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KS5112 CMOS DIGITAL INTEGRATED CIRCUIT APPLICATION • The voltage doubler circuit is formed by connecting O.OS"F to O.1~ capacitor from 'CAP' PAD to '1KO' PAD and from ·VDD2' PAD to 'VSS' PAD. • Oscillator circuit is formed by connecting crystal from '01' PAD to '00' PAD. • The circuit substrate is electrically connected to Vss, the most negative voltage. The preferred assembly method is to connect die area to Vss using a conductive die attach. • The watch can operate with 1.SV silver oxide battery and user should connect 'VDD' PAD to 1.SV, VSS to OV. TESTING • T1, T2 and T3 PAD are provided for testing. In normal operation they should be kept open. • Three test inputs and two switches are pulled down by internal resistors. LCD FORMAT ...J 0 0 ill ill ~ ~ i ~ 0 ~ ;Z ~ ~ (J III III ~ ~ B !!i! ~ ~ w III u '" ~ c8SAMSUNG 53
KS5112 CMOS DIGITAL INTEGRATED CIRCUIT APPLICATION CIRCUIT LCD COM1 COM2 COM3 00 vss x-laiD 01 KS5112 VDD2 C2: O.1~F 1KO C1: O.1~F S CAP D VSf VDDl 1.SV + * Quartz Crystal Parameter Fp = 32,768Hz CL = 10pF C1 = 4pF Co = 2.5pF Rs = 35KO --,----."-------------- ~---Q--~- 35;000--------- ~ _______.__________ ---_0------- _______________ ._______ __ ~ ______________________ _ c8SAMSUNG 54
Page 1 and 2: c8 SAMSUNG MOS Products Data Book 1
Page 3 and 4: QUALITY and RELIABILITY Table 1. Re
Page 5 and 6: QUALITY and RELIABILITY Table 2. Fa
Page 7 and 8: QUALITY and RELIABILITY ACCELERATED
Page 9 and 10: QUALITY and RELIABILITY Some words
Page 11 and 12: QUALITY and RELIABILITY Process Mon
Page 13 and 14: QUALITY and RELIABILITY 3.1 WAFER F
Page 15 and 16: QUALITY and RELIABILITY 3. Photo/Et
Page 17 and 18: QUALITY and RELIABILITY Figure 9. G
Page 19 and 20: QUALITY and RELIABILITY 6. Seal Ins
Page 21 and 22: QUALITY and RELIABILITY 3. In·Proc
Page 23 and 24: - QUALITY and RELIABILITY Figure 10
Page 25 and 26: ~. QUALITY and RELIABILITY Figure 1
Page 27 and 28: NOTES
Page 29 and 30: ----_.._---
Page 31 and 32: PRODUCT GUIDE E Calculator ICs Devi
Page 33 and 34: PRODUCT GUIDE 4 3. ORDERING INFORMA
Page 35 and 36: CMOS LCD Watch ICs Device Function
Page 37 and 38: KS5112 CMOS DIGITAL INTEGRATED CIRC
Page 39: KS5112 CMOS DIGITAL INTEGRATED CIRC
Page 71 and 72: KS5199A CMOS DIGITAL INTEGRATED CIR
Page 75 and 76: KS5199A CMOS DIGITAL INTEGRATED CIR
Page 87 and 88: ~ - KS5209 CMOS DIGITAL INTEGRATED
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K5521 0 CMOS DIGITAL INTEGRATED CIR
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KS521 0 CMOS DIGITAL INTEGRATED CIR
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KS5211 CMOS DIGITAL INTEGRATED CIRC
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Calculator ICs Device Function Pack
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KS602,5 CMOS DIGITAL INTEGRATED CIR
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KS6026 APPLICATION CMOS DIGITAL INT
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KS6027 AlBIC CMOS DIGITAL INTEGRATE
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KS6027 AlBIC CMOS DIGITAL INTEGRATE
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KS6027A CMOS DIGITAL INTEGRATED CIR
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---------- - - _____ _____ n _____
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KS6027B CMOS DIGITAL INTEGRATED CIR
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KS60278 CMOS DIGITAL INTEGRATED CIR
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KS6027C CMOS DIGITAL INTEGRATED CIR
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KS6027C CMOS DIGITAL INTEGRATED CIR
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~~ KS6027C CMOS DIGITAL INTEGRATED
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NOTES
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VOICE SYNTHESIZER APPLICATION GUIDE
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db ~ 3: CJ) c: z c;) KS5901A APPLIC
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-- KS5901A CMOS DIGITAL INTEGRATED
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-------------~ KS5901A CMOS DIGITAL
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------------------- KS5901A CMOS DI
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----~-----------~--~- ~---~~-- ----
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KS5902XX CMOS DIGITAL INTEGRATED CI
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~ KS5911 CMOS DIGITAL INTEGRATED CI
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---~ KS5911 CMOS DIGITAL INTEGRATED
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--------- ______ ~ ______ -_0_.__--
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~ MELODY/MISCELLANEOUS ICs 6
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KS5381 CMOS DIGITAL IC MULTI MELODY
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KS5381 CMOS DIGITAL IC BATTERY OPER
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KS5381 CMOS DIGITAL IC MELODY OPERA
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KS5381 CMOS DIGITAL IC PAD DIAGRAM
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KS5381 CMOS DIGITAL IC 2. PACKAGJ:
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------------~--------- KS5116 CMOS
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1--. ------29-30sec KS5116 CMOS DIG
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PACKAGE DIMENSIONS 8 DIP Unit: mm 1
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PACKAGE DIMENSIONS 40 DIP Unit: mm
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SALES OFFICES/MANUF ACTURER' S REPR
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SALES OFFICES/MANUFACTURER'S REPRES
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SALES OFFICES/MANUFACTURER'S REPRES
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c8 SAMSUNG Electronics Semiconducto
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