Content

More documents

Recommendations

Info

B-020 Nanoindentation for measuring mechanical properties of Sn-Ag-Cu-RE BGA solder joints Wang Lifeng 1 , LIU Meirna, Tian Chong jun, Yang Wenxuan Harbin University of Science & Technology, China B-021 Influence of rare earth addition on the microstructure of Sn-Cu-Ni solder and interfacial reaction of Cu/Sn-Cu-Ni/Cu microscale solder joints Wei Li 1 , Min-Bo Zhou, Xiao Ma, Xin-Ping Zhang South China University of Technology, China B-022 Electroless and Eletroplating Copper on Liquid Crystal Polymer (LCP) for High Frequency Applications Meisheng Zhou 1 , Wenlong Zhang, Ming Li, Dongyan Ding Shanghai Jiao Tong University, China B-023 Preparation and properties of conductive polymer doped with Ag-coated fiber glass for EMI shielding Xiaohei Liu 1 , Zhidong Xia, Bo Yuan,Mengke Zhao, Fu Guo Beijing University of Technology, China B-024 Preparation and deposition process of Cu/Al powder in conductive polymer for EMI shielding Xing zhang 1 , Zhidong Xia, Shaofan Zhao, Yong Gao Beijing University of Technology, China, B-025 Enhanced thermoelectric figure of merit of Bi2Te3-based thin-film microcooler with non-planar barrier structure Leilei Han 1 , Chunqing Wang Harbin Institute of Technology, Nangang, China B-027 Size Effect on Coalescence of Intermetallic Compounds in Reflowed Sn-Ag-Cu Solder Balls and Sn-Ag-Cu/Cu Solder Joints Min-Bo Zhou 1 , Xiao Ma, Xin-Ping Zhang South China University of Technology, China Area 3 (Session C): Packaging Design & Modeling C-001 The Copper Stud Bumping Shaping Simulation Based on Thermal-Solid couple analysis Zhang Shanshan 1 Anyang Institute of Technology, China C-009 Signal Integrity Simulation for SiP Using GTLE Jia Jia 1 , Liqiang Cao, Lixi Wan Institute of Microelectronics, Chinese Academy of Science, China C-010 Modeling of kink effect for undoped polycrystalline silicon thin-film transistors Hongyu He 1 , Xueren Zheng Guangdong University of Technology, China 34 C-013 FE simulation of joint volume effect on fracture behavior of BGA structure Sn3.0Ag0.5Cu solder interconnects under lap shear loading J.M. Xia 1 , X.P. Li, X. Ma, X.P. Zhang South China University of Technology, China C-015 Investigation of bulk resistance for metal-coated polymer particles used in anisotropic conductive adhesive Xiancai Chen 1 , Bo Tao, Zhouping Yin Huazhong University of Science & Technology, China C-018 A Study of Thermal Behavior of High Power Double-Quantum-Well Semiconductor Laser Pu Zhang 1 , Xiaochen Ding, Jingwei Wang, Xiaoning Li, Lingling Xiong, Chenhui Peng, Xiang Ou, Xingsheng Liu Xi'an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, China C-019 Investigation on Lead-free Solder Joint Reliability of Edge-Bonded CBGA under Temperature Cycling Y. Sing Chan, Fubin Song, S. W. Ricky Lee 1 The Hong Kong University of Science and Technology, Hong Kong, China C-020 Design optimization on the CoB LED module Gong Yu-bing 1 Guilin University of Electronic Technology, China C-021 Molecular Dynamics Simulation for the Bonding Energy of Metal-SWNT Interface Yahui Zhang 1 , Zhili Hu, Yan Zhang, Lilei Ye, Johan Liu Shanghai University, China C-024 A Constitutive Model for Lead-free Solders by Considering Damage Effects at High Strain Rates WANG Xuming, QIN Fei 1 , AN Tong Beijing University of Technology, China C-026 Influence of Interfacial Delamination on Temperature Distribution of QFN Packages BAN Zhaowei, QIN Fei 1 , WANG Xuming Beijing University of Technology, China Area 4 (Session D): High Density Substrate & SMT D-001 Study on Solder Joint Image Segmentation Techniques Based on Matlab ZHU Shao-hua 1 ,WU Zhao-hua,SUN Yu-feng Guilin University of Electronic Technology, China D-002 Pad Design, Soldering Technology and Reliability of Package on Package Yuming Wang 1 , Jian Cai, Wang Beibei, Yang Xinghua Tsinghua University, China D-003 SMD Reliability Research Base on Stolkarts Fatigue
