, CIE, China ORGANIZING COMMITTEE( 组织委员会 ) Chair Jianhua ZHANG Shanghai University, China Co-chairs Xiang WU CETC, China Lixi WAN Institute of Microelectronics, CAS, China Bill LI JCAP, China Ming LI Shanghai JiaoTong University, China Chunqing WANG Harbin Institute of Technology, China Yiping WU Huazhong University of Science & Technology, China James CAI Tsinghua University, China Fei XIAO Fudan University, China Xingsheng LIU Xi’an Institute of Optics & Precision Mechanics,China Tim CHEN YanTai Darbond Electronics Materials Co., Ltd, China Hao TANG Nantong Fujitsu Microelectronics Co., Ltd, China Secretary Xingzao HUANG Beijing Faith Consulting Co., Ltd, China Gang HUANG Beijing Faith Consulting Co., Ltd, China Zhen LI EMPT, CIE, China Yan ZHANG Shanghai University, China TECHNICAL COMMITTEE( 技术委员会 ) Chair Dr. Daniel SHI R&D Director, ASTRI, Hong Kong, China Co-chairs Prof. Jianhua ZHANG Shanghai University, China Dr. Andy TSENG ASE, USA Prof. Chris BAILEY University of Greenwich, UK Mr. T. ONISHI GJ Tech, HK, China Dr. TongYan TEE Deputy R&D Director, Nepes, Singapore Prof. Sheng LIU Huazhong University of Science & Technology, China Dr. Chiming LAI JCAP, China 4
Chiar for PDC & Forum Wenhui ZHU Secretary Jinsong ZHANG Ms. Tina YANG Xiuzheng LU Yang LIN CTO, TSHT, China Shanghai University, China ASTRI, Hong Kong, China Shanghai University, China Shanghai University, China Session 1 -- Advanced Packaging & System Integration Chairs Dr. Lixi WAN Dr. Bing DANG Members Prof. Yufeng JIN Prof. GS KIM Dr. Yishao LAI Dr. Shan LEI Prof. Gang DONG Dr. Wei LIN Dr. Charlie LU Dr. Klaus PRESSEL Dr. Ivan SHAM Dr. Cheng YANG Dr. Charlie ZHAI Dr. Herb HUANG Dr. Daniel YU Dr. Robert LO Dr. Yann GUILLOU Dr. Boping WU IMECAS, China IBM, USA Peking University, China Kangnam University, Republic of Korea ASE, Taiwan, China IBM, USA Xidian University, China Amkor, USA Altera, Taiwan,, China Infineon, Germany ASTRI, Hong Kong, China Intel, China Nvidia, USA SMIC, China WLCSP, China ITRI, Taiwan, China ST, France Intel, USA Session 2 -- Packaging Materials & Processes Chairs Prof. Ming LI Dr. Jerry LU Members Dr. Kejun ZENG Dr. Daniel LU Prof. Liangliang LI Dr. Xinyu DU Prof. Zhong CHEN Prof. Guoyuan LI Prof. Guangbin DOU Prof. Jeng-Gong DUH Prof. Anmin HU Prof. Changqing LIU 5 Shanghai Jiaotong University, China Intel, USA TI, USA Henkel, China Tsinghua University, China Henkel, USA Nanyang Technological University, Singapore South China University of Technology, China Imperial College of London, UK Tsinghua University, Tai Wan, China Shanghai Jiaotong University, China Loughborough University, UK
Page 3 and 4: CONTENTS WELCOME FROM THE GENERAL C
Page 5 and 6: WELCOME FROM THE GENERAL CHAIR Star
Page 7: CONFERENCE CHAIRS( 大会主席
Page 11 and 12: Prof. Yuming WANG Dr. Jianhua WU Dr
Page 13 and 14: OVERVIEW OF CONFERENCE PROGRAM( 会
Page 15 and 16: Dr. Yong LIU Fairchild, USA Dr. Yon
Page 17 and 18: Introduction of TSV Forum Speakers
Page 19 and 20: Prof. C.P. WONG GT, USA Prof. C.P.
Page 21 and 22: Dr. Thorsten MATTHIAS EV Group, Aus
Page 23 and 24: Engineering at The University of To
Page 25 and 26: Chairs 08:00--09:20 OVERVIEW OF ORA
Page 27 and 28: ORAL SESSIONS Note: Only the contac
Page 29 and 30: Electromigration Behavior in In-sit
Page 31 and 32: Nepes, Singapore Session14: Advance
Page 33 and 34: University of Maryland, USA F-052 1
Page 35 and 36: Ziyang Wu, Chuanguo Dou, Yanhong Wu
Page 37 and 38: POSTER SESSION 1 Note: Only the con
Page 39 and 40: Model Zhao Wang 1 , Heming Zhao, We
Page 41 and 42: soldering reaction L. Y. Gu, L. Qu,
Page 43 and 44: Area 1 (Session G): Solid State Lig
Page 45 and 46: Area 5 (Session F): Quality & Relia
Page 47 and 48: 会议结束时间 :8 月 11
Page 49 and 50: TRANSPORTATION MAP 45

Content

Create successful ePaper yourself

Delete template?

Save as template?