Content

More documents

Recommendations

Info

Area 1 (Session A): Advanced Packaging & System Integration A-021 An Application of System in Package Technology: UTI ZHU Wenhui 1 , GUO Xiaowei, WEI Jianyou, WANG Yongzhong, LI Xizhou, QIN Fei, XIA Guofeng Tian shui Hua tian Microelectronics Co., Ltd, China A-023 Thermal cycling reliability of edge and corner bonded package stackable very thin fine pitch ball grid array assemblies SHI Hongbin 1 and UEDA Toshitsugu. WASEDA University, Japan A-027 Development Process of Phosphor Coating with Screen Printing for White Light Emitting Diode Packaging Shan Yu 1 , Liang Yang, Feng Jiao, Huai Zheng, Mingxiang Chen, Sheng Liu Wuhan National Laboratory for Optoelectronics, China A-031 Process characterization and optimization of copper TSV i nterconnection Shenglin Ma, Yunhui Zhu, Xin Sun, Min Miao, Jin Chen, Yufeng Jin 1 Peking University, China A-032 Process development of multi-layer stacked chip module Shenglin Ma, Xin Sun, Yunhui Zhu, Wenping Kang, Qinghu Cui, Min Miao, Jin Chen, Yufeng Jin 1 Peking University, China A-033 Wafer Level Vacuum Packaging for MEMS Device by Solder Sealing Bing An 1 , Gan-ran Tang, Ya-nan Sun, Yi-ping Wu Huazhong University of Science & Technology, China A-034 Wafer-level Chip-to-Wafer Integration of High-Sensitivity MEMS and IC Gaowei Xu 1 , Peili Yan, Xiao Chen, Wenguo Ning, Le Luo, Jiwei Jiao Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, China A-036 Preparation of Micro-nano Glass Cavities by a Novel Hot Forming Process Xinhu Luo, Jintang Shang 1 , Hui Yu, Jingdong Liu Southeast University, China A-043 Solution to Leakage of Polyimide-structural Wafer Level Package Dong Chen 1 , CM Lai, KH Tan, Li Zhang, XinJiang Long Jiangyin Changdian Advanced Package Co., LTD, China POSTER SESSION 2 Wednesday, August10, 14:50PM – 15:50PM 36 Area 2 (Session B): Packaging Materials & Processes B-037 Improving the Thermal Conductivity of Epoxy Resins with Mesogenic Units for Electronic Packaging Jingfeng Hao 1 , Dayong Gui, Jianhong Liu, Wentao Zeng Shenzhen University, China B-040 Deformation characteristics of micrometer coarse-grained aluminum wires exposed under ultrasonic at room temperature Hongjun JI, Mingyu LI 1 Shenzhen Graduate School, Harbin Institute of Technology, China B-041 Synthesis and Characterization of Benzocyclobutene- Functionalized Siloxane Thermoset with a Cyclic Structure Jun Yang 1 , Mingfei Sun, Yuanrong Cheng, Fei Xiao Fudan University, China B-042 The study on the shaping of electroplated Copper Pillar Bumping Ying Han 1 , Hongqi Sun, Su Wang, Ming Li, Jiangyan Sun Shanghai Jiaotong University, China B-043 Solder wetting on the substrates with Tin finish Cai Chen, Lei Zhang 1 and J. K. Shang Institute of Metal Research, Chinese Academy of Sciences, China B-045 Elecromigration-induced failure of Ni/Sn3.0Ag0.5Cu/ ENEPIG flip chip solder joint S.M. Zhou, M.L. Huang 1 , L.D. Chen, S. Ye, Y.M. Ye, J.F. Wang, X. Cao Dalian University of Technology, China B-046 Effect of Solder Volume on Interfacial Reaction Between Sn-3Ag-0.5Cu Solder Ball and Cu Pad After Multiple Reflows Luwei Liu, Mingliang Huang 1 Dalian University of Technology, China B-047 Mechanical Properties and Electrochemical Corrosion Behavior of Al-Cu Solder Joints with solder alloys of Sn-Zn-Al, Sn-Zn-Ag, Sn-Zn-Ag-Al N. Kang, M. L. Huang 1 Dalian University of Technology, China B-048 Recent progress in the studies of low melting Sn-based Pb-free solder alloys Yang Lin 1 , Luqiao Yin, Xicheng Wei Shanghai University, China B-049 Effects of soldering time and cooling rates on microstructures of intermetallic compounds in Sn-Ag/Cu
soldering reaction L. Y. Gu, L. Qu, H. T. Ma 1 Dalian University of Technology, China B-050 Effect of Electromigration on Creep Rupture Life of Sn-Ag-Cu Solder Joints H. Y. Liu, Q. S. Zhu 1 , Z. G. Wang, J. K. Shang Institute of Metal Research, Chinese Academy of Sciences, China B-051 Thermal and Dielectric Properties of Bismaleimide- Triazine resin/Boron Nitride Composite Xiaoliang Zeng, Shuhui Yu 1 , Rong Sun, Ruxu Du Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China B-052 Carboxyl-Terminated Polyesterimide/Epoxy Resin System: Preparation and Thermomechanical Properties Dayong Gui 1 , XinMiao, Jingfeng Hao, Wentao Zeng, Jianhong Liu Shenzhen University, China B-053 Analysis of Cu6Sn5 grain orientations in Sn3.0Ag0.5Cu lead-free solder joints Lina Niu, Yanhong Tian 1 , Chunqing Wang Harbin Institute of