Content

Three Years of Fine Copper Wire Bonding in High Volume
Manufacturing
Mr. Bernd APPELT
ASE, USA
B-032 16: 20--16:40
Towards Quantitative Microstructural Modeling for 3D
Electronic Packaging
Zhiyong Wu and Zhiheng Huang 1
Sun Yat-sen University, China
B-033 16:40--17:00
Conjecture on The Chemical Stability and Corrosion
Resistance of Cu-Al and Au-Al Intermetallics in Ball
Bonds
C. D. Breach 1 and T.K. Lee
ProMat Consultants, Singapore
B-036 17:00--17:20
Improving Plated Copper Adhesion for Metallisation of
Glass PCBs
Baofeng He 1 , Dennis Patrick Webb and Jon Petzing
Loughborough University, UK
Session18: Packaging Design & Modeling
Date Wednesday, August 10, 2011
Time 15:50PM-17:20PM
Venue Room 3
Chairs
Dr. Jianqi HE
Dr. Jiangtao ZHENG
Invited Talk 15:50–16:20
Design and Reliability of Power Electronics Modules
Prof. Hua LU
University of Greenwich, UK
C-035 16: 20--16:40
Heat dissipation design for a high density-high power chip
package
Jing zhou 1 , Liqiang Cao, Xueping Guo, Qidong Wang,
Daquan Yu, Lixi Wan
Institute of Microelectronics, Chinese Academy of
Sciences, China
C-036 16:40--17:00
Experimental investigation of gas flow in copper channel
carbon nanotubes coated micro coolers
Wang Dianxiao 1 , Wang Xiaojing, Wang Jia, Li Zongshuo,
Fu Yifeng, Liu Johan
Shanghai University, China
C-039 17:00--17:20
The elastic anisotropy of Sn-based intermetallics in solder
joints: A first-principles calculation
Rong An 1 , Wei Liu, Chunjin Hang, Yanhong Tian,
Chunqing Wang
Harbin Institute of Technology, China
Session19: Quality & Reliability
Date Wednesday, August 10, 2011
Time 15:50PM-17:30PM
Venue Room 4
Chairs
Dr. Zezhong FU
Prof. Jun WANG
28
F-027 15:50 –16:10
Dynamic Bending Test and Simulation of PBGA Packages
Lin LONG 1 , Guoyuan LI, Pengfei ZHANG, Bin XIE,
Xunqing SHI
South China University of Technology, China
F-028 16:10 –16:30
Leakage failure Analysis of pole pieces used for traveling
wave tube
Li Peng 1 , Bao Sheng Xiang, Shi Guanghua, Lai Weiming,
Rao Zhenzhen
School of microelectronics and Solid-State Electronics,
China
F-038 16:30 –16:50
Plasma Decapsulation of plastic IC packages with copper
wire bonds for failure analysis
J. Tang 1 , H. Ye, J.B.J. Schelen and C.I.M. Beenakker
Delft University of Technology, Netherlands
F-039 16:50 –17:10
Reliability analysis on the solder joints in space cable
connectors
Zhang Xiao-chao 1 , Zhang Zhen-ming, Yangmeng
Beijing Spacecrafts, China
F-042 17:10 –17:30
Numerical Simulation and Experiments on the
Performance of LED Subjected to Thermal Shock
Xulong Gui 1 , Xiaobing Luo, Sheng Liu
Wuhan National Lab for Optoelectronics, China
Session20: Quality & Reliability
Date Wednesday, August 10, 2011
Time 15:50PM-17:30PM
Venue Room 5
Dr. Ming XUE
Chairs
Prof. Kailing PAN
F-043 16:10 –16:30
Transmission Electron Microscopy Investigations on the
Growth of Tin Whiskers from CeSn3 Substrate
Cai-Fu Li ,Zhi-Quan Liu 1 , Jian-Ku Shang
Institute of Metal Research, Chinese Academy of Sciences,
China
F-044 16:30 –16:50
A General Weibull Model for Reliability Estimate of
Anisotropic Conductive Adhesive Joining technology
using Accelerated Degradation Data
Guang-hua Wu 1 , Xian-cai Chen, Bo Tao, Zhou-ping Yin
Huazhong University of Science & Technology, China
F-046 16:50 –17:10
Electrochemical Corrosion Behavior of Sn-0.75Cu Solder
Joints in NaCl Solution
Y. F. Gao, C. Q. Cheng, M.L. Huang, L.H. Wang, J. Zhao 1
Dalian University of Technology, China
F-051 17:10 –17:30
In situ electro-mechanical experiments and mechanics
modeling of tensile cracking in indium tin oxide thin films
on polyimide substrates
Cheng Peng, Zheng Jia, Dan Bianculli, Teng Li 1 , Jun Lou