U - Index of

QUALITY and RELIABILITY
Figure 10. General Assembly Flow (Continued)
Process Flow Process Step Major Control Item
I
O.C. Monitor
"O.C. Cure Monitor Inspection
1. Control Item
- Temperature
- In/out Time
2. Frequency
- 1 Time/Shift
Au Wire
r
Wire
Bonding Wire
"O.C Au Wire Incoming Inspection
1. Visual Inspection: N = 5, C = 0
Incoming Inspection 2. Bond Pull Test Strength Test: N = 13, C = 0
3. Bondability Test
- Critical Defect: AOL 0.65%
- Major Defect: AOL 1.0%
- Minor Defect: AOL 1.5%
Bonding (W/B)
100% Visual
Inspection
O.C. Monitor
O.C. Gate
Mold Compound
"O.C. W/B Monitor Inspection
1. Frequency: 4 Times/Mach/Shift
1. O.C. Acceptance Ouality Level
- Critical Defect: AOL 0.65%
- Major Defect: AOL 1.0%
- Minor Defect: AOL 1.5%
"Moldability Test
Incoming Inspection - Critical Defect: AOL 0.15%
Mold - Major Defect: AOL 1.0%
- Minor Defect: AQL 1.5%
Mold
O.C. Monitor
"O.C. Mold Monitor Inspection
1. In-Process Monitor Insp~ction
- Frequncy: 4 Times/Station/Shift
- Sample: 200 UnitslTime
2. Acceptance Ouality Level
- Critical Defect: AOL 0.25%
- Major Defect: AOL 0.4%
c8SAMSUNG 37