Design for Reliability: PCBs - DfR Solutions
Design for Reliability: PCBs - DfR Solutions
Design for Reliability: PCBs - DfR Solutions
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Pb-Free HASL: Ni-modified SnCuoAlloy selection is critical.ooSn-Cu will result in high Cu dissolution and poor planarity.SnCuNiGe provides high fluidity and reduced Cu dissolution.oRole of constituentsoooSnCuNiGe AlloySnCu AlloyCu creates a eutectic alloy with lower melt temp (227C vs. 232C), <strong>for</strong>msintermetallics <strong>for</strong> strength, and reduces copper dissolutionNi suppresses <strong>for</strong>mation of -Sn dendrites, controls intermetallic growth, grainrefinerGe prevents oxide <strong>for</strong>mation (dross inhibitor), grain refiner© 2004 - 2007 2010
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