Content

Session11: Advanced Packaging & System
Integration
Date Wednesday, August 10, 2011
Time 13:10PM-14:50PM
Venue Room 1
Dr. Lionel CADIX
Chairs
Dr. Daniel YU
A-022 13:10--13: 30
Electrical Characterization of Cylindrical and Annular TS
V for Combined Application Thereof
Xin Sun, Qinghu Cui, Yunhui Zhu, Zhiyuan Zhu, Min Miao,
Jing Chen, Yufeng Jin 1
Peking University, China
A-025 13:30--13:50
Investigation of various options of CTBGA adhesives for
bend performance enhancements in portable
electronic products
SHI Hongbin 1 and UEDA Toshitsugu
WASEDA University, Japan
A-026 13:50--14:10
Reliability Optimization for Multilayer Circuits for Active
RFID Tag on Rigid and Flexible Substrates
Huang Jingyuan 1 , Zhang Zheming, Chen Haibin and Wu
Jingshen
The Hong Kong University of Science & Technology,
Hong Kong, China
A-028 14:10--14:30
Halogen-free corner bond adhesive for array-based SMT
packages and the impact on board-level solder
joint reliability
SHI Hongbin 1 and UEDA Toshitsugu
WASEDA University, Japan
A-014 14:30 –14:50
Low temperature thermocompression bonding based on
copper nanostructure for 3D packaging
Mingxian Cai 1 , Mingxiang Chen, Sheng Liu
Huazhong University of Science and Technology, China
Session12: Packaging Materials & Processes
Date Wednesday, August 10, 2011
Time 13:10PM-14:50PM
Venue Room 2
Prof. Liangliang LI
Chairs
Prof. Mingyu LI
Co-chair
B-018 13:10--13:30
Preparation of rod-shaped and spherical Silver
nanoparticles & application for Packaging materials
Jinting Jiu 1 and Masaya Nogi
Osaka University, Japan
B-019 13:30--13:50
Mechanical and Thermal Analysis of TSV interposer
Filling with Pure Sn, Cu and Cu-Cored Solder
Ran He 1 , Huijuan Wang, Jing Zhou, Xueping Guo, Daquan
Yu and Lixi Wan
Wednesday, August 10, 13:10PM – 14:50PM
26
Institute of Microelectronics Chinese Academy of
Sciences, China
B-028 13:50--14:10
Large-scale synthesis of silver nanoparticles by polyol
process for low temperature sintering-bonding application
Jianfeng Yan 1 , Guisheng Zou, Xiaoyu Wang, Hailin Bai,
Fengwen Mu and Aiping Wu
Tsinghua University, China
B-029 14:10--14:30
Influence of nano-TiO2 reinforcements on the wettability
and interfacial reactions of novel lead-free Sn3.5Ag0.5Zn
composite solder/Cu solder joints
S. Y. Chang, L. C. Tsao 1 , F. S. Wang and L. P. Feng
Pingtung University of Science & Technology, Taiwan,
China
B-031 14:30--14:50
Properties of ferroelectric thin film capacitor for embedded
passive applications
Ning Zhao 1 , Lixi Wan and Shuhui Yu
Institute of Microelectronics, Chinese Academy of
Sciences, China
Session13: Packaging Design & Modeling
Date Wednesday, August 10, 2011
Time 13:10PM-14:50PM
Venue Room 3
Dr. Haibo FAN
Chairs
Dr. Hongfei YAN
C-016 13:10--13:30
Optimisation of Heatsink Design for a Ruggedised LCD
Display
Hua Lu 1 , Chris Bailey
University of Greenwich, UK
C-017 13:30-13:50
The electrical design of high-speed and high-density ASIC
package
Tao Wenjun 1 , Li Jun, Zhou Yunyan, Wang Qidong, Cao
Liqiang, WAN Lixi
Institute of Microelectronics, Chinese Academy of
Sciences, China
C-022 13:50--14:10
Drawing the packaging landscape for CFL applications
E.P.B.J. de Bruin 1 , P.Dijkstra, F.J. Sluijs, J.H.J. Jansen
NXP Semiconductors, Netherlands
C-025 14:10--14:30
Diffusion-induced Stresses in the Intermetallic Compound
Layer of Solder Joints
XIA Guofeng, QIN Fei 1 , AN Tong, LI Wei
Beijing University of Technology, China
C-034 14:30--14:50
Development of Low-cost Wafer Level Package
through Integrated Design and Simulation Analysis
Tong Yan Tee 1 , Glen Siew, Haoyang Chen, Serine Soh, In
Sook Kang, Jong Heon Kim, Hun Shen Ng, Teck Kheng
Lee, Germaine Hoe, Shan Gao