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QUALITY and RELIABILITY Figure 9. General Wafer Fabrication Flow Process Flow Process Step Major Control Item II Wafer and Mask Input Starting Material Incoming Inspection Mask: (See mask Inspection) Wafer: (See wafer Inspection) Wafer Sorting and Labelling Resistivity I I Initial Oxidation Photo Inspection Oxide Thickness • (See manufacturing section) • (See FAB, QC Monitor/gate) • Critical Dimension • Visual/Mech - Major: AQL 1.0% - Minor: AQL 6.5% QC Gate • Critical Dimension Ditt'n Metal 6 Etch • (See manufacturing section) • (See FAB, QC Monitor/gate) Inspection • Critical Dimension • Visual/Mech - Major: AQL 1.0% - Minor: AQL 6.5% QC Gate • Critical Dimension • Visual/Mech y E·test Diffusion Metalization • (See in·process Quality Inspection) • Electrical Characteristics c8SAMSUNG 29
QUALITY and RELIABILITY Figure 9. General Wafer Fabrication Flow (Continued) Process Flow Process Step Major Control Item QC Gate • Electrical Characteristics Back-Lap • Thickness Back Side Evaporation • Thickness, Time Evaporation Rate Final Inspection • All Wafers Screened (Visual/Mech) QC Fab. Final Gate • Visual/Mech. - Major: AQL 1.0% - Minor: AQL 6.5% EDS (Electrical Die Sorting) QC Gate • Function Monitor Sawing --- ---- --- -- -- ---- ,-- -- ----- ---- -- --- ' -, ---- ---- -, --- - Inspection • Chip Screen Die Attach QC Final Inspection • AQL 1.0% • Fab. Defect • Test Defect • Sawing Defect c8SAMSUNG 30
Page 1 and 2: c8 SAMSUNG MOS Products Data Book 1
Page 3 and 4: QUALITY and RELIABILITY Table 1. Re
Page 5 and 6: QUALITY and RELIABILITY Table 2. Fa
Page 7 and 8: QUALITY and RELIABILITY ACCELERATED
Page 9 and 10: QUALITY and RELIABILITY Some words
Page 11 and 12: QUALITY and RELIABILITY Process Mon
Page 13 and 14: QUALITY and RELIABILITY 3.1 WAFER F
Page 15: QUALITY and RELIABILITY 3. Photo/Et
Page 19 and 20: QUALITY and RELIABILITY 6. Seal Ins
Page 21 and 22: QUALITY and RELIABILITY 3. In·Proc
Page 23 and 24: - QUALITY and RELIABILITY Figure 10
Page 25 and 26: ~. QUALITY and RELIABILITY Figure 1
Page 27 and 28: NOTES
Page 29 and 30: ----_.._---
Page 31 and 32: PRODUCT GUIDE E Calculator ICs Devi
Page 33 and 34: PRODUCT GUIDE 4 3. ORDERING INFORMA
Page 35 and 36: CMOS LCD Watch ICs Device Function
Page 37 and 38: KS5112 CMOS DIGITAL INTEGRATED CIRC
Page 67 and 68:
KS5194 CMOS DIGITAL INTEGRATED CIRC
Page 69 and 70:
Page 71 and 72:
KS5199A CMOS DIGITAL INTEGRATED CIR
Page 73 and 74:
Page 75 and 76:
Page 77 and 78:
Page 79 and 80:
Page 81 and 82:
Page 83 and 84:
Page 85 and 86:
Page 87 and 88:
~ - KS5209 CMOS DIGITAL INTEGRATED
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Page 91 and 92:
K5521 0 CMOS DIGITAL INTEGRATED CIR
Page 93 and 94:
KS521 0 CMOS DIGITAL INTEGRATED CIR
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Page 97 and 98:
Page 99 and 100:
Page 101 and 102:
Page 103 and 104:
Page 105 and 106:
Page 107 and 108:
Calculator ICs Device Function Pack
Page 109 and 110:
Page 111 and 112:
Page 113 and 114:
Page 115 and 116:
KS602,5 CMOS DIGITAL INTEGRATED CIR
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Page 119 and 120:
Page 121 and 122:
Page 123 and 124:
KS6026 APPLICATION CMOS DIGITAL INT
Page 125 and 126:
Page 127 and 128:
KS6027 AlBIC CMOS DIGITAL INTEGRATE
Page 129 and 130:
KS6027 AlBIC CMOS DIGITAL INTEGRATE
Page 131 and 132:
Page 133 and 134:
---------- - - _____ _____ n _____
Page 135 and 136:
Page 137 and 138:
Page 139 and 140:
KS6027B CMOS DIGITAL INTEGRATED CIR
Page 141 and 142:
KS60278 CMOS DIGITAL INTEGRATED CIR
Page 143 and 144:
KS6027C CMOS DIGITAL INTEGRATED CIR
Page 145 and 146:
KS6027C CMOS DIGITAL INTEGRATED CIR
Page 147 and 148:
~~ KS6027C CMOS DIGITAL INTEGRATED
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Page 187:
NOTES
Page 190 and 191:
VOICE SYNTHESIZER APPLICATION GUIDE
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Page 194 and 195:
Page 196 and 197:
Page 198 and 199:
db ~ 3: CJ) c: z c;) KS5901A APPLIC
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Page 202 and 203:
-- KS5901A CMOS DIGITAL INTEGRATED
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Page 208 and 209:
Page 210 and 211:
-------------~ KS5901A CMOS DIGITAL
Page 212 and 213:
------------------- KS5901A CMOS DI
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Page 218 and 219:
Page 220 and 221:
----~-----------~--~- ~---~~-- ----
Page 222 and 223:
KS5902XX CMOS DIGITAL INTEGRATED CI
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Page 228 and 229:
Page 230 and 231:
Page 232 and 233:
Page 234 and 235:
Page 236 and 237:
~ KS5911 CMOS DIGITAL INTEGRATED CI
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Page 240 and 241:
Page 242 and 243:
Page 244 and 245:
---~ KS5911 CMOS DIGITAL INTEGRATED
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Page 248 and 249:
--------- ______ ~ ______ -_0_.__--
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Page 254 and 255:
~ MELODY/MISCELLANEOUS ICs 6
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Page 264 and 265:
KS5381 CMOS DIGITAL IC MULTI MELODY
Page 266 and 267:
KS5381 CMOS DIGITAL IC BATTERY OPER
Page 268 and 269:
KS5381 CMOS DIGITAL IC MELODY OPERA
Page 270 and 271:
KS5381 CMOS DIGITAL IC PAD DIAGRAM
Page 272 and 273:
KS5381 CMOS DIGITAL IC 2. PACKAGJ:
Page 274 and 275:
Page 276 and 277:
------------~--------- KS5116 CMOS
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Page 280 and 281:
1--. ------29-30sec KS5116 CMOS DIG
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PACKAGE DIMENSIONS 8 DIP Unit: mm 1
Page 294 and 295:
PACKAGE DIMENSIONS 40 DIP Unit: mm
Page 298 and 299:
SALES OFFICES/MANUF ACTURER' S REPR
Page 300 and 301:
SALES OFFICES/MANUFACTURER'S REPRES
Page 302 and 303:
SALES OFFICES/MANUFACTURER'S REPRES
Page 304:
c8 SAMSUNG Electronics Semiconducto
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