Design for Reliability: PCBs - DfR Solutions

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ImAg - MicrovoidsoVoid under silver causes void at interface.Microvoids survived shocktesting but cause earlyfailure in thermal cycling.Ref: Mukadam, “Planar Microvoids in LF Solder Joints”, SMTA, 2006.© 2004 - 2007 2010
Typical Creep Corrosion• Corrosion product is poorly conductive (resistance of about 1Mohm).• Conductivity is higher when the humidity is high.• Field returns often function fine – since corrosion product has dried out.• Features most sensitive to leakage current will trigger the system failure (failingsymptoms can vary system-to-system).• Visual inspection is often required to diagnose.© 2004 - 2007 2010
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Design for Reliability: PCBsNorth T
Page 3 and 4:
Course OutlineINTRODUCTIONSooIntro
Page 5 and 6:
Why Design for Reliability (DfR)?o
Page 7 and 8:
Physics of Failure DefinitionsoFail
Page 9 and 10:
A Word on Quality, Reliability & Cl
Page 11 and 12:
PCB Materials / Laminate Selectiono
Page 13 and 14:
Laminate DatasheetsooOut-of-plane C
Page 15 and 16:
Glass StyleoooPCB laminates (and pr
Page 17 and 18:
Laminate Properties (cont.)oMore re
Page 19 and 20:
Thermal Parameters and IPC Slash Sh
Page 21 and 22:
PTV Degradation due to Assembly© 2
Page 23 and 24:
PCB Materials: StackupoMaximum stre
Page 25 and 26:
PCB ViasPlated Through Holes© 2004
Page 27 and 28:
How to Design a Reliable PTV?PTH Ar
Page 29 and 30:
PCB Industry PTV Capability95% of I
Page 31 and 32:
IPC TR-579oRound Robin Reliability
Page 33 and 34:
IPC TR-579 (cont.)oDetermine strain
Page 35 and 36:
IPC TR-579 (cont.)o Iteratively cal
Page 37 and 38:
The Effect of Design Parameters (He
Page 39 and 40:
Effect of Design Parameters (cont.)
Page 41 and 42:
Plating (Thickness and Material Pro
Page 43 and 44: Case Study: Microvia Fill and PTV R
Page 45 and 46: Plating Mechanical PropertiesoIndus
Page 47 and 48: Cycles to FailureThe Reality of PTV
Page 49 and 50: Post-Plating MeasurementsoHardness
Page 51 and 52: Other Platings (cont.)oS. Neumann,
Page 53 and 54: Test / Qualify PTVoQualifying PTV i
Page 55 and 56: Simulation and ModelingoSecond step
Page 57 and 58: Initial Qualification (PCQR2)oQuali
Page 59 and 60: Lot QualificationoInterconnect stre
Page 61 and 62: ConclusionoThe base knowledge and u
Page 63 and 64: CAF: ExamplesInfluenced by electric
Page 65 and 66: Strain Flexure Issues & Pad Crateri
Page 67 and 68: Strain & Flexure: Pad CrateringoCra
Page 69 and 70: Potential Mitigations to Pad Crater
Page 71 and 72: Pad Geometry• Pad design influenc
Page 73 and 74: Future of Contamination / Cleanline
Page 75 and 76: Failure ModeoWhy do you care about
Page 77 and 78: ECM MechanismsoooSome ECM Mechanism
Page 79 and 80: Nominal Ionic LevelsooooBare printe
Page 81 and 82: Process Material Qualification - SI
Page 83 and 84: Importance of Surface FinishooooThe
Page 85 and 86: Surface Finish Selection Approachoo
Page 87 and 88: Surface Finish Selection GuidelineA
Page 89 and 90: OSP Issues: Plated Through-Hole Fil
Page 91 and 92: Surface Finish Selection GuidelineP
Page 93: ImAg Trace EtchingSolder maskGalvan
Page 97 and 98: Wetting Force ( mN/mm)Impact of Tar
Page 99 and 100: Immersion Sn (ImSn)• A single mat
Page 103 and 104: ENIG - Ni Interface Issues w/ SACBr
Page 105 and 106: Unreliability, F(t)ENIG: Mechanical
Page 109 and 110: Pb-Free HASL: Ni-modified SnCuoAllo
Page 111 and 112: Newer Finishes to the MarketProduct
Page 113 and 114: Newer Finishes to the MarketProduct
Page 115 and 116: Examples of Best Application Fitsoo
Page 117 and 118: What to do if there is no SF fit?oo
Page 119 and 120: SummaryoooooThe surface finish you
Page 121 and 122: ConclusionsoooDesign for Reliabilit
Page 123: Contact Information• Questions?
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Design for Reliability: PCBs - DfR Solutions

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