Content

More documents

Recommendations

Info

CONFERENCE ORGANIZERS( 会议组织结构 ) Directed by Department of Higher Education, Ministry of Education, China 会议指导单位中华人民共和国教育部高等教育司 Department of Telecommunication, Ministry of Industry and Information Technology, China 中华人民共和国工业和信息化部电子信息司 China International Culture Exchange Center, China 中国国际文化交流中心 Science and Technology Commission of Shanghai Municipality, China 上海市科学技术委员会 Sponsored by Chinese Institute of Electronics, China 会议主办单位中国电子学会 IEEE Component, Packaging, &Manufacturing Technology Society (IEEE-CPMT) 国际电气电子工程师联合会电子元件封装和生产技术学会 Organized by Electronic Manufacturing & Packaging Technology Society of the Chinese Institute of Electronics, China 会议承办单位中国电子学会电子制造与封装技术分会 Shanghai University, China 上海大学 Co-organized by Key Laboratory of Advanced Display and System Applications of Ministry of Education, Shanghai University, China 会议协办单位新型显示及应用集成教育部重点实验室 ( 上海大学 ) Shanghai R&D Public Service Platform for Advanced display Design, Manufacturing and System Integration 上海市新型显示设计制造与系统集成专业技术服务平台 Applied Science & Technology Research Institute (ASTRI), Hong Kong, China 中国香港特别行政区香港应用科技研究院 Beijing Faith Consulting Co., Ltd., China 北京菲尔斯信息咨询有限公司 2
CONFERENCE CHAIRS( 大会主席 ) General Chair Keyun BI Co-chairs Min WANG Rolf ASCHENBRENNER William T. CHEN Kouchi ZHANG Director of China Institute of Electronics (CIE), China President of Electronics Manufacturing & Packaging Technology Society (EMPT), CIE, China President of Electronics Packaging Society, CSIA, China Vice President, Shanghai University, China President of IEEE-CPMT, USA Deputy Director of IZM, Fraunhofer, Germany Former President of IEEE-CPMT Senior Director of ASE, USA Senior Director and Fellow of Philips Lighting Prof. of Delft University of Technology, Netherlands ADVISORY COMMITTEE( 顾问委员会 ) Shichang ZOU Academician of CAS; President of Shanghai Integrated Circuit Industry Association, China Juyan XU Academician of CAE; Honorary Director of No. 58 Institute of CETC, China C. P. WONG Dean of School of Eng., CUHK, Hong Kong, China Prof. of Georgia Institute of Technology, USA Rao TUMMALA Pettit Chair Prof. & Director of Packaging Research Center, Georgia Institute of Technology, USA Michael PECHT Director of CALCE, Prof. of Univ. of Maryland, USA James MORRIS Prof. of Portland State University, USA Johan LIU Prof. of Shanghai University, China; Prof. of Chalmers Univ. of Science & Technology, Sweden; Member of Royal Swedish Academy of Engineering, Sweden Xuejun FAN Prof. of Lamar University, USA Tadatomo SUGA Prof. of University of Tokyo, Japan Guoqiang DAI Deputy Director, Ministry of Science & Technology of the People’s Republic of China Wenwu DING Deputy Director, Ministry of Industry and Information Technology of the People’s Republic of China Rulin LIU General Executive Director of CIE, China Shouwen YU Former Vice President of Tsinghua University, China Yintang YANG Vice President of Xidian University, China Tianchun YE General Director of IME, CAS, China Dongkai SHANGGUAN Vice President, Flextronics International, USA Ricky S. W. LEE Prof. of HKUST, Hong Kong, China Kees BEENAKKER Director, Delft University of Technology, Netherlands Roger HOSKENS Director, Philips Lighting, Netherlands Jusheng MA Prof. of Tsinghua University, China 3
Page 3 and 4: CONTENTS WELCOME FROM THE GENERAL C
Page 5: WELCOME FROM THE GENERAL CHAIR Star
Page 9 and 10: Chiar for PDC & Forum Wenhui ZHU Se
Page 11 and 12: Prof. Yuming WANG Dr. Jianhua WU Dr
Page 13 and 14: OVERVIEW OF CONFERENCE PROGRAM( 会
Page 15 and 16: Dr. Yong LIU Fairchild, USA Dr. Yon
Page 17 and 18: Introduction of TSV Forum Speakers
Page 19 and 20: Prof. C.P. WONG GT, USA Prof. C.P.
Page 21 and 22: Dr. Thorsten MATTHIAS EV Group, Aus
Page 23 and 24: Engineering at The University of To
Page 25 and 26: Chairs 08:00--09:20 OVERVIEW OF ORA
Page 27 and 28: ORAL SESSIONS Note: Only the contac
Page 29 and 30: Electromigration Behavior in In-sit
Page 31 and 32: Nepes, Singapore Session14: Advance
Page 33 and 34: University of Maryland, USA F-052 1
Page 35 and 36: Ziyang Wu, Chuanguo Dou, Yanhong Wu
Page 37 and 38: POSTER SESSION 1 Note: Only the con
Page 39 and 40: Model Zhao Wang 1 , Heming Zhao, We
Page 41 and 42: soldering reaction L. Y. Gu, L. Qu,
Page 43 and 44: Area 1 (Session G): Solid State Lig
Page 45 and 46: Area 5 (Session F): Quality & Relia
Page 47 and 48: 会议结束时间 :8 月 11
Page 49 and 50: TRANSPORTATION MAP 45

Content

You also want an ePaper? Increase the reach of your titles

Delete template?

Save as template?