Content

Prof. Michael PECHT
University of Maryland, USA
Prof. Michael Pecht is a world renowned expert in strategic planning, design, test, prognostics, IP
and risk assessment of electronic products and systems. In 2010, he received the IEEE Exceptional
Technical Achievement Award for his innovations in the area of prognostics and systems health
management. In 2008, he was awarded the highest reliability honor, the IEEE Reliability Society’s
Lifetime Achievement Award. He is a Professional Engineer, an IEEE Fellow, an ASME Fellow, a
SAE Fellow and an IMAPS Fellow. He served as chief editor of the IEEE Transactions on Reliability
for eight years and on the advisory board of IEEE Spectrum. He is chief editor for Microelectronics
Reliability and an associate editor for the IEEE Transactions on Components and Packaging
Technology. He is the founder and Director of CALCE at the University of Maryland. The CALCE
Center received the NSF Innovation Award in 2009. He is also a Chair Professor in Mechanical
Engineering and a Professor in Applied Mathematics at the University of Maryland. He has written more than twenty books on
product reliability, development, use and supply chain management and over 400 technical articles. He has also written a series
of books of the electronics industry in China, Korea, Japan and India.
Prof. Moo-Whan SHIN
Yonsei University, Republic of Korea
Prof. Moo Whan Shin is one of world-wide leaders in thermal design & packaging of
optoelectronics including high power LEDs and solar cells. He received M.S. and PhD degrees from
the North Carolina State University, USA in 1988 and 1991, respectively. He is currently a Professor
in the School of Integrated Technology at Yonsei University, Korea. He holds 28 patents and
published more than 185 papers on thermal packaging and high power semiconductor devices. He
worked for the Seoul Semiconductor Company for two years as a Technical Consultant. He has given
more than 30 invited talks at international conferences and seminars on the subject of thermal
packages of optoelectronic devices. He has received an excellent green technology research award
from the Ministry of Education and Science and Technology. He is currently a President of Korea
Society of Optoelectronics. He serves Korean government as a member of Presidential Committee
on Green Growth. He is a director of ISA (International Solid State Lighting Alliance) as well.
Prof. Tadatomo SUGA
University of Tokyo, Japan
Prof. Tadatomo Suga received PhD degree from the University of Stuttgart in 1983, while
performing his PhD research at the Max-Planck Institute für Metallforschung, Stuttgart. In 1984, he
became a member of Faculty of Engineering, the University of Tokyo, and since 1993, he has been
professor of the School of Engineering. He was also a director of National Institute of Materials
Science (NIMS) conducting Interconnect Design Group and the chair of IEEE CPMT Society Japan
Chapter. His researches focus on micro-systems integration and packaging, and development of
interconnect technology, especially a room temperature bonding technique for 3D integration:
Surface Activated Bonding (SAB). He has advocated also the importance of environmental aspects of
packaging technology and is well-known as the key organizer of Japanese roadmap of lead-free
soldering and International Eco-design Conference.
Dr. Weiping LI
JCET, China
Dr. Weiping Li is the Corporate VP of Laminate Packaging and Overseas Sales of JCET. Prior to
his current responsibility, he was GM of JCET’s North American Operations. Dr Li graduated from
Georgia Institute of Technology with a PhD in Materials Science and worked at Delphi Delco,
Motorola Semiconductor and Amkor in R&D and product management areas. He was selected as one
of the “1000 Elite Overseas Chinese Returnees” by the Central Government in 2009 and is a member
of the Steering Committee for the National Key Lab for High-Density Packaging.
16