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Design for Reliability: PCBs - DfR Solutions

Design for Reliability: PCBs - DfR Solutions

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PCB Materials and Plated Through Via <strong>Reliability</strong>oHistorically, two material properties of concerno Out-of-plane coefficient of thermal expansion (CTE z )o Out-of-plane elastic modulus (‘stiffness’)(E z )oKey Assumption: No exposure to temperatures above theglass transition temperature (Tg)oThe two material properties(CTE and E) are driven bychoices in resin, glass style,and filler© 2004 - 2007 2010

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