Design for Reliability: PCBs - DfR Solutions

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SummaryooooTo avoid design mistakes, be aware thatfunctionality is just the beginning. Designreliability in!Be aware of industry best practicesMaximize knowledge of your design as early inthe product development process as possiblePractice design for excellence (DfX)ooooDesign for manufacturabilityDesign for sourcingDesign for reliabilityDesign for environment© 2004 - 2007 2010
ConclusionsoooDesign for Reliability is a valuable process forlowering cost, reducing time-to-market, andimproving customer satisfactionPoF is a powerful tool that can leverage thevalue of DfR activitiesSuccessful DfR / PoF implementation requiresthe right combination of personnel and tools andtime limitations© 2004 - 2007 2010
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Design for Reliability: PCBsNorth T
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Course OutlineINTRODUCTIONSooIntro
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Why Design for Reliability (DfR)?o
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Physics of Failure DefinitionsoFail
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A Word on Quality, Reliability & Cl
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PCB Materials / Laminate Selectiono
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Laminate DatasheetsooOut-of-plane C
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Glass StyleoooPCB laminates (and pr
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Laminate Properties (cont.)oMore re
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Thermal Parameters and IPC Slash Sh
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PTV Degradation due to Assembly© 2
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PCB Materials: StackupoMaximum stre
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PCB ViasPlated Through Holes© 2004
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How to Design a Reliable PTV?PTH Ar
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PCB Industry PTV Capability95% of I
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IPC TR-579oRound Robin Reliability
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IPC TR-579 (cont.)oDetermine strain
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IPC TR-579 (cont.)o Iteratively cal
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The Effect of Design Parameters (He
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Effect of Design Parameters (cont.)
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Plating (Thickness and Material Pro
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Case Study: Microvia Fill and PTV R
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Plating Mechanical PropertiesoIndus
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Cycles to FailureThe Reality of PTV
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Post-Plating MeasurementsoHardness
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Other Platings (cont.)oS. Neumann,
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Test / Qualify PTVoQualifying PTV i
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Simulation and ModelingoSecond step
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Initial Qualification (PCQR2)oQuali
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Lot QualificationoInterconnect stre
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ConclusionoThe base knowledge and u
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CAF: ExamplesInfluenced by electric
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Strain Flexure Issues & Pad Crateri
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Strain & Flexure: Pad CrateringoCra
Page 69 and 70: Potential Mitigations to Pad Crater
Page 71 and 72: Pad Geometry• Pad design influenc
Page 73 and 74: Future of Contamination / Cleanline
Page 75 and 76: Failure ModeoWhy do you care about
Page 77 and 78: ECM MechanismsoooSome ECM Mechanism
Page 79 and 80: Nominal Ionic LevelsooooBare printe
Page 81 and 82: Process Material Qualification - SI
Page 83 and 84: Importance of Surface FinishooooThe
Page 85 and 86: Surface Finish Selection Approachoo
Page 87 and 88: Surface Finish Selection GuidelineA
Page 89 and 90: OSP Issues: Plated Through-Hole Fil
Page 91 and 92: Surface Finish Selection GuidelineP
Page 93 and 94: ImAg Trace EtchingSolder maskGalvan
Page 95 and 96: Typical Creep Corrosion• Corrosio
Page 97 and 98: Wetting Force ( mN/mm)Impact of Tar
Page 99 and 100: Immersion Sn (ImSn)• A single mat
Page 103 and 104: ENIG - Ni Interface Issues w/ SACBr
Page 105 and 106: Unreliability, F(t)ENIG: Mechanical
Page 109 and 110: Pb-Free HASL: Ni-modified SnCuoAllo
Page 111 and 112: Newer Finishes to the MarketProduct
Page 113 and 114: Newer Finishes to the MarketProduct
Page 115 and 116: Examples of Best Application Fitsoo
Page 117 and 118: What to do if there is no SF fit?oo
Page 119: SummaryoooooThe surface finish you
Page 123: Contact Information• Questions?
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