Technology, China B-054 Dielectric properties of BaTiO3 -based mu ltilayered thin films for capacitors prepared by sol-gel technique Bin Li 1 , Chunqing Wang, Wei Zhang, Ying Zhong, Weiwei Wu Harbin Institute of Technology, China Area 3 (Session C): Packaging Design & Modeling C-027 Morphology and nano-indentation properties of intermetallic compounds in solder joints ZHONG Weixu, QIN Fei 1 , AN Tong Beijing University of Technology, China C-028 3D Modeling and Simulation of Heat Transfer for Internal Channel Cooling of 3D-Chip Stacks Jing Zhang 1 ,Guidotti.Daniel, Xueping Guo, Jing Zhou, Liqiang Cao, Daquan Yu, Lixiwan Institute of Microelectronics, Chinese Academy of Sciences, China C-029 Modeling and Finite-Element Full-wave Simulation of Glass Interposer with TGVs (Through-Glass-Vias) for 3D packaging Zhang jing 1 , Sun xiaofeng, Yu daquan, Cao liqiang, Wan lixi Institute of Microelectronics, Chinese Academy of Sciences, China C-030 Ultra-Wideband Noise Isolation on Power Distribution Network of High-speed Package Substrate Baoxia Li 1 and Lixi Wan Institute of Microelectronics, Chinese Academy of 37 Sciences, China C-031 A novel cooling structure for electronic package Jun Li 1 , Xueping Guo, Jing Zhang, Liqiang Cao, Lixi Wan Institute of Microelectronics, Chinese Academy of Sciences, China C-033 Power Integrity Simulation for Multilayer Power Distribution Networks Based on GTLE and Via Model Yunyan Zhou 1 , Lixi Wan, Shuhua Liu, Liqiang Cao, Jia jia Institute of Microelectronics, Chinese Academy of Sciences, China C-037 Geometric optimization of Carbon nanotubes(CNTs) microchannel with liquid flow Wang Dianxiao 1 , Wang Xiaojing, Wang Jia, Li Zongshuo Shanghai University, China C-038 Current optimization of different chips for High Power Light-emitting diodes Liang Yang, Sheng Liu 1 , Run Chen, Zhicheng Lv Huazhong University of Science & Technology, China C-040 Effects of Package Type, Die Size, Material and Interconnection on the Junction-to-Case Thermal Resistance of Power MOSFET Packages Cong Yue 1 , Jun Lu, Xiaotian Zhang, Yueh-Se Ho Agape Package Manufacturing Ltd., China C-041 Modeling and Design of Coplanar Structure in QFP80 Package for RFIC Applications Sun haiyan 1 , Wu jianhui Southeast University, China C-044 Thermal Stress Simulation of PBGA under Natural Convection Using A Fluid-solid Coupling Method Zhimin Wan, Ling Xu, Xiaobing Luo 1 , Sheng Liu Huazhong University of Science & Technology, China C-046 Low Electromagnetic Interference Optoelectronic Packaging of a 40Gbps Optical Transceiver WAN Lixi 1 , LI Zhihua, LI Baoxia, LIU Fengman, LI Jun, SONG Jian, XIANG Haifei & ZHONG Hanmei Institute of Microelectronics, Chinese Academy of Sciences, China Area 4 (Session E): Advanced Manufacturing Technologies & Packaging Equipment E-002 Development of a three-dimensional integrated solder ball bumping & bonding method for MEMS devices Lei Yang 1 , Wei Liu, Chunqing Wang, Yanhong Tian Harbin Institute of Technology, China E-004 Technology of Embedded Capacitance And Resistance Hu Shaohua 1 Shennan Circuit Co., China E-005 An Experimental Investigation on Thermal Contact Resistance Across Metal Contact Interfaces Xiaobing Luo 1 , Han Feng, Jv Liu, Minglu Liu and Sheng
Page 3 and 4: CONTENTS WELCOME FROM THE GENERAL C
Page 5 and 6: WELCOME FROM THE GENERAL CHAIR Star
Page 7 and 8: CONFERENCE CHAIRS( 大会主席
Page 9 and 10: Chiar for PDC & Forum Wenhui ZHU Se
Page 11 and 12: Prof. Yuming WANG Dr. Jianhua WU Dr
Page 13 and 14: OVERVIEW OF CONFERENCE PROGRAM( 会
Page 15 and 16: Dr. Yong LIU Fairchild, USA Dr. Yon
Page 17 and 18: Introduction of TSV Forum Speakers
Page 19 and 20: Prof. C.P. WONG GT, USA Prof. C.P.
Page 21 and 22: Dr. Thorsten MATTHIAS EV Group, Aus
Page 23 and 24: Engineering at The University of To
Page 25 and 26: Chairs 08:00--09:20 OVERVIEW OF ORA
Page 27 and 28: ORAL SESSIONS Note: Only the contac
Page 29 and 30: Electromigration Behavior in In-sit
Page 31 and 32: Nepes, Singapore Session14: Advance
Page 33 and 34: University of Maryland, USA F-052 1
Page 35 and 36: Ziyang Wu, Chuanguo Dou, Yanhong Wu
Page 37 and 38: POSTER SESSION 1 Note: Only the con
Page 39: Model Zhao Wang 1 , Heming Zhao, We
Page 43 and 44: Area 1 (Session G): Solid State Lig
Page 45 and 46: Area 5 (Session F): Quality & Relia
Page 47 and 48: 会议结束时间 :8 月 11
Page 49 and 50: TRANSPORTATION MAP 45

Content

You also want an ePaper? Increase the reach of your titles

Delete template?

Save as template?