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QUALITY and RELIABILITY 3. PROCESS CONTROL GENERAL PROCESS CONTROL II The general process flow in Samsung is shown in Figure 8. This illustration contains the standard process flow from incoming parts and materials to customer shipment. Acceptance inspection (according to acceptance inspection plan) Process quality control • Check of each condition by process quality control procedures • Process inspection • Lot control • Equipment calibration and maintenance 100% Electrical Die Sorting Process Quality Control and screening of infant mortality defects • Mechanical screen • Thermal shock • Burn-in 100% package sorting of electrical characteristics and marking Reliability monitoring 1. Product reI. monitor I. 2. Product rei. monitor II. • High Temperature Operating Life Test • Environmental test • Life Test Finished Goods Incoming Inspection Sampling Inspection • Dimensions • Visual • Electrical characteristics • Periodic calibration of measuring equipment Stock control • Age control Sampling Inspection (when applicable) Shipment Figure 8. General Process Flow Chart c8SAMSUNG 25
QUALITY and RELIABILITY 3.1 WAFER FABRICATION Process Controls The Quality Control program utilizes the following methods of control to achieve its previously stated objectives: process audits, environmental monitors, process monitors, lot acceptance inspections, and process integrity audits. Definitions The essential method of the Quality Control Program is defined as follows: 1. Process Audit-Performed on all operations critical to product quality and reliability. 2. Environmental Monitor-Monitors concerning the process environment, i.e., water purity, temperature, humidity, particle counts. 3. Process Monitor-Periodic inspection at designated process steps for verification of manufacturing inspection and maintenance of process average. These inspections provide both attribute and variable data. 4. Lot Acceptance-Lot-by-Iot sampling. This sampling method is reserved for those operations deemed as critical, and require special attention. Environmental Monitor Process Control Item Spec. Limit Insp. Frequency Clean Room • Temperature • Individual Spec. 24 Hrs. • Humidity • Individual Spec. 24 Hrs. • Particle • Individual Spec. 24 Hrs. • Air Velocity • Individual Spec. 24 Hrs. D.1. Water • Particle • 5 ea/50ml (O.BIL) 24 Hrs. • Bacteria • 50 colonies/100ml (0.45IL) Weekly • Resistivity • Main (Line): More than 24 Hrs. 16 Mohm-cm • Using point: More than 24 Hrs. 14 Mohm-cm * Instruments • FMS (Facility Monitoring System) HIAC/ROYCO • CPM (Central Particle Monitoring System-Dan Scientific) • Liquid Dust Counter Etch Rate • Filtration System for Bacterial check • Air Particle counter • Air Velocity meter Process Monitor Process Control Item Spec. Limit Insp. Frequency Photo • Aligner N2 Flow Rate • Individual Spec. Once/Shift • Aligner Vacuum • Individual Spec. Once/Shift ------ ---- ---- ------- ----·-AI i g nerAr f- ---'--rndividliarSpec. Once/Shift • Aligner Pressure • Individual Spec. Once/Shift • Aligner Intensity o Individual Spec. Once/Shift o Coater Soft Bake o Individual Spec. Once/Shift Temperature o Individual Spec. Once/Shift Vacuum o Individual Spec. Once/Shift --- --- - ------- Etch • Etchant Temp. o Individual Spec. Once/Shift • Etch Rate o Individual Spec. Once/Shift • Spin Dryer N2 Flow o Individual Spec. Once/Shift RPM o Individual Spec. Once/Shift • Hard Bake Temp. o Individual Spec. Once/Shift N2 Flow o Individual Spec. Once/Shift c8SAMSUNG 26
Page 1 and 2: c8 SAMSUNG MOS Products Data Book 1
Page 3 and 4: QUALITY and RELIABILITY Table 1. Re
Page 5 and 6: QUALITY and RELIABILITY Table 2. Fa
Page 7 and 8: QUALITY and RELIABILITY ACCELERATED
Page 9 and 10: QUALITY and RELIABILITY Some words
Page 11: QUALITY and RELIABILITY Process Mon
Page 15 and 16: QUALITY and RELIABILITY 3. Photo/Et
Page 17 and 18: QUALITY and RELIABILITY Figure 9. G
Page 19 and 20: QUALITY and RELIABILITY 6. Seal Ins
Page 21 and 22: QUALITY and RELIABILITY 3. In·Proc
Page 23 and 24: - QUALITY and RELIABILITY Figure 10
Page 25 and 26: ~. QUALITY and RELIABILITY Figure 1
Page 27 and 28: NOTES
Page 29 and 30: ----_.._---
Page 31 and 32: PRODUCT GUIDE E Calculator ICs Devi
Page 33 and 34: PRODUCT GUIDE 4 3. ORDERING INFORMA
Page 35 and 36: CMOS LCD Watch ICs Device Function
Page 37 and 38: KS5112 CMOS DIGITAL INTEGRATED CIRC
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KS5190 CMOS DIGITAL INTEGRATED CIRC
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KS5199A CMOS DIGITAL INTEGRATED CIR
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~ - KS5209 CMOS DIGITAL INTEGRATED
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K5521 0 CMOS DIGITAL INTEGRATED CIR
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KS521 0 CMOS DIGITAL INTEGRATED CIR
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Calculator ICs Device Function Pack
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KS602,5 CMOS DIGITAL INTEGRATED CIR
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KS6026 APPLICATION CMOS DIGITAL INT
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KS6027 AlBIC CMOS DIGITAL INTEGRATE
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KS6027 AlBIC CMOS DIGITAL INTEGRATE
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---------- - - _____ _____ n _____
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KS6027B CMOS DIGITAL INTEGRATED CIR
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KS60278 CMOS DIGITAL INTEGRATED CIR
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KS6027C CMOS DIGITAL INTEGRATED CIR
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KS6027C CMOS DIGITAL INTEGRATED CIR
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~~ KS6027C CMOS DIGITAL INTEGRATED
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NOTES
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VOICE SYNTHESIZER APPLICATION GUIDE
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db ~ 3: CJ) c: z c;) KS5901A APPLIC
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-- KS5901A CMOS DIGITAL INTEGRATED
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-------------~ KS5901A CMOS DIGITAL
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------------------- KS5901A CMOS DI
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----~-----------~--~- ~---~~-- ----
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KS5902XX CMOS DIGITAL INTEGRATED CI
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~ KS5911 CMOS DIGITAL INTEGRATED CI
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---~ KS5911 CMOS DIGITAL INTEGRATED
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--------- ______ ~ ______ -_0_.__--
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~ MELODY/MISCELLANEOUS ICs 6
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KS5381 CMOS DIGITAL IC MULTI MELODY
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KS5381 CMOS DIGITAL IC BATTERY OPER
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KS5381 CMOS DIGITAL IC MELODY OPERA
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KS5381 CMOS DIGITAL IC PAD DIAGRAM
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KS5381 CMOS DIGITAL IC 2. PACKAGJ:
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------------~--------- KS5116 CMOS
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1--. ------29-30sec KS5116 CMOS DIG
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PACKAGE DIMENSIONS 8 DIP Unit: mm 1
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PACKAGE DIMENSIONS 40 DIP Unit: mm
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SALES OFFICES/MANUF ACTURER' S REPR
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SALES OFFICES/MANUFACTURER'S REPRES
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SALES OFFICES/MANUFACTURER'S REPRES
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c8 SAMSUNG Electronics Semiconducto
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