Content

F-053 8:00–8:20
Thermomigration in Lead-Free Solder Joints at low
Ambient Temperature
Lan Ding, Yuan Tao, Yiping Wu 1
Huazhong University of Science & Technology, China
F-054 8:20--8:40
Improved Humidity Resistance of Leaded Packages
through Solder Dip Process
Yeoh Lai Seng 1 , Ng Eng Keat, Gooi Boon Hooi
Spansion Inc., Malaysia
F-057 8:40--9:00
Crosstalk Analysis and Optimization of High-Speed
Interconnects
Haidong Wang 1 , Jian Song, Fengman Liu, Haifei Xiang,
Wei Gao, Lixi Wan
Institute of Microelectronics, Chinese Academy of
Sciences, China
F-058 9:00--9:20
Characterization of the hot-cutting defects produced during
the processing of alumina green tape
Zeng Chao, Wang Chunqing, Tian Yanhong 1 , Liu Wei, An
rong, Hang Chunjing
Harbin Institute of Technology, China
Session 25: Quality & Reliability
Date Thursday, August 11, 2011
Time
8:00AM-9:20AM
Venue Room 5
Dr. Chenxi WANG
Chairs
Dr. Min MIAO
F-062 8:00--8:20
Comparison of charge injection in SiO2 and Si3N4 for
Capacitive RF MEMS switches
Gang Li 1 , Ulrik Hanke and Xuyuan Chen
Vestfold University College, Norway
F-063 8:20--8:40
Finite element simulation of interfacial crack propagation
behavior in BGA solder interconnects
Hong-Bo Qin 1 , Bin Li, Xun-Ping Li, Xin-Ping Zhang
South China University of Technology, China
F-065 8:40--9:00
Effect of rapid thermal cycles on the microstructure of
single solder joint
Jibing Chen, Yiping Wu 1 , Bing An
Wuhan National Laboratory for Optoelectronics, China
F-070 9:00--9:20
Theoretical analysis on the element diffusion during
thermomigration
Yuan Tao, Lan Ding, Yiping Wu 1 , Boyi Wu
Huazhong University of Science & Technology, China
Session 26: Solid State Lighting Packaging &
Integration
Date Thursday, August 11, 2011
Time 10:20AM-12:10PM
Venue Room 1
Mr. T. ONISHI
Chairs
Prof. Xu CHEN
Invited Talk 10:20–10:50
LED packaging study by tear down approaching
Mr. T. ONISHI
GJ Tech, HK, China
G-012 10:50--11:10
Static and Dynamic Analysis for High Power Light
Emitting Diodes Street Lamp under Wind Load
Xiaogang Liu 1 , Zhaohui Chen, Sheng Liu
Wuhan National Lab for Optoelectronics, China
G-016 11:10--11:30
Effect of Plating Parameters on the Au-Sn
Co-electrodeposition for Flip Chip-LED Bumps
J. L. Pan, M. L. Huang 1
Dalian University of Technology, China
G-017 11:30--11:50
Effects of die-attach materials on the optical durability and
thermal performances of HP-LED
Luqiao Yin, Lianqiao Yang, Guangming Xu, Weiqiao Yang,
Shuzhi Li, Jianhua Zhang 1
Shanghai university, China
Thursday, August 11, 10:20AM – 12:10PM
30
G-020 11:50--12:10
Novel Cooling Solutions for LED Solid State Lighting
Kai Zhang 1 , David G. W. Xiao, Haibo Fan, Xiaohua
Zhang, Zhaoli Gao, Matthew M. F. Yuen
The Hong Kong University of Science & Technology,
Hong Kong, China
Session 27: Packaging Materials & Processes
Date Thursday, August 11, 2011
Time
10:20AM-12:10PM
Venue Room 2
Prof. Hao TANG
Chairs
Dr. Bing AN
Invited Talk 10:20–10:50
Advanced Epoxy Molding Compound Technology &
Marketing Trend
Dr. Tom XIE
Henkel, China
B-065 10:50--11:10
Microstructure and mechanical properties of
Sn3Ag0.5Cu3Bi0.05Cr/Cu joints
Fei Lin, Wenzhen Bi, Guokui Ju, Xicheng Wei 1
Shanghai University, China
B-067 11:10--11:30
Design, fabrication of through silicon vias based on
suspended photoresist thin film and its application in
silicon interposer