Model Zhao Wang 1 , Heming Zhao, Wenzhong Lou, Liu Chuanqin , Hanwei Li, Li Jin North university of China, China D-005 Study on Intelligent Identification Technology of Solder Joints Defects Based on LMBP Neural Network WU Zhao-hua 1 GuiLin University of Electronic Technology, China D-007 Study on the Heat Dissipation of the Thermal Via in T/R Modules Based on BP-GA Tang-wen Bi 1 , De-jian Zhou GuiLin University of Electronic Technology, China. D-008 The intelligent detection method study of PQFP solder joint defects based on improved neural network Tianxiang Yan 1 , Dejian Zhou Guilin University of Electronic Technology, China D-010 Mechanical and Thermal Analysis of 3D embedded capacitor filling with conductive adhesive Huijuan Wang 1 , Daquan Yu, Ran He, Fengwei Dai, Xueping Guo, Lixi Wan Institute of Microelectronics Chinese Academy of Sciences, China D-012 A new measurement method and electrical design for high density optoelectronics integration Fengman Liu 1 , Baoxia Li, Yunyan Zhou, Wei Gao, Haifei Xiang, Haidong Wang, Jian Song, Zhihua Li, Kun Yang,Liqiang Cao,Lixi Wan Institute of Microelectronics, Chinese Academy of Science, China Area 5 (Session F): Quality & Reliability F-004 A Damage model for SnAgCu Solder under Thermal Cycling Hui Xiao 1 , Xiaoyan Li, Na Liu, Yongchang Yan, Beijing University of Technology, China F-008 Irregular tin whisker growth on the surface of Sn-3.8Ag-0.7Cu-1.0RE solder joints Hu Hao 1 , Jun Tian, Guangchen Xu, Fu Guo, Yonglun Song Beijing University of Technology, China F-010 In situ measurement and binning system of LED for improved color consistency Shengjun Zhou 1 , Sheng Liu Shanghai Jiao Tong University, China F-012 Tensile Properties of PV ribbons with Sn-Pb-X Coating Xuewei Wu, Dongyan Ding 1 , Yanting Zhou, Bai Han, Yunhong Yu, Xulin Sun, Ming Li, Dali Mao Shanghai Jiao Tong University, China F-013 Tin whisker formation on electroless tin films deposited on lead-frame alloys Ting Liu, Yiqing Wang, Dongyan Ding 1 , Klaus-Peter Galuschki, Yu Hu, Angela Gong, Ming Li, Dali Mao Shanghai Jiao Tong University, China F-014 Influence of Reflow Atmosphere on the Lead-Free Solder Joints Yanting Zhou, Dongyan Ding 1 , Bai Han, Xuewei Wu, Xulin Sun, Yunhong Yu, Ming Li, Dali Mao Shanghai Jiao Tong University, China F-015 Phase Segregation under Reversed Current Stressing in Eutectic Sn-based Solder Joints Sihan Liu 1 , Guangchen Xu, Fu Guo, Andre Lee, K.N. Subramanian, Beijing University of Technology, China F-016 Simulation and Experimental Investigation for Board Level Package-on-Package in Drop Test Zerui Fan, Xiaohu Yao 1 South China University of Technology, China F-017 Preparation and Properties of Electroless Deposited NiP, NiWP as Barrier Layer on p-type Si Yuhang Xin 1 , Anmin Hu, Ming Li, Dali Mao Shanghai Jiao Tong University, China. F-022 Application of Response Surface Methods in Lead-free Solder Joints of Plastic Ball Grid Array Thermal Fatigue Life Prediction Zhao Qiang 1 , Dejian Zhou GuiLin University of Electronic Technology, China F-024 Oxidation behavior of Sn-9Zn-3Bi-XCr solders under high-temperature condition Jing Hu 1 , Anmin Hu,Ming Li, Dali Mao Shanghai Jiao Tong University, China 35
Page 3 and 4: CONTENTS WELCOME FROM THE GENERAL C
Page 5 and 6: WELCOME FROM THE GENERAL CHAIR Star
Page 7 and 8: CONFERENCE CHAIRS( 大会主席
Page 9 and 10: Chiar for PDC & Forum Wenhui ZHU Se
Page 11 and 12: Prof. Yuming WANG Dr. Jianhua WU Dr
Page 13 and 14: OVERVIEW OF CONFERENCE PROGRAM( 会
Page 15 and 16: Dr. Yong LIU Fairchild, USA Dr. Yon
Page 17 and 18: Introduction of TSV Forum Speakers
Page 19 and 20: Prof. C.P. WONG GT, USA Prof. C.P.
Page 21 and 22: Dr. Thorsten MATTHIAS EV Group, Aus
Page 23 and 24: Engineering at The University of To
Page 25 and 26: Chairs 08:00--09:20 OVERVIEW OF ORA
Page 27 and 28: ORAL SESSIONS Note: Only the contac
Page 29 and 30: Electromigration Behavior in In-sit
Page 31 and 32: Nepes, Singapore Session14: Advance
Page 33 and 34: University of Maryland, USA F-052 1
Page 35 and 36: Ziyang Wu, Chuanguo Dou, Yanhong Wu
Page 37: POSTER SESSION 1 Note: Only the con
Page 41 and 42: soldering reaction L. Y. Gu, L. Qu,
Page 43 and 44: Area 1 (Session G): Solid State Lig
Page 45 and 46: Area 5 (Session F): Quality & Relia
Page 47 and 48: 会议结束时间 :8 月 11
Page 49 and 50: TRANSPORTATION MAP 45

Content

Create successful ePaper yourself

Delete template?

Save as